Method and circuitry for thermal accelerometer signal conditioning
    131.
    发明授权
    Method and circuitry for thermal accelerometer signal conditioning 有权
    用于热加速度计信号调理的方法和电路

    公开(公告)号:US07305881B2

    公开(公告)日:2007-12-11

    申请号:US11146993

    申请日:2005-06-07

    CPC classification number: G01P15/008

    Abstract: A thermal accelerometer device that provides a compensation for sensitivity variations over temperature. The thermal accelerometer includes signal conditioning circuitry operative to receive analog signals representing a differential temperature is indicative of a sensed acceleration. The signal conditioning circuitry includes serially connected A-to-D and D-to-A converters, which implement a temperature dependent function and process the received signals to provide a compensation for sensitivity variations over a range of ambient temperature. To provide a ratiometric compensation for variations in power supply voltage, a buffered voltage proportional to the supply voltage is provided as a reference voltage to the D-to-A converter. The thermal accelerometer includes a self-test circuit for verifying the integrity of a heater, temperature sensors, and circuitry included within the device.

    Abstract translation: 一种热敏加速度计装置,可提供对温度敏感度变化的补偿。 热加速度计包括信号调节电路,其操作以接收表示差分温度的模拟信号,其指示感测到的加速度。 信号调理电路包括串行连接的A到D和D到A转换器,其实现温度依赖功能并处理接收到的信号以提供在环境温度范围内的灵敏度变化的补偿。 为了提供电源电压变化的比例补偿,将与电源电压成比例的缓冲电压作为参考电压提供给D转换器。 热加速度计包括用于验证加热器,温度传感器和包括在装置内的电路的完整性的自检电路。

    Method and system for adding group member
    132.
    发明申请
    Method and system for adding group member 审中-公开
    组成员的方法和系统

    公开(公告)号:US20070162588A1

    公开(公告)日:2007-07-12

    申请号:US11699867

    申请日:2007-01-30

    Abstract: A method and a system for adding a group member, includes: sending a client corresponding to a user to be possibly added to a group a notification message to confirm whether the user agrees to be added to the group; obtaining a confirmation result from the client, and adding to the group the user who agrees to be added to the group. By utilizing the method and the system, unwanted disturbance caused by group management in a group communication system is lessened, meanwhile security of a group communication system is improved, and illegal spread of media which is harmful to individuals and society caused by flaws of a group system may be prevented.

    Abstract translation: 一种用于添加组成员的方法和系统,包括:将与用户相对应的客户端发送给组可以添加通知消息,以确认用户是否被添加到组中; 从客户端获取确认结果,并向组中添加同意添加到组中的用户。 通过利用该方法和系统,集团通信系统中群组管理引起的不必要的干扰减轻,同时群组通信系统的安全性得到提高,而且由于群体的缺陷对个人和社会造成的危害的媒体的非法传播 系统可以被防止。

    SLOW TAIL COMPENSATION
    133.
    发明申请
    SLOW TAIL COMPENSATION 有权
    慢尾补偿

    公开(公告)号:US20070108373A1

    公开(公告)日:2007-05-17

    申请号:US11621506

    申请日:2007-01-09

    Applicant: Yang Zhao

    Inventor: Yang Zhao

    CPC classification number: H01L27/14609 H03F3/08

    Abstract: Systems and methods for slow tail compensation are provided. A photodetector signal is pre-amplified to thereby produce an uncompensated photodetector signal that includes a fast component and a slow component. The fast component is removed from the uncompensated photodetector signal to thereby produce a compensating signal that includes the slow component of the uncompensated photodetector signal. The compensating signal is subtracted from the uncompensated photodetector signal to thereby produce a compensated photodetector signal that includes the fast component but not the slow component.

