Abstract:
An xDSL modem assembly is provided. The assembly comprises a housing, a circuit board having xDSL electronics, and a multi-layer electromagnetic shield formed to receive the circuit board. The circuit board is positioned inside the multi-layer electromagnetic shield, and the multi-layer electromagnetic shield is positioned inside the housing.
Abstract:
An electronic patching system includes a first plurality of ports connected to the terminations of a plurality of telephone and data lines from the utility central office, and a second plurality of ports wired to a plurality of telecommunications devices. Both pluralities of ports are coupled to inputs of a controlled switching matrix, which connects each of the telecommunications devices to one or more of the telephone and data lines. The switching matrix is operated by a programmable logic array that directs the matrix to establish and maintain the desired connections between the telephone equipment and the telephone and data lines, computer network lines, and the like. The switching matrix includes a high voltage switch portion to handle analog telephone instruments. An algorithm for controlling the programmable logic array is created using a personal computer, and stored in memory. The algorithm comprises a database program that provides a graphical user interface on the computer display to indicate the desired connection scheme between the telephone devices and telephone lines and computer networks. The computer is provided with software to convert the database program to instructions for setting the PLA and operating the switching matrix. The connection scheme of all telephone devices may be displayed on-screen by the personal computer at any time, and the connection scheme may be easily altered to accommodate personnel movement, changes in telecommunications devices, and office reconfigurations. A line test subroutine may be included in the controller, so that the telephone/data line and connecting line to each telephone device may be checked with a test signal every time the line is used.
Abstract:
An electronics module for coupling to a module arrangement, in particular valve island, in a line-up direction, comprises a casing which comprises a front side, a back side, an upper side, a bottom side and two opposite lateral surfaces extending along the line-up direction in relation to a state mounted on the module arrangement. In the casing an electronics is accommodated and at least a first bus connection and two second bus connections are provided, which are connected to the electronics within the casing. The at least one first bus connection is arranged either on the upper side or on the bottom side, while a second bus connection is arranged on each of the lateral surfaces, respectively. A module assembly comprises a module arrangement, in particular a valve island, and an electronics module, wherein the electronics module directly abuts on the module arrangement in the line-up direction, and is detachably connected thereto in a non-destructive manner.
Abstract:
A connection management method, a controller, and a server cabinet are provided The method comprises: sending a command to the switch to instruct the switch to send a signal to a designated port of the switch; receiving from a compute node connected to the designated port of the switch, a response to the signal received by the compute node from the designated port of the switch; and based on pre-acquired location information of the compute node, associating the pre-acquired location information of the compute node with the designated port of the switch.
Abstract:
In one embodiment, a method for increasing potential data capacity for a high-density transceiver connector includes: aligning at least two transceiver-switch copper contacts opposite at least one network switch copper contact associated with a network switch, aligning at least two transceiver-cable copper contacts opposite at least one cable copper contact, and connecting the at least two transceiver-switch copper contacts to the at least two transceiver-cable copper contacts, wherein the high-density transceiver connector shares a form factor with a low-density transceiver connector.
Abstract:
A powered communications patch panel is adapted to power network devices connected to the communications patch panel. Power is supplied to the network devices by the powered communications patch panel over the communication cabling. The powered communications patch panel may be provided with a management port to allow remote management of the patch panel via a network connection. Multiple management ports may be provided, allowing patch panels to be connected to one another in a daisy-chain configuration.
Abstract:
A patch panel comprises one or more support members supporting a plurality of cable terminations that are each operatively connectable to a respective data cable for the transmission of data. Each cable termination is operatively connected to a respective first socket that is open on a side of the patch panel such that a plug inserted into the first socket is connectable to a said data cable via a data transmission path forming part of the patch panel. The patch panel additionally includes in at least one of the data transmission paths a further connector that permits the connection in the first data transmission path of one or more additional components, such as a module providing status information or power over Ethernet capabilities.
Abstract:
A powered communications patch panel is adapted to power network devices connected to the communications patch panel. Power is supplied to the network devices by the powered communications patch panel over the communication cabling. The powered communications patch panel may be provided with a management port to allow remote management of the patch panel via a network connection. Multiple management ports may be provided, allowing patch panels to be connected to one another in a daisy-chain configuration.
Abstract:
The distribution connecting module for telecommunications and data systems technology, comprises a housing inside of which input and output contacts for connecting lines and wires are placed, said contacts being accessible from the exterior. The housing is provided with a cavity inside of which at least one printed circuit board is placed. The input and output contacts are situated on the opposing faces of the housing. The input contacts are provided in the form of at least one connector strip with insulation displacement contacts. The input and output contacts can be detachably connected to the printed circuit board. The connector strip supporting the input contacts is detachably connected to the housing via a front part. The insulation displacement contacts are connected to the printed circuit board via fork contacts. The connection between the front part and the housing is such that when the connection is released, the connector strip, which is connected to the front part, is, together with the fork contacts, moved away from the printed circuit board.
Abstract:
A powered communications patch panel is adapted to power network devices connected to the communications patch panel. Power is supplied to the network devices by the powered communications patch panel over the communication cabling. The powered communications patch panel may be provided with a management port to allow remote management of the patch panel via a network connection. Multiple management ports may be provided, allowing patch panels to be connected to one another in a daisy-chain configuration.