Abstract:
An optical apparatus for the inspection of nucleic acid probes includes: a holder (22) for housing a chip (1) for analysis of nucleic acids, containing nucleic acid probes (12, 12' ); a light (24), for supplying an excitation radiation (WE) to the holder (22); and an optical sensor (25) for detecting images (IMG) of the nucleic acid probes (12, 12'), when a chip (1) is housed in the holder (22). The light source (24) is configured for polarizing the excitation radiation (WE) according to a excitation polarization direction (DE). Furthermore, the apparatus is provided with a sensing polarizing filter (27), which is arranged so as to intercept a reflected portion (WR) of the excitation radiation (WE), directed towards the optical sensor (25). The sensing polarizing filter (27) has a direction of the sensing polarization (D3) transverse to the excitation polarization direction (DE).
Abstract:
Method for manufacturing a vertical power MOS transistor on a semiconductor substrate (10) with wide band gap comprising a first superficial semiconductor layer (11) with wide band gap of a first type of conductivity, comprising the steps of: forming trench regions (13) in the first superficial semiconductor layer (H), filling in said trench regions (13) by means of a second semiconductor layer (14) with wide band gap of a second type of conductivity, so as to form semiconductor portions (15) of the second type of conductivity contained in the first superficial semiconductor layer (11), carrying out at least one ion implantation of a first type of dopant in the semiconductor portions (15) for forming respective implanted body regions (19) of said second type of conductivity, carrying out at least one ion implantation of a second type of dopant in each of the implanted body regions (19) for forming at least one implanted source region (23) of the first type of conductivity inside the implanted body regions (19), carrying out an activation thermal process of the first and second type of dopant with low thermal budget suitable to complete said formation of the implanted body and source regions (19, 23).
Abstract:
Process for manufacturing a power electronic device (30) comprising the following steps: forming a first semiconductor layer (21) of the first type of conductivity forming at least a second semiconductor layer (22) of a second type of conductivity value on the first semiconductor layer (21), forming, in this at least a second semiconductor layer (22), a first plurality of implanted regions (D1) of the first type of conductivity forming, above said at least a second semiconductor layer (22), a superficial semiconductor layer (26) of the first type of conductivity, forming in the surface semiconductor layer (26) body regions (40) of the second type of conductivity, the body regions (40) being aligned with portions of semiconductor layer (22) free from the plurality of said at least second implanted regions (D1), carrying out a thermal diffusion step so that the plurality of implanted regions (D1) form a plurality of electrically continuous implanted column regions (D).
Abstract:
A microfluidic device for nucleic acid analysis includes a monolithic semiconductor body (13), a microfluidic circuit (10), at least partially accommodated in the monolithic semiconductor body (13), and a micropump (11). The microfluidic circuit (10) includes a sample preparation channel (18) formed on the monolithic semiconductor body (13) and at least one microfluidic channel (20, 22) buried in the monolithic semiconductor body (13). The micropump (11), includes a plurality of sealed chambers (40) provided with respective openable sealing elements (41) and having a first pressure therein that is different from a second pressure in the microfluidic circuit (10). In addition, the micropump (11) and the microfluidic circuit (10) are configured so that opening the openable sealing elements (41) provides fluidic coupling between the respective chambers (40) and the microfluidic circuit (10). The openable sealing elements (41) are integrated in the monolithic semiconductor body (13).
Abstract:
A method for facilitating the determination of the end point of a dry plasma etching process of a material, is proposed. The method includes performing an analysis of the whole spectrum of a radiation generated during the plasma etching process of the material, the analysis comprising evaluating the time trend of a plurality of spectral components of the radiation, each spectral component indicating the time trend of the radiation intensity of a corresponding wavelengths interval of the radiation. The method further includes, on the basis of such analysis, selecting at least one of the spectral components, wherein the at least one spectral component has a time trend indicative of the evolution of the etching process of the material. The performing of the spectral analysis comprises performing a statistical analysis of the time trend of the whole spectrum of the radiation and, on the basis of the results of the statistical analysis, selecting the at least one spectral component.
