Metalized plastic article and method of producing the same
    121.
    发明公开
    Metalized plastic article and method of producing the same 有权
    金属化的塑料制品及其制造方法

    公开(公告)号:EP2657366A3

    公开(公告)日:2013-11-06

    申请号:EP13177928.2

    申请日:2010-11-30

    Abstract: Metalized plastic substrate and methods of producing the same are provided herein. The method includes providing a plastic having at least one accelerator dispersed in the plastic. The accelerator/s have a formula AM x B y O z , in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, TI, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerator/s further have an alternative formula A'M' m O n , in which A' is one or more elements selected from groups 9, 10, and 11 of the periodic table; M' is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the irradiated surface, and then plating the first metal layer to form at least a second metal layer.

    HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE

    公开(公告)号:EP3660894A1

    公开(公告)日:2020-06-03

    申请号:EP18839408.4

    申请日:2018-06-29

    Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.

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