Abstract:
A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.
Abstract:
An apparatus (110) (and associated method) for inspecting a steering column assembly (10) including a motor (114a) driven drive sleeve (128) supported in a headstock (114) and having a longitudinal axis, and being adapted for receiving and engaging a portion of the steering column assembly, and at least one optical scanning device (160a, 160b, 160c) adapted to optically scan a feature of interest of the steering column assembly (10) while the shaft of the steering column assembly (10) is rotated for gathering data for identifying one or more deviations from one or more predetermined values for the feature of interest.
Abstract:
A system for the detection of foreign object debris material on a surface of a composite part being manufactured. A platform is configured to move over the surface. A thermal excitation source is fixed to the platform and configured to direct infrared radiation across the surface. An infrared camera is also fixed to the platform and configured to scan the surface as the platform moves over the surface to detect and output a signal proportional to infrared radiation emitted by the surface and/or by any foreign object debris material on the surface in response to the infrared radiation from the excitation source. A controller is coupled to the excitation source and to the infrared camera and is configured to compare the signal from the infrared camera with a first predetermined threshold signal to detect if any foreign object debris material is located on the surface.
Abstract:
A panel inspection apparatus is provided. The panel inspection apparatus has a support platform, a delivery platform and a panel inspection assembly. The delivery platform is disposed on the support platform, and the delivery platform has a push module for delivering the panel. The panel inspection assembly includes a plurality of light source modules and a plurality of image-taking modules corresponding to the light source modules. The light source modules include a front light source, a first horizontal light source, and a back light source. The image-taking modules include a front light image-taking module, a first horizontal light image-taking module, and a back light image-taking module. The push module delivers the panel across the support platform so that a plurality of light beams emitted from the light source modules can scan the panel to finish the panel inspection process.
Abstract:
The present invention is directed to a method and an apparatus for detecting micro-colonies growing on a membrane or an agarose medium of a sample in a closed device. According to the invention the sample is irradiated with a light incident at an angle (β) with respect to the normal to the membrane or the surface of the agarose medium from outside the device. An incident area of the light on the membrane or the surface of the agarose medium is imaged by means of a light receiving element using an imaging angle (α) different from angle (β) with respect to the normal to the membrane or the surface of the agarose medium from outside the device. The light reflected, scattered and/or diffused from the membrane or the surface of the agarose medium and/or the micro-colonies on the membrane and/or the micro-colonies on the agarose medium is detected.
Abstract:
A method of determining wear of a worn surface of a machine component includes providing a scanning device at a distance from the worn surface. The method also includes moving at least one of the scanning device and the worn surface relative to the other and generating a set of data points via the scanning device. Each data point of the set of data points is indicative of a depth of a corresponding point on the worn surface relative to a reference plane. The method further includes determining a maximum depth of the worn surface based on the set of data points and comparing the maximum depth to a reference value to determine a next step in a remanufacturing process of the machine component.
Abstract:
A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.
Abstract:
A surface scanning wafer inspection system with independently adjustable scan pitch and associated methods of operation are presented. The scan pitch may be adjusted independently from an illumination area on the surface of a wafer. In some embodiments, scan pitch is adjusted while the illumination area remains constant. For example, defect sensitivity is adjusted by adjusting the rate of translation of a wafer relative to the rate of rotation of the wafer without additional optical adjustments. In some examples, the scan pitch is adjusted to achieve a desired defect sensitivity over an entire wafer. In other examples, the scan pitch is adjusted during wafer inspection to optimize defect sensitivity and throughput. In other examples, the scan pitch is adjusted to maximize defect sensitivity within the damage limit of a wafer under inspection.
Abstract:
A first lens configured to convert light from the objective lens into parallel light includes a concave lens part having a concave curved face in a center portion of a flat face, and a convex lens part having a convex curved face around a flat face. Further, the first lens includes first and second regions configured to diverge light through the flat face and the concave curved face and a third region configured to collect light through the convex curved face and the concave curved face. When the sample is on a sample table and sealed in a two-dimensional electrophoresis substrate, light totally reflected by a side surface of the objective lens enters the second region. In contrast, when the sample is directly on the sample table, the light enters the third region.
Abstract:
The present invention relates to DNA sequencing with reagent cycling on the wiregrid. The sequencing approach suggested with which allows to use a single fluid with no washing steps. Based on strong optical confinement and of excitation light and of cleavage light, the sequencing reaction can be read-out without washing the surface. Stepwise sequencing is achieved by using nucleotides with optically cleavable blocking moietys. After read-out the built in nucleotide is deblocked by cleavage light through the same substrate. This ensures that only bound nucleotides will be unblocked.