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141.发明公开
公开(公告)号：EP3778192A1
公开(公告)日：2021-02-17
申请号：EP18912245.0
申请日：2018-03-30
Inventor： MIYANO Hideaki , OOBA Yoshikazu , SUZUKI Koukichi , SUWA Mitsunori
IPC: B29C64/209 , B29C64/343 , B33Y30/00
Abstract: A material supply amount is controlled accurately. A material supply apparatus includes a hopper that stores a material used for shaping a three-dimensional laminating and shaping object, a columnar recoater having a rotational shaft, and a driver that rotates the columnar recoater while moving the columnar recoater in a horizontal direction perpendicular to the rotational shaft. The recoater has a plurality of grooves in a direction along the rotational shaft that are formed on an outer circumferential surface, and temporarily store the material supplied from the hopper.
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公开(公告)号：EP3248717B1
公开(公告)日：2020-09-02
申请号：EP16825690.7
申请日：2016-03-25
Inventor： KITAMURA Shinichi , MANABE Hironobu
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公开(公告)号：EP3269536B1
公开(公告)日：2020-07-29
申请号：EP16823147.0
申请日：2016-05-31
Inventor： AMAYA Koichi , MIDORIKAWA Tetsushi , KAWAJI Masaaki
IPC: B29C64/264 , B29C64/277 , B33Y30/00 , B33Y50/02 , B22F3/105 , B29C64/153
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144.发明授权
公开(公告)号：EP3366390B1
公开(公告)日：2020-07-08
申请号：EP16885441.2
申请日：2016-12-26
Inventor： HASHIZUME Yoshiki , MURAKAMI Isao , MURAMATSU Kenji , ISHIGAMI Kenta
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公开(公告)号：EP3656486A1
公开(公告)日：2020-05-27
申请号：EP17917935.3
申请日：2017-07-18
Applicant: Fukuda Metal Foil & Powder Co., Ltd. , Technology Research Association for Future Additive Manufacturing
Inventor： SUGITANI Yuji , NISHIZAWA Yoshito , MARUYAMA Takeshi , OKUBO Hiroaki
Abstract: This invention provides a copper powder to which tin (Sn) is added such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. That is, this invention provides a copper powder for lamination shaping in which a tin element is added to pure copper. Desirably, the copper powder contains 0.5 wt% or more of the tin element. More desirably, the copper powder contains 5.0 wt% or more of the tin element. When the product has an electrical conductivity sufficient as a copper product, the copper powder desirably contains 6.0 wt% or less of the tin element. Furthermore, no element other than the tin element is desirably added to the copper powder.
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Patent Agency Ranking
公开(公告)号：EP3189924B1
公开(公告)日：2020-01-15
申请号：EP15898473.2
申请日：2015-11-11
Inventor： OHNO Hiroshi , TSUNO Satoshi , SASAKI Yuji
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公开(公告)号：EP3560631A1
公开(公告)日：2019-10-30
申请号：EP16885442.0
申请日：2016-12-26
Inventor： NISHIDA Motonori , SUGITANI Yuji , CHIBA Akihiko , DAINO Youhei
Abstract: The present invention relates to a metal powder which shortens a lamination-shaping time and facilitates the removal of an unnecessary powder after lamination-shaping by decreasing a pre-sintering temperature by using a processed metal powder. This metal powder for lamination-shaping is obtained by coating the surface of a powder of a nickel-based alloy with a conductive material. When the powder is the powder of the nickel-based alloy containing nickel as a main component and chromium and iron as primary subcomponents, the powder is coated, e.g., plated with nickel as the conductive material. The particle diameter range of the powder of the nickel-based alloy is 10 to 200 µm, preferably 25 to 150 µm, and more preferably 45 to 105 µm. The thickness range of the conductive material is 0.1 to 1 µm, and preferably 0.3 µm or more.
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公开(公告)号：EP3159094B1
公开(公告)日：2019-05-08
申请号：EP15886334.0
申请日：2015-03-24
Inventor： FUJIYA, Yasuyuki , KOMATSU, Yoshinao , NARITA, Ryuichi
IPC: B23K26/144 , B22F3/105 , B23K26/21 , B23K26/34 , B29C64/141 , B29C64/209 , B33Y30/00
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149.发明公开
公开(公告)号：EP3366390A1
公开(公告)日：2018-08-29
申请号：EP16885441.2
申请日：2016-12-26
Inventor： HASHIZUME Yoshiki , MURAKAMI Isao , MURAMATSU Kenji , ISHIGAMI Kenta
Abstract: The present invention provides a robust metal lamination-shaped object containing aluminum and having no defect. A metal powder used for forming this metal lamination-shaped object is an aluminum-based powder having a volume-based 50% particle diameter larger than or equal to 10 µm and smaller than 100 µm when a particle diameter distribution is measured by a laser diffraction-scattering method, a specific surface area smaller than or equal to 0.5 m 2 /g, and an oxygen amount larger than or equal to 30 mg/m 2 and less than or equal to 100 mg/m 2 per unit surface area. A relationship between a hydrogen amount (X ml in standard state) per 100 g of the aluminum-based powder and a specific surface area (Y m 2 /g), and a relationship between the hydrogen amount (X ml in standard state) and an oxygen amount (Z wt%), are respectively in accordance with formulas: X/Y 0.0022. A metal lamination-shaped object, that is lamination-shaped by a three-dimensional lamination-shaping apparatus in a powder bed fusion type using the above metal powder, has a hydrogen amount less than or equal to 3 ml in standard state per 100 g, and a relative density more than or equal to 99%.
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公开(公告)号：EP3324229A1
公开(公告)日：2018-05-23
申请号：EP16885450.3
申请日：2016-09-14
Inventor： ISHIGE Yuta , KATAYAMA Etsuji , MORI Hajime
Abstract: A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.
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