    Abstract translation: 提供了用于慢尾补偿的系统和方法。 光电检测器信号被预放大,从而产生包括快速分量和慢分量的未补偿光电检测器信号。 从未补偿的光检测器信号中去除快速分量,从而产生包括未补偿光电检测器信号的慢分量的补偿信号。 从未补偿的光电检测器信号中减去补偿信号,从而产生包括快速分量而不是慢分量的补偿光电检测器信号。

    Single chip tri-axis accelerometer
    134.
    发明申请
    Single chip tri-axis accelerometer 有权
    单片三轴加速度计

    公开(公告)号:US20070101813A1

    公开(公告)日:2007-05-10

    申请号:US11271035

    申请日:2005-11-10

    CPC classification number: G01P15/18 G01P15/006

    Abstract: Single chip 3-axis thermal accelerometer devices include a substrate, at least one cavity etched in the substrate, a fluid disposed in the cavity, a bridge structure suspended over an opening of the cavity, and a plurality of heater elements and temperature sensing elements disposed on the bridge structure. The substrate has a substantially planar surface defined by X and Y coordinate axes, and the bridge structure is suspended over the opening of the cavity in the X-Y plane. In one embodiment, the bridge structure is configured to position at least two of the temperature sensing elements out of the X-Y plane. The heater and temperature sensing elements are disposed on the bridge structure in optimized arrangements for providing reduced temperature coefficients and for producing output voltages having reduced DC offset and drift.

    Abstract translation: 单芯片3轴热加速度计装置包括衬底,在衬底中蚀刻的至少一个腔,设置在空腔中的流体,悬挂在空腔的开口上的桥结构,以及多个加热器元件和温度感测元件, 在桥梁结构上。 衬底具有由X和Y坐标轴限定的基本平坦的表面,并且桥结构悬挂在X-Y平面中的空腔的开口上。 在一个实施例中,桥结构被配置为将至少两个温度感测元件定位在X-Y平面之外。 加热器和温度感测元件以优化的布置设置在桥结构上,以提供降低的温度系数并且用于产生具有降低的DC偏移和漂移的输出电压。

    CURRENT-MODE PREAMPLIFIERS
    135.
    发明申请
    CURRENT-MODE PREAMPLIFIERS 有权
    电流模式预处理器

    公开(公告)号:US20050258905A1

    公开(公告)日:2005-11-24

    申请号:US10850504

    申请日:2004-05-20

    Applicant: Yang Zhao

    Inventor: Yang Zhao

    CPC classification number: H03F3/082

    Abstract: Current-mode preamplifiers are provided. In accordance with an embodiment, a current-mode preamplifier includes a transistor, that acts as an input stage for the preamplifier, and a pair of current mirrors. The transistor includes a gate connected to the input of the preamplifier, a source connected to a first voltage supply rail, and a drain. The first current mirror, which is connected to a second voltage supply rail, includes an input connected to the drain of the first transistor, and an output. The second current mirror, which is connected to the first voltage supply rail, includes an input connected to the output of the first current mirror, a first output connected to the input of the preamplifier, and a second output connected to the output of the preamplifier.

    Abstract translation: 提供电流模式前置放大器。 根据实施例,电流模式前置放大器包括用作前置放大器的输入级的晶体管和一对电流镜。 晶体管包括连接到前置放大器的输入端的栅极,连接到第一电压供应轨道的源极和漏极。 连接到第二电压源的第一电流镜包括连接到第一晶体管的漏极的输入端和输出端。 连接到第一电压源的第二电流镜包括连接到第一电流镜的输出的输入端,连接到前置放大器的输入端的第一输出端和连接到前置放大器的输出端的第二输出端 。

    Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same
    136.
    发明授权
    Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same 有权
    蚀刻衬底中的深沟槽的方法和使用其制造片上器件和微加工结构的方法

    公开(公告)号:US06712983B2

    公开(公告)日:2004-03-30

    申请号:US09833973

    申请日:2001-04-12

    CPC classification number: B81C1/00571 H01L21/3065

    Abstract: A method of etching a trench in a substrate using a dry plasma etch technique that allows precise control of lateral undercut. The method includes optionally forming at least one on-chip device or micro-machined structure in a surface of a silicon substrate, and covering the surface with a masking layer. A trench pattern is then imaged in or transferred to the masking layer for subsequent etching of the substrate. Upper portions of the trench are anisotropically etched in the substrate. The trench is then semi-anisotropically etched and isotropically etched in the substrate. By modifying isotropic etching time, a controlled lateral undercut can be achieved as the trench is etched vertically in the substrate.

