Automatic gain control circuit
    163.
    发明专利
    Automatic gain control circuit 审中-公开
    自动增益控制电路

    公开(公告)号:JP2006332797A

    公开(公告)日:2006-12-07

    申请号:JP2005149962

    申请日:2005-05-23

    CPC classification number: H03G1/007 H03G1/0029

    Abstract: PROBLEM TO BE SOLVED: To easily set a dynamic range or a noise figure or the like to an optimum value by contriving to decrease gain control sensitivity.
    SOLUTION: A gain control MOS transistor M4 is differentially connected to a second MOS transistor M2 in first and second MOS transistors M1, M2 configuring a cascode amplifier, an AGC control voltage VAGC is applied to a gate of the gain control MOS transistor M4 and a device area ratio of the second MOS transistor M2 to the gain control MOS transistor M4 is selected to be 1:N (N≥1) so that a sudden change caused in the gain can be suppressed and a drain current of the first MOS transistor M1 is made constant independently of the gain control even in a region wherein the AGC control voltage VAGC is small.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:通过设计降低增益控制灵敏度,容易地将动态范围或噪声系数等设置为最佳值。 解决方案:增益控制MOS晶体管M4差分地连接到构成共源共栅放大器的第一和第二MOS晶体管M1,M2中的第二MOS晶体管M2,AGC控制电压VAGC施加到增益控制MOS晶体管的栅极 M4和第二MOS晶体管M2与增益控制MOS晶体管M4的器件面积比选择为1:N(N≥1),从而可以抑制增益引起的突然变化,并且第一 即使在AGC控制电压VAGC较小的区域中,MOS晶体管M1也与增益控制无关。 版权所有(C)2007,JPO&INPIT

    Substrate mounting method
    164.
    发明专利
    Substrate mounting method 审中-公开
    基板安装方法

    公开(公告)号:JP2006303271A

    公开(公告)日:2006-11-02

    申请号:JP2005124543

    申请日:2005-04-22

    Abstract: PROBLEM TO BE SOLVED: To reinforce a bonding strength of a mother board with an interposer using a grounding land for the package shielding case or any other attached patterns.
    SOLUTION: In the package corresponding to the BGA and LGA mounting methods, when the LGA mounting is performed, a bonding strength of a metal pattern on the mother board with the package can be reinforced using a land attached for the bonding reinforcement which is never used in the BGA mounting case.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:使用用于封装屏蔽壳体的接地区域或任何其它附接图案来增强具有插入器的母板的接合强度。 解决方案:在对应于BGA和LGA安装方法的封装中,当执行LGA安装时,可以使用附接到粘合加强件的焊盘来加强母板上的金属图案与封装的结合强度, 从未在BGA安装盒中使用。 版权所有(C)2007,JPO&INPIT

    Glove with lighting installation
    165.
    发明专利
    Glove with lighting installation 审中-公开
    带灯具安装

    公开(公告)号:JP2006241649A

    公开(公告)日:2006-09-14

    申请号:JP2005062205

    申请日:2005-03-07

    Inventor: MASUDA YUKIO

    Abstract: PROBLEM TO BE SOLVED: To obtain a pair of gloves enabling a wearer to sufficiently recognize the condition of the fingertip when working at night or in a dark place.
    SOLUTION: This pair of gloves 1 forming a thumb part 1d covering at least part of the thumb 11 and an index finger part 1e covering at least part of the index finger 12 is obtained by attaching luminous parts 2 and 3 to both the thumb part 1d and the index finger part 1e, or either one of them. The first luminous part 2 is attached to the index finger part 1e adjacent to the thumb part 1d in the case of attaching the first luminous part 2 to the thumb part 1d, and the second luminous part 3 is attached to the thumb part 1d adjacent to the index finger part 1e in the case of attaching the second luminous part 3 to the index finger part 1e. As the result of this, light is irradiated to the middle part of the fingertip of both the thumb 11 and the index finger 12 or either one of them to sufficiently light up the fingertip as working parts, and a worker can sufficiently recognize the condition of the working part.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:获得一双手套,使佩戴者能够在夜间或黑暗的地方工作时充分认出指尖的状况。 解决方案:形成覆盖拇指11的至少一部分的拇指部分1d的一对手套1和覆盖食指12的至少一部分的食指部分1e是通过将发光部分2和3附接到两个 拇指部分1d和食指部分1e,或它们中的任何一个。 在将第一发光部分2附接到拇指部分1d的情况下,第一发光部分2附接到与拇指部分1d相邻的食指部分1e,并且第二发光部分3附接到与拇指部分1d相邻的拇指部分1d 在将第二发光部3附接到食指部1e的情况下的食指部1e。 结果,将光照射到拇指11和食指12的指尖的中间部分,或者其中任意一个使得指尖作为工作部件充分点亮,并且工人可以充分地识别 工作部分。 版权所有(C)2006,JPO&NCIPI

    Transistor circuit and receiver having transistor circuit
    167.
    发明专利
    Transistor circuit and receiver having transistor circuit 审中-公开
    具有晶体管电路的晶体管电路和接收器

