Abstract:
Metalized plastic substrate and methods of producing the same are provided herein. The method includes providing a plastic having at least one accelerator dispersed in the plastic. The accelerator/s have a formula AM x B y O z , in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, TI, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerator/s further have an alternative formula A'M' m O n , in which A' is one or more elements selected from groups 9, 10, and 11 of the periodic table; M' is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the irradiated surface, and then plating the first metal layer to form at least a second metal layer.
Abstract:
A rare earth permanent magnetic material is provided, which is represented by the general formula of R a-x-y Ho x Dy y Fe 1-a-b-c-d Co d M c B b , wherein x, y, a, b, c and d are weight percentages of corresponding elements, in which 28%≤ a ≤34%, 0.95%≤ b ≤1.3%, 0≤ c ≤1.5%, 1%≤ d ≤10%, 15%≤ x ≤20% and 3%≤ y ≤8%; wherein R is a rare earth element, which is selected from the group consisting of Nd, Pr, La, Ce, Gd, Tb and combinations thereof; and wherein M is selected from the group consisting of Al, Cu, Ti, V, Cr, Zr, Hf, Nb, Sn, Mo, Ga, Si and combinations thereof. A method for preparing the rare earth permanent magnetic material is also provided.
Abstract:
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.
Abstract:
An amorphous alloy having the general formula of: (ZrxAlyCuzNi1-x-y-z)100-a-bScaYb, wherein x, y, and z are atomic percents, and a and b are atom molar ratios, in which: about 0.45≦̸x≦̸about 0.60; about 0.08≦̸y≦̸about 0.12; about 0.25≦̸z≦̸about 0.35; 0