Abstract:
A nonvolatile memory device having self-presence diode characteristics, and/or a nonvolatile memory array including the nonvolatile memory device may be provided. The nonvolatile memory device may include a lower electrode, a first semiconductor oxide layer on the lower electrode, a second semiconductor oxide layer on the first semiconductor oxide layer, and/or an upper electrode on the second semiconductor oxide layer.
Abstract:
A method of manufacturing a semiconductor device can uniformly form a metal gate irrespective of gate pattern density. The method includes forming an interlayer dielectric layer having a trench on a substrate, forming a metal layer having first, second and third sections extending along the sides of the trench, the bottom of the trench and on the interlayer dielectric layer, respectively, forming a sacrificial layer pattern exposing an upper part of the first section of the metal layer, forming a spacer pattern on the exposed part of the first section of the metal layer, and forming a first gate metal layer by etching the first section of the metal layer using the sacrificial layer pattern and the spacer pattern as masks.
Abstract:
Provided are a phase-change memory device using insulating nanoparticles, a flexible phase-change memory device and a method for manufacturing the same. The phase-change memory device includes an electrode, and a phase-change layer in which a phase change occurs depending on heat generated from the electrode, wherein insulating nanoparticles formed from a self-assembled block copolymer are provided between the electrode and the phase-change layer undergoing crystallization and amorphization.
Abstract:
Provided is an apparatus and method for processing a scene that may prevent overload of a scene caused by transmission of excessive information, by generating geometric information corresponding to meaningful information, as which sensed information may be construed semantically, and by only transmitting the geometric information to the scene, instead of transmitting, to the scene, all of the sensed information with respect to a real world.
Abstract:
A frequency tunable filter is disclosed. The disclosed filter comprises a filter unit having a sliding member so as to be capable of tuning a frequency band of a frequency signal being filtered; a communication module configured to receive a control signal for controlling the tuning of the frequency band; and a control unit configured to control the tuning of the frequency band by moving the sliding member based on the control signal. With the disclosed filter, the tuning of the filter may be performed automatically by way of control signals transmitted from a remote location.
Abstract:
A method for processing program information and a broadcast receiver are disclosed. The method includes selecting a program from a service guide screen, identifying a group to which the selected program belongs, and displaying a group list of programs included in a signaling table that signals information of the identified group.
Abstract:
A bottle cap which is combined with a beverage container in the direction of discharge or drinking, comprised of; a main body combined with the container; a storage space inside the main body which contains additives, and; filter holes formed above and below the storage space to keep the additives within the storage space; and the additives in the storage space is soluble in the liquid in the container and discharged through a spout above, and the flow path of the liquid is characterized by being configured to lead the liquid to the storage space of the additives to facilitate dissolution of the additives.
Abstract:
A composition for an organic photoelectric device, the composition including a first host compound including substituents represented by the following Chemical Formulas 1 to 3 sequentially combined; and a second host compound represented by the following Chemical Formula 4,
Abstract:
A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.
Abstract:
Nano-silver infused container arrangements are presented including: a nano-silver infused container body defining at least one opening; and a nano-silver infused container lid configured to close off the at least one opening. In some embodiments, the arrangement is a composition of a polymeric compound and a concentration of nano-silver particles. In some embodiments, the polymeric compound includes polyvinyl-pyrrolidione, polypropylene and polycarbonate. In some embodiments, the nano-silver infused container lid includes: a lid top disposed along a plane, a gasket channel disposed along the contiguous lid wall edge, a channel opening, two opposing concave surfaces disposed perpendicular to the channel opening, and a bottom surface disposed substantially perpendicular to the two opposing concave surfaces and a compressible gasket disposed within the gasket channel and retained by the two opposing concave surfaces; and wherein, the nano-silver infused container body includes: a container bottom, a container wall, and a sealing ridge.