    公开(公告)号:JP2005229314A

    公开(公告)日:2005-08-25

    申请号:JP2004035647

    申请日:2004-02-12

    Abstract: PROBLEM TO BE SOLVED: To provide a technology of reducing the power consumption of a transistor circuit composed of one or more transistors.
    SOLUTION: A differential amplifier, in one embodiment, is provided with a pair of transistors 12 and 13, resistors 14 and 15 for converting a current flowing to a DC power source (VDD) and the transistors 12 and 13 to a voltage, a transistor 11 which selectively constitutes a current mirror together with a transistor 16a or 16b to deliver a current from a constant current source 17, and a changeover switch 19 which selects a route on the basis of a switching signal. The transistor 16a is a noticed transistor in the circuit, and the smaller-sized transistor 16 is connected in parallel with the transistor 16a, and the changeover switch 19 is provided to perform switching between a route passing the transistor 16a and that passing the transistor 16b.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 解决的问题:提供降低由一个或多个晶体管构成的晶体管电路的功耗的技术。 解决方案:在一个实施例中,差分放大器设置有一对晶体管12和13,电阻器14和15,用于将流过DC电源(VDD)的电流和晶体管12和13转换成电压 ,晶体管11,其与晶体管16a或16b一起选择性地构成电流镜,以从恒流源17传送电流;以及切换开关19,其基于切换信号选择路线。 晶体管16a是电路中的注意晶体管,并且较小尺寸的晶体管16与晶体管16a并联连接,并且提供转换开关19以在通过晶体管16a的通路和通过晶体管16b的通路之间进行切换 。 版权所有(C)2005,JPO&NCIPI

    Non-contact gate device
    169.
    发明专利
    Non-contact gate device 审中-公开
    非接触门设备

    公开(公告)号:JP2005190475A

    公开(公告)日:2005-07-14

    申请号:JP2004358105

    申请日:2004-12-10

    Abstract: PROBLEM TO BE SOLVED: To provide a non-contact gate device capable of generating a magnetic field in a direction other than an original direction of the magnetic field by a power feed coil; and to provide a non-contact gate device capable of surely feeding power to an identified medium by generating a magnetic field in a plurality of directions by power feed coils arranged in a single direction. SOLUTION: A magnetic field generation means has: a first power feed coil 12 disposed in one side part of a passing path 16; a second power feed coil 14 disposed in the other side part of a passing path 16 and installed oppositely to the first power feed coil 12; an excitation power source part 19 for driving the first and second power feed coils 12 and 14 at the same cycle; and a phase control part 21 for periodically changing a phase difference of an alternating current supplied to the first and second power feed coil 12 and 14. The magnetic field generation means is characterized in that combined magnetic lines of force generated in the passing path 16 are periodically directed in different directions. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题:提供能够通过馈电线圈在除了磁场的原始方向以外的方向上产生磁场的非接触栅极器件; 并且提供一种非接触栅极器件,其能够通过沿着单个方向布置的馈电线圈在多个方向上产生磁场来确定地向所识别的介质馈电。 解决方案:磁场产生装置具有:设置在通过路径16的一个侧部中的第一馈电线圈12; 设置在通路16的另一侧部分并与第一馈电线圈12相对安装的第二馈电线圈14; 励磁电源部19,用于以相同的周期驱动第一和第二供电线圈12和14; 以及用于周期性地改变提供给第一和第二馈电线圈12和14的交流电的相位差的相位控制部分21.磁场产生装置的特征在于,在通过路径16中产生的组合磁力线是 定期指导在不同的方向。 版权所有(C)2005,JPO&NCIPI

    Transfer device and transfer method of circuit board, and method of mounting solder ball
    170.
    发明专利
    Transfer device and transfer method of circuit board, and method of mounting solder ball 审中-公开
    电路板的传送装置和传送方法以及安装焊枪的方法

    公开(公告)号:JP2005064205A

    公开(公告)日:2005-03-10

    申请号:JP2003291769

    申请日:2003-08-11

    CPC classification number: B23K3/0607 B23K2201/42 H01L2224/13 H05K3/3478

    Abstract: PROBLEM TO BE SOLVED: To prevent solder balls from being wrongly mounted when solder balls are collectively mounted on a plurality of BGAs. SOLUTION: The pad formation surface of a CSP 400 is photographed, a pad arrangement is recognized through image processing, and the CSP 400 is positioned for transferring solder balls based on the recognition results of the pad arrangement, whereby the positions of the pads 401 on the pad formation surface of the CSP 400 can accurately be matched with those of solder ball suction nozzles possessed by a solder ball mounting device independently of how pads 401 are formed and arranged on the pad formation surface of the CSP 400. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题:为了防止当焊球集体安装在多个BGA上时焊球被错误地安装。 解决方案:拍摄CSP400的焊盘形成表面,通过图像处理识别焊盘布置,并且基于焊盘布置的识别结果,CSP 400被定位用于传送焊球,由此, CSP400的焊盘形成表面上的焊盘401可以与焊球安装装置所具有的焊球吸附喷嘴的焊盘401精确地匹配,而不管垫401如何形成并布置在CSP 400的焊盘形成表面上。

    版权所有(C)2005,JPO&NCIPI

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