    Abstract translation: 使用允许精确控制横向底切的干等离子体蚀刻技术来蚀刻衬底中的沟槽的方法。 该方法包括任选地在硅衬底的表面中形成至少一个片上器件或微加工结构,并用掩模层覆盖该表面。 然后将沟槽图案成像在掩模层中或转移到掩模层,以便随后蚀刻衬底。 在衬底中各向异性地蚀刻沟槽的上部。 然后在衬底中对该沟槽进行半各向异性蚀刻和各向同性蚀刻。 通过改变各向同性蚀刻时间,可以在衬底中垂直蚀刻沟槽来实现受控的横向底切。

    Micromachined device packaged to reduce stiction
    138.
    发明授权
    Micromachined device packaged to reduce stiction 失效
    微加工设备包装以减少粘性

    公开(公告)号:US5694740A

    公开(公告)日:1997-12-09

    申请号:US616718

    申请日:1996-03-15

    Abstract: A micromachined device is packaged to reduce stiction. In one embodiment, a level of moisture is introduced in the package to create a very thin film over surfaces of the device. The device can also be packaged with a vapor deposition of an organic material after a wafer of devices has been separated into individual dies and the individual dies are placed in open containers. In another embodiment, a micromachined device is positioned in an open package and a liquid or solid organic material is disposed within the package so that when the device is sealed, the organic material vaporizes and coats portions of the die to reduce stiction.

    Abstract translation: 包装微机械装置以减少静摩擦。 在一个实施例中,在包装中引入水分水平以在装置的表面上产生非常薄的薄膜。 在将晶片的晶片分离成单独的模具并且将各个模具放置在开放的容器中之后,该装置也可以与有机材料的气相沉积一起包装。 在另一个实施例中,微加工装置定位在开放的包装中,并且液体或固体有机材料设置在包装内,使得当装置被密封时,有机材料蒸发并涂覆模具的部分以减少粘性。

    Micromechanical structure with textured surface and method for making
same
    139.
    发明授权
    Micromechanical structure with textured surface and method for making same 失效
    具有纹理表面的微机械结构及其制造方法

    公开(公告)号:US5679436A

    公开(公告)日:1997-10-21

    申请号:US447100

    申请日:1995-05-22

    Applicant: Yang Zhao

    Inventor: Yang Zhao

    Abstract: A method for forming sub-micron sized bumps on the bottom surface of a suspended microstructure or the top surface of the underlying layer in order to reduce contact area and sticking between the two layers without the need for sub-micron standard photolithography capabilities and the thus-formed microstructure. The process involves the deposition of latex spheres on the sacrificial layer which will later temporarily support the microstructure, shrinking the spheres, depositing aluminum over the spheres, dissolving the spheres to leave openings in the metal layer, etching the sacrificial layer through the openings, removing the remaining metal and depositing the microstructure material over the now textured top surface of the sacrificial layer.

    Abstract translation: 一种用于在悬浮的微结构的底表面或下层的顶表面上形成亚微米级的凸起的方法,以便减少接触面积和两层之间的粘附,而不需要亚微米标准的光刻能力,因此 形成微观结构。 该方法包括将胶乳球体沉积在牺牲层上,其将稍后暂时支撑微结构,收缩球体,在球体上沉积铝,溶解球体以在金属层中留下开口,通过开口蚀刻牺牲层,去除 剩余的金属并将微结构材料沉积在牺牲层的现在变形的顶部表面上。

    Conductive plane beneath suspended microstructure
    140.
    发明授权
    Conductive plane beneath suspended microstructure 失效
    悬浮微结构下面的导电平面

    公开(公告)号:US5640039A

    公开(公告)日:1997-06-17

    申请号:US347702

    申请日:1994-12-01

    CPC classification number: G01P15/125 G01P15/0802 G01P2015/0814

    Abstract: A method and apparatus for providing a conductive plane beneath a suspended microstructure. A conductive region is diffused into a substrate. A dielectric layer is added, covering the substrate, and then removed from a portion of the conductive region. A spacer layer is deposited over the dielectric and exposed conductive region. A polysilicon layer is deposited over the spacer layer, and formed into the shape of the suspended microstructure. After removal of the spacer layer, the suspended microstructure is left free to move above an exposed conductive plane. The conductive plane is driven to the same potential as the microstructure.

    Abstract translation: 一种用于在悬浮微结构下方提供导电平面的方法和装置。 导电区域扩散到衬底中。 添加介电层,覆盖基板,然后从导电区域的一部分去除。 间隔层沉积在电介质和暴露的导电区域上。 多晶硅层沉积在间隔层上,并形成悬浮微结构的形状。 在去除间隔层之后,使悬浮的微结构自由地在暴露的导电平面上移动。 导电平面被驱动到与微结构相同的电位。

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