Abstract:
A thermal accelerometer device that provides a compensation for sensitivity variations over temperature. The thermal accelerometer includes signal conditioning circuitry operative to receive analog signals representing a differential temperature is indicative of a sensed acceleration. The signal conditioning circuitry includes serially connected A-to-D and D-to-A converters, which implement a temperature dependent function and process the received signals to provide a compensation for sensitivity variations over a range of ambient temperature. To provide a ratiometric compensation for variations in power supply voltage, a buffered voltage proportional to the supply voltage is provided as a reference voltage to the D-to-A converter. The thermal accelerometer includes a self-test circuit for verifying the integrity of a heater, temperature sensors, and circuitry included within the device.
Abstract:
A method and a system for adding a group member, includes: sending a client corresponding to a user to be possibly added to a group a notification message to confirm whether the user agrees to be added to the group; obtaining a confirmation result from the client, and adding to the group the user who agrees to be added to the group. By utilizing the method and the system, unwanted disturbance caused by group management in a group communication system is lessened, meanwhile security of a group communication system is improved, and illegal spread of media which is harmful to individuals and society caused by flaws of a group system may be prevented.
Abstract:
Systems and methods for slow tail compensation are provided. A photodetector signal is pre-amplified to thereby produce an uncompensated photodetector signal that includes a fast component and a slow component. The fast component is removed from the uncompensated photodetector signal to thereby produce a compensating signal that includes the slow component of the uncompensated photodetector signal. The compensating signal is subtracted from the uncompensated photodetector signal to thereby produce a compensated photodetector signal that includes the fast component but not the slow component.
Abstract:
Single chip 3-axis thermal accelerometer devices include a substrate, at least one cavity etched in the substrate, a fluid disposed in the cavity, a bridge structure suspended over an opening of the cavity, and a plurality of heater elements and temperature sensing elements disposed on the bridge structure. The substrate has a substantially planar surface defined by X and Y coordinate axes, and the bridge structure is suspended over the opening of the cavity in the X-Y plane. In one embodiment, the bridge structure is configured to position at least two of the temperature sensing elements out of the X-Y plane. The heater and temperature sensing elements are disposed on the bridge structure in optimized arrangements for providing reduced temperature coefficients and for producing output voltages having reduced DC offset and drift.
Abstract:
Current-mode preamplifiers are provided. In accordance with an embodiment, a current-mode preamplifier includes a transistor, that acts as an input stage for the preamplifier, and a pair of current mirrors. The transistor includes a gate connected to the input of the preamplifier, a source connected to a first voltage supply rail, and a drain. The first current mirror, which is connected to a second voltage supply rail, includes an input connected to the drain of the first transistor, and an output. The second current mirror, which is connected to the first voltage supply rail, includes an input connected to the output of the first current mirror, a first output connected to the input of the preamplifier, and a second output connected to the output of the preamplifier.
Abstract:
A method of etching a trench in a substrate using a dry plasma etch technique that allows precise control of lateral undercut. The method includes optionally forming at least one on-chip device or micro-machined structure in a surface of a silicon substrate, and covering the surface with a masking layer. A trench pattern is then imaged in or transferred to the masking layer for subsequent etching of the substrate. Upper portions of the trench are anisotropically etched in the substrate. The trench is then semi-anisotropically etched and isotropically etched in the substrate. By modifying isotropic etching time, a controlled lateral undercut can be achieved as the trench is etched vertically in the substrate.
Abstract:
A micromachined magnetometer is built from a rotatable micromachined structure on which is deposited a ferromagnetic material magnetized along an axis parallel to the substrate. A structure rotatable about the Z-axis can be used to detect external magnetic fields along the X-axis or the Y-axis, depending on the orientation of the magnetic moment of the ferromagnetic material. A structure rotatable about the X-axis or the Y-axis can be used to detect external magnetic fields along the Z-axis. By combining two or three of these structures, a dual-axis or three-axis magnetometer is obtained.
Abstract:
A micromachined device is packaged to reduce stiction. In one embodiment, a level of moisture is introduced in the package to create a very thin film over surfaces of the device. The device can also be packaged with a vapor deposition of an organic material after a wafer of devices has been separated into individual dies and the individual dies are placed in open containers. In another embodiment, a micromachined device is positioned in an open package and a liquid or solid organic material is disposed within the package so that when the device is sealed, the organic material vaporizes and coats portions of the die to reduce stiction.
Abstract:
A method for forming sub-micron sized bumps on the bottom surface of a suspended microstructure or the top surface of the underlying layer in order to reduce contact area and sticking between the two layers without the need for sub-micron standard photolithography capabilities and the thus-formed microstructure. The process involves the deposition of latex spheres on the sacrificial layer which will later temporarily support the microstructure, shrinking the spheres, depositing aluminum over the spheres, dissolving the spheres to leave openings in the metal layer, etching the sacrificial layer through the openings, removing the remaining metal and depositing the microstructure material over the now textured top surface of the sacrificial layer.
Abstract:
A method and apparatus for providing a conductive plane beneath a suspended microstructure. A conductive region is diffused into a substrate. A dielectric layer is added, covering the substrate, and then removed from a portion of the conductive region. A spacer layer is deposited over the dielectric and exposed conductive region. A polysilicon layer is deposited over the spacer layer, and formed into the shape of the suspended microstructure. After removal of the spacer layer, the suspended microstructure is left free to move above an exposed conductive plane. The conductive plane is driven to the same potential as the microstructure.