Abstract:
A semiconductor laser that has a reflective surface. The reflective surface redirects the light of an edge emitting laser diode to emit from the top or bottom surface of the diode. The laser may include a gain layer and a feedback layer located within a semiconductive die. The gain and feedback layers generate a laser beam that travels parallel to the surface of the die. The reflective surface reflects the laser beam 90 degrees so that the beam emits the die from the top or bottom surface. The reflective surface can be formed by etching a vicinally oriented III-V semiconductive die so that the reflective surface extends along a (111)A crystalline plane of the die.
Abstract:
An AlGaInP laser element (24) and an AlGaAs laser element (26) are disposed so that their respective stripes (28, 30) are parallel to each other. The AlGaInP laser element (24) is disposed on the (011) plane (22b) side of the substrate center line, and the AlGaAs laser element (26) on the (011) plane (22a) side of the substrate center line as viewed from the main emission plane (011) (22c) side of a laser beam. The substrate (22) is an off-substrate, and is tilted from the (011) plane (22a) toward the (011) plane (22b) at an angle (thetaoff) of at least 2 degrees and up to 15 degrees with respect to the (100) plane. The optical axis L1 of the AlGaInP laser element (24) is in parallel to the optical axis L2 of the AlGaAs laser element (26), or approaches the latter at an angle of about 0.5 degrees.
Abstract:
A method of growing a nitride semiconductor crystal having very few crystal defects and capable of being used as a substrate, comprising the step of forming a first selective growth mask equipped with a plurality of first windows for selectively exposing the surface of a support on the support having a main plane and including different kinds of substrates made of materials different from those of a nitride semiconductor, and the step of growing the nitride semiconductor, by using a gaseous Group III element source and a gaseous nitrogen source, until portions of the nitride semiconductor crystal growing in adjacent windows from the surface of the support exposed from the window join with one another on the upper surface of the selective growth mask.
Abstract:
The present invention relates to production method and device applications of a new silicon (Si) semiconductor light source that emits at a single wavelength at 1320 nm with a full width at half maximum (FWHM) of less than 200 nm and a photoluminescence quantum efficiency of greater than 50% at room temperature. The semiconductor that is the base for the new light source includes a surface which is treated by an acid vapor involving heavy water or Deuterium Oxide (D2O) and a surface layer producing the light source at 1320 nm.
Abstract:
A method for forming optical devices. The method includes providing a gallium nitride substrate member having a crystalline surface region and a backside region. The method also includes subjecting the backside region to a laser scribing process to form a plurality of scribe regions on the backside region and forming a metallization material overlying the backside region including the plurality of scribe regions. The method removes at least one optical device using at least one of the scribe regions.