Abstract:
PROBLEM TO BE SOLVED: To provide an optical scanning device which gives high image quality and is easy in adjustment of optical axis. SOLUTION: The optical axis of the optical scanning device 10 is adjusted by moving a circuit substrate 32 on which an open light emitting element type semiconductor laser 14 is mounted along the base plane 30A of an optical box 30. Thus, the optical axis is easily adjusted. Further, the circuit substrate 32 is fitted to the base plane 30A of the optical box 30 and an optical scanning giving a high image quality is available by suppressing the influence of the thermal deformation of the optical box. Further, the semiconductor laser 14 is arranged in the optical box which is nearly sealed with a cover, and the attachment of dust and a dielectric breakdown are prevented even the open light emitting element type is used, thus the deterioration of the image quality is prevented. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
【課題】安価なラインセンサを用いて高精度に用紙を読み取ることが可能な読取装置を提供する。 【解決手段】用紙の読取装置は、紫外光を発するためのLED(Light Emitting Diode)53Uと、紫外光で励起される蛍光体を有する発光素子53R,53G,53Bと、LED53Uから発せられ用紙で反射された光を受けて受光量に応じた画像信号V U を生成するとともに、発光素子53R,53G,53Bから発せられ用紙で反射された光を受けて受光量に応じた画像信号V R ,V G ,V B を生成するためのラインセンサと、画像信号V R ,V G ,V B のそれぞれから画像信号V U に対応する成分を除去し、それぞれの差分結果から用紙を表わす画像を生成するための制御装置とを備える。 【選択図】図7
Abstract:
PROBLEM TO BE SOLVED: To provide an image reading apparatus in which heat generated from a photoelectric conversion element can be dissipated appropriately while suppressing incidence of disturbance light or mixing of dust to a space between a lens and the photoelectric conversion element, and work cost required for manufacturing can be reduced.SOLUTION: A light condensation member 10 includes a barrel 11 which shields the space between a lens 1 and a photoelectric conversion element 4a from the outside. The barrel 11 consists of a member 11a where the incidence side of the lens 1 is formed into substantially cylindrical shape, and a member 11b where the exit side of the lens 1 has a square shape opening wider than the outer shape of the photoelectric conversion element 4a, with both members molded integrally of resin, and is disposed to cover the photoelectric conversion element 4a with its square enclosure. Out of the square enclosure, both side faces facing each other in the longitudinal direction have concave shape 1b so that a gap is formed between a substrate to which the photoelectric conversion element 4a is fixed.
Abstract:
PROBLEM TO BE SOLVED: To obtain an optical module in which both the thickness of the entire module and the length in the optical axis direction of an optical lens are shortened, and to obtain an image reader incorporating the optical module and an assembling method of the optical module. SOLUTION: A reflective mirror group 14 is arranged inside a specified space area positioned on the incidence side of an optical lens 13. A first reflective mirror 14a is arranged so that an optical path reaching the first reflective mirror 14a, for making the reflected light of an original incident first, crosses the optical axis of the optical lens 13. An optical path, through which reflected light from the first reflective mirror 14a reaches a second reflective mirror 14b, is configured to cross the optical axis of the optical lens 13. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.