Abstract:
A method of bonding a laminated porous sheath to a cast strut includes the step of performing a compressible pad to have a plurality of closely spaced grooves on one surface thereon and a plurality of spaced apart lands on the opposite face thereof; locating a preformed porous laminate sheath over the outer surface of a cast strut and laser welding it thereto and thereafter assembling the preformed compressible pad to locate the plurality of grooves thereon in overlying relationship to a plurality of airflow openings in the porous laminated sheath and with ribs on either side of the grooves being located in juxtaposed relationship with the outer surface of the porous laminated sheath for uniformly distributing a load thereto; locating the preassembled casting, sheath and compressible pad within a contoured opening formed by a three piece pressure block fixture and applying a predetermined pressure to the assembled parts while subjecting them to a predetermined bond temperature while applying a vacuum.
Abstract in simplified Chinese:本发明系提供一种轮机动叶之修补方法,其可抑制熔接所引起之开裂之产生。因此,作为修补轮机动叶前端部之叶片的损伤之轮机动叶之修补方法,其系对叶片之损伤处堆焊(步骤S2),对叶片与堆焊之边界区域实施锤击处理(步骤S4)后,进行熔体化处理(步骤S6)而修补轮机动叶之叶片之损伤。
Abstract in simplified Chinese:一种近实体成形无裂缝金属制物品之无模制法,包括于可排除裂缝之特定条件下将一填充材料熔入一金属脉基或种子中。在本发明之一实施例中,一激光光束以较低的功率密度及较大的光束直径于脉基表面上操作一段较长之时间,以制得具低纵深比之熔融池。
可借由将该方法应用于一回授系统、多轴控制金属沉积系统中而达成。
Abstract in simplified Chinese:本文描述用于改良晶圆涂布之烘焙方法及工具。在一个实施例中,切割包括集成电路之半导体晶圆之方法涉及涂布半导体晶圆之表面以形成覆盖集成电路之遮罩。该方法涉及利用来自一或更多个光源之辐射烘焙遮罩。该方法涉及利用激光划割制程图案化遮罩,以向图案化遮罩提供间隙,从而曝露基板的介于集成电路之间的区域。该方法亦可涉及诸如利用等离子蚀刻操作来单体化集成电路。
Abstract in simplified Chinese:本发明系提供一种轮机动叶之修补方法,其可抑制熔接所引起之开裂之产生。因此,作为修补轮机动叶前端部之叶片的损伤之轮机动叶之修补方法,其系对叶片之损伤处堆焊(步骤S2),对叶片与堆焊之边界区域实施锤击处理(步骤S4)后,进行熔体化处理(步骤S6)而修补轮机动叶之叶片之损伤。
Abstract in simplified Chinese:一种燃气涡轮机包括成交替列设置的旋转翼剖面或叶片、及静态翼剖面或轮叶。该等轮叶系由一基底为金属诸如钴或镍之超合金制成。如果一裂缝形成于其中一轮叶中,一焊接合金被施加至该裂缝。该焊接合金系一粉状泥浆。该焊接合金包括一基底材料为约50至100%及一焊接材料为约0至50%。该焊接合金之基底材料的组成系与该轮叶之基底金属的组成相同。该翼剖面接着曝露于微波中,以熔化该焊接合金而不熔化该基底金属,以修复该轮叶中的裂缝。