HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE

    公开(公告)号:EP3660894A1

    公开(公告)日:2020-06-03

    申请号:EP18839408.4

    申请日:2018-06-29

    Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.

Patent Agency Ranking