Abstract:
The invention relates to moisture-curing compositions with increased storage stability based on compounds bearing silyl groups and use thereof.
Abstract:
Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.
Abstract:
A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
Abstract:
A process for fixing an article to a substrate with a mounting set including two receptacles storing an aerobic adhesive and a hydrophilic substance, respectively. The aerobic adhesive and the hydrophilic substance are removed from the two receptacles and then mixed together to prepare the fastening. A layer of the fastening composition is applied to the article. The article is fixed to the substrate by pressing the layer of the fastening composition against the substrate. The aerobic adhesive in the layer hardens because of the moisture contained in the hydrophilic substance.
Abstract:
The present invention relates to silane reactive hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives.
Abstract:
To provide an adherence substance which has a low viscosity and good coatability, can be made solvent free, is less likely to undergo an increase in the adhesive strength with time and has good adhesion to an adherend while the adhesive strength is low, is excellent in removability and has a good wettability.An adherence substance which is obtainable by curing a curable composition comprising a silyl group-containing polymer (S) represented by the formula (1) and which has a peel adhesive strength of at most 8 N/25 mm: in the formula (1), R1 represents a t-valent residue derived from a (mono)polyol; Q represents a bivalent group formed by a reaction of a terminal group selected from a hydroxy group, an amino group, an isocyanate group, an allyl group, an acryloyl group and a methacryloyl group, with a specific silyl compound; R3 represents a monovalent organic group; X represents a hydroxy group or a hydrolyzable group; Y represents a bivalent group containing an ester linkage or a bivalent group containing an ether linkage; a represents an integer of from 1 to 3; r represents an integer of from 1 to 1,000; and t represents an integer of from 1 to 8.
Abstract:
Non-ceramic floor coverings are bonded to a substrate by an aqueous adhesive that comprises a synthetic polymer as a binder and hydrolyzable silane groups.
Abstract:
A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting a agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
Abstract:
It is an object of the present invention to provide a curable resin composition, having excellent workability (thixotropic properties and applicability) required in applications such as floor adhesives, without causing a decrease in mechanical properties, which contains an organic polymer having a reactive silicon group. The object is attained by a curable resin composition including: an organic polymer (A) having a reactive silicon group; a filler (B) obtained through a combination of three types of filler, namely a filler (B1) having an average particle diameter of less than 0.5 μm, a filler (B2) having an average particle diameter of not less than 0.5 μm to less than 10 μm, and a filler (B3) having an average particle diameter of not less than 10 μm.
Abstract:
A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing adhesive; at least one curable cyanoacrylate adhesive, and at least one curable epoxy adhesive. The optional adhesives can be one or more of the following: contact adhesive, urethane adhesive, polyvinylacetate adhesive, and pressure sensitive adhesive. The kit system also can have a selection guide for the adhesives in the system based on substrate types or substrate types and use conditions. Optionally a guide for using the adhesives in repairing adherends can be included in the kit. Also optionally the selection guide and/or the repair guide can be in an interactive program on a web site on a computer network such as the internet.