公开(公告)号：US20220368100A1

公开(公告)日：2022-11-17

申请号：US17712932

申请日：2022-04-04

Applicant: STMicroelectronics PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01S5/026 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0239 ,  G02F1/01 ,  H01S5/183

Abstract: An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

公开(公告)号：US11245273B2

公开(公告)日：2022-02-08

申请号：US16282097

申请日：2019-02-21

Applicant: STMicroelectronics Pte Ltd

Inventor： Prabhu Jyoti ,  Cho Seng Dominic Tay

IPC: H02J7/00 ,  H01M50/10 ,  H01M50/20 ,  H01M50/204 ,  H01M50/207 ,  H01M10/46

Abstract: A battery charging system includes a first electrical connector disposed facing a first shelf, a second electrical connector disposed facing a second shelf, a first charge device coupled to the first electrical connector, and a second charge device coupled to the second electrical connector. A mobile device includes a first electrical connector, a first shelf portion and a second shelf portion, which are facing the first electrical connector, and a third shelf portion and a fourth shelf portion, which are facing the second electrical connector. Each of the electrical connectors of the battery charging system and the mobile device includes a first conductor, a second conductor, and a third conductor, with the first conductor electrically coupled to the third conductor, and the second conductor electrically isolated from and disposed between the first and third conductors, which enable the battery charging system and mobile device to easily swap batteries.

公开(公告)号：US20210305438A1

公开(公告)日：2021-09-30

申请号：US17187510

申请日：2021-02-26

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS PTE LTD

Inventor： David GANI ,  Yiying KUO

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0392

Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.

公开(公告)号：US20210193476A1

公开(公告)日：2021-06-24

申请号：US17096434

申请日：2020-11-12

Applicant: STMicroelectronics Pte Ltd

Inventor： Yuzhan WANG ,  Pradeep BASAVANAHALLI KUMARSWAMY ,  Hong Kia KOH ,  Alberto LEOTTI ,  Patrice RAMONDA

IPC: H01L21/3105 ,  H01L21/762

Abstract: A first dielectric layer made of a first dielectric material is deposited over a semiconductor substrate. A buffer layer is then deposited on an upper surface of the first dielectric layer. A trench is opened to extend through the buffer layer and the first dielectric layer. A second dielectric layer made of a second dielectric material is the deposited in a conformal manner on the buffer layer and filling the trench. Chemical mechanical polishing of the second dielectric layer is performed to remove overlying portions of the second dielectric layer with the buffer layer being used as a polish stop. After removing the buffer layer, the first dielectric layer and the second dielectric material filling the trench form a pre-metallization dielectric layer having a substantially planar upper surface.

公开(公告)号：US11009474B2

公开(公告)日：2021-05-18

申请号：US16217631

申请日：2018-12-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Malek Brahem ,  Hatem Majeri ,  Olivier Le Neel ,  Ravi Shankar

IPC: G01N7/00 ,  G01N21/00 ,  G01N27/00 ,  G01N31/00 ,  G01N33/00 ,  G01N27/12

Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.

公开(公告)号：US10768133B2

公开(公告)日：2020-09-08

申请号：US15723661

申请日：2017-10-03

Applicant: STMicroelectronics Pte Ltd

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/12 ,  G01N27/22

Abstract: Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with a support material that provides structural integrity. The solid state gas sensor module can be integrated on top of an ASIC on a common substrate. With sufficient thermal insulation, such a gas detector can be provided as a low-power component of mobile electronic devices such as smart phones. A method of operating a multi-sensor array allows detection of relative concentrations of different gas species by either using dedicated sensors, or by thermally tuning the sensors to monitor different gas species.

公开(公告)号：US10684389B2

公开(公告)日：2020-06-16

申请号：US16107911

申请日：2018-08-21

Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

IPC: H01L31/167 ,  G01V8/12 ,  H01L25/16

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

公开(公告)号：US10128207B2

公开(公告)日：2018-11-13

申请号：US14674891

申请日：2015-03-31

Applicant: STMicroelectronics Pte Ltd

Inventor： Yun Liu ,  Jerome Teysseyre ,  Yonggang Jin

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31 ,  H01L21/78

Abstract: One or more embodiments are directed to semiconductor packages that include a pillar and bump structures. The semiconductor packages include a die that has recess at a perimeter of the semiconductor die. The semiconductor package includes an encapsulation layer that is located over the semiconductor die filling the recess and surrounding side surfaces of the pillars. The package may be formed on a wafer with a plurality of die and may be singulated into a plurality of packages.

公开(公告)号：US10115842B2

公开(公告)日：2018-10-30

申请号：US15802271

申请日：2017-11-02

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics R&D Limited

Inventor： Yonggang Jin ,  David Lawson ,  Colin Campbell ,  Anandan Ramasamy

IPC: H01L31/0216 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/101

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

公开(公告)号：US20180248068A1

公开(公告)日：2018-08-30

申请号：US15969908

申请日：2018-05-03

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/18 ,  H01L31/0232 ,  H01L25/16

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.