Abstract:
The present invention relates to a method for realising a nanometric circuit architecture (2) in a semiconductor device comprising the steps of: a) realising a plurality of active areas (1) on a substrate (A) of the semiconductor device; b) realising on the substrate (A) a seed layer (4) of a first material; c) realising a mask-spacer (5) of a second material on the seed layer (4) in a region (A’) of the substrate (A) comprised between said active areas (1), said mask-spacer (5) being realised by MSPT and having at least one end portion (5) extending over the region (A’); d) realising at least one mask (6) overlapping the mask-spacer (5) and extending in a substantially perpendicular direction thereto (5); e) selectively removing the seed layer (4) being exposed on the substrate (A); f) selectively removing the mask (6) and the mask-spacer (5) obtaining a seed-spacer (7; 70) comprising a linear portion (7a) extending in that region (A’) and connected to at least one portion (7b) being substantially orthogonal thereto; g) eventually realising at least one insulating spacer (8) from said seed-spacer (7; 70) through the MSPT, that at least one insulating spacer (8) reproducing at least part of the profile of said seed-spacer (7; 70); h) realising at least one nano-wire (3; 13; 23) of conductive material from the seed-spacer (7, 70) or from the at least one insulating spacer (8) through the MSPT, the at least one nano-wire (3; 13; 23; 33) comprising a first portion (3a; 13a) at least partially extending in said region (A’) and at least one second portion (3b; 13b) in contact with a respective active area (1), the second portion (3b; 13b) being substantially orthogonal to the first portion (3a; 13a).
Abstract:
The present invention refers to a multi-station rotary machine for polishing wafers, comprising a machine body (1) and a rotating tower (2) consisting of a plurality of heads (3) each of which supports a wafer (4). Said tower (2) made to rotate with predefined pitch between a first station (25) for loading/unloading the wafers (4) and subsequent work stations all the same in which said heads (3) position themselves on rotatable polishing plates (5) on which rotating cleaning arms (6) act in the work phase with rotation pin and rotating end (7) in contact with the above mentioned plates (5). Between said work stations intermediate washing zones of the heads (3) and the wafers (4) are provided for by means of cleaning means (8, 17) that comprise delivery blocks (8) of washing liquid positioned between said plates (5) and each one having an upper hole (9) for the delivery of a nozzle (11) spraying liquid under pressure for cleaning one of said heads (3) and the lower part of the tower (2), and a supplementary hole connected to a further nozzle (13) for cleaning the machine body (1) and the rotation pin of one of said cleaning arms (6). Said cleaning means also comprise arms (17) for delivering the washing liquid positioned above said plates (5) with external support and each one having a supplementary lower hole (20) connected to a tube (21) that carries the liquid towards a further nozzle (22) for cleaning the lower part of said rotating arms (6) when they are in the rest position.
Abstract:
A system for rendering a primitive of an image to be displayed, for instance in a mobile 3D graphic pipeline, the primitive including a set of pixels. The system is configured for: - locating the pixels that fall within the area of the primitive, - generating, for each pixel located in the area, a set of associated sub-pixels, - borrowing a borrowed set of sub-pixels from neighboring pixels, - subjecting the set of associated sub-pixels and the borrowed set of pixels (A, B, C, D) to adaptive filtering to create an' adaptively filtered set of subpixels (AA, BB, CC, DD), and - subjecting at least the adaptively filtered set of sub-pixels (AA, BB, CC, DD) to further filtering to compute a final pixel adapted for display. Preferably, the set of associated sub-pixels fulfils at least one of the following requirements: the set includes two associated sub-pixels and - the set includes associated sub-pixels placed on triangle edges.
Abstract:
The present invention relates to switching. power supplies, and especially to a method and the related circuit for protection against malfunctioning of the feedback loop in switching power supplies. More particularly it relates to a circuit for the identification of a condition of excessively high voltage at the output. In one embodiment the circuit for the protection against malfunctioning of the feedback loop of a switching power supply comprises: means for generating (vaux R1, R2) a voltage proportional to the output voltage of said switching power supply; a comparator (15) for comparing said voltage proportional to the output voltage with a reference voltage (vth); a counter (17) coupled to said comparator capable of supplying an output signal when said voltage proportional to the output voltage exceeds said reference voltage a preset number of times; said output signal is indicative of a malfunctioning of the feedback loop.
Abstract:
An ordered dither method is applied to reduce the chromatic resolution of an image represented by channels R (red), G (green), B (blue) and A (brightness), whereby a first and a second dither matrix is provided, both comprising the same threshold values but arranged in a different spatial distribution. The first dither matrix is applied to the R, B, and A channels, and the second dither matrix is applied to the G channel.