Active light or radiation sensitive resin composition and pattern forming method using the same
    161.
    发明专利
    Active light or radiation sensitive resin composition and pattern forming method using the same 有权
    活性光或辐射敏感性树脂组合物和使用其的图案形成方法

    公开(公告)号:JP2010237627A

    公开(公告)日:2010-10-21

    申请号:JP2009088472

    申请日:2009-03-31

    Abstract: PROBLEM TO BE SOLVED: To provide an active light or radiation sensitive resin composition which allows formation of a pattern having less water residue defects, bubble defects, and development residue defects and is superior in LWR, and a pattern forming method using this resin composition. SOLUTION: The active light or radiation sensitive resin composition includes a resin (HR) having a recurring unit (a) which has a polycyclic structure in its main chain and has a portion where the polycyclic structure is decomposed by the action of an acid to increase the solubility in an alkaline developer. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种有源光或辐射敏感性树脂组合物,其能够形成具有较少缺水缺陷,气泡缺陷和显影残渣缺陷的图案,并且在LWR中优异,并且使用该图案形成方法 树脂组合物。 解决方案:活性光或辐射敏感性树脂组合物包括具有重复单元(a)的树脂(HR),该重复单元(a)在其主链中具有多环结构,并且具有多环结构通过 酸以增加在碱性显影剂中的溶解度。 版权所有(C)2011,JPO&INPIT

    Composition for film formation, insulating film and electronic device
    162.
    发明专利
    Composition for film formation, insulating film and electronic device 审中-公开
    胶片形成用组合物,绝缘膜和电子器件

    公开(公告)号:JP2009227713A

    公开(公告)日:2009-10-08

    申请号:JP2008071418

    申请日:2008-03-19

    Abstract: PROBLEM TO BE SOLVED: To provide a composition (coating liquid) for film formation capable of forming an insulating film that has a low dielectric constant and excellent mechanical strengths and has good surface properties (film surface properties) and heat resistance. SOLUTION: The composition for film formation comprises a polymer (A) comprising a monomer unit represented by formula (1) (wherein R 1 is alkyl or aryl; R 2 is alkyl, alkenyl, alkynyl, aryl, alkoxy, acyloxy, aryloxy, hydroxy, carboxy, alkoxycarbonyl, aryloxycarbonyl, trialkylsilyl or triarylsilyl; when a plurality of R 2 exist, they may be the same or different from each other and may be linked together to form a ring structure; and n is an integer of 0-5). COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供能够形成具有低介电常数和优异的机械强度并且具有良好的表面性质(膜表面性质)和耐热性的绝缘膜的成膜用组合物(涂布液)。 解决方案:用于成膜的组合物包含包含由式(1)表示的单体单元的聚合物(A)(其中R 1为烷基或芳基; R 2为SP 烷基,烯基,炔基,芳基,烷氧基,酰氧基,芳氧基,羟基,羧基,烷氧基羰基,芳氧基羰基,三烷基甲硅烷基或三芳基甲硅烷基;当存在多个R“SP”2 时,它们可以相同或不同 并且可以连接在一起形成环结构; n为0-5的整数)。 版权所有(C)2010,JPO&INPIT

    Composition for forming film, film and electronic device
    163.
    发明专利
    Composition for forming film, film and electronic device 审中-公开
    用于形成薄膜,薄膜和电子器件的组合物

    公开(公告)号:JP2009046622A

    公开(公告)日:2009-03-05

    申请号:JP2007215536

    申请日:2007-08-22

    Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming a film capable of forming a film that exhibits high heat resistance, high mechanical strengths, a low dielectric constant, surface smoothness and good preservation stability with time, a film obtained using the composition for forming a film, and an electronic device comprising the film. SOLUTION: The composition for forming a film comprises a compound represented by formula (1) and/or a polymer obtained by polymerizing at least the compound represented by formula (1). The film is formed using the composition for forming a film. The electronic device comprises the film. In formula (1), A 1 is a tetravalent to hexavalent organic group; A 2 is an alkenyl group or an alkynyl group; Ar is an (a1+1)-valent aryl group; R is a hydrogen atom or a 1-30C alkyl group; a1 is an integer of 1-5; and a2 is 2 or 3. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于形成能够形成具有高耐热性,高机械强度,低介电常数,表面光滑度和随时间保持稳定性好的膜的组合物,使用 用于形成膜的组合物和包含该膜的电子器件。 解决方案:用于形成膜的组合物包含由式(1)表示的化合物和/或通过至少使由式(1)表示的化合物聚合而获得的聚合物。 使用用于形成膜的组合物形成膜。 电子装置包括薄膜。 在式(1)中,A 1是四价至六价有机基团; A 2 是烯基或炔基; Ar是(a1 + 1)价的芳基; R是氢原子或1-30C烷基; a1为1-5的整数; a2是2或3.版权所有(C)2009,JPO&INPIT

    Composition for interlayer insulation film
    164.
    发明专利
    Composition for interlayer insulation film 审中-公开
    中间层绝缘膜的组成

    公开(公告)号:JP2008222742A

    公开(公告)日:2008-09-25

    申请号:JP2007058857

    申请日:2007-03-08

    Inventor: IWATO KAORU

    Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming an interlayer insulation film, having good film characteristics such as permittivity, mechanical strengths, etc., used for an electronic device, also having a good close adhesion with a substrate plate, and further excellent in the stability of coating liquid.
    SOLUTION: This composition for the interlayer insulation film contains the following components. (A) A hydrolysate obtained by hydrolyzing an alkoxy silane or acyloxysilane having at least one carbon-carbon double bond under ≤10 mass% substrate concentration. (B) A compound having at least two bonds selected from a carbon-carbon double bond and carbon-carbon triple bond in its molecule and (C) solvent.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供一种用于形成层间绝缘膜的组合物,其具有与衬底板具有良好紧密粘合性的用于电子器件的具有良好膜特性,例如介电常数,机械强度等, 并且涂布液的稳定性进一步优异。 解决方案:该层间绝缘膜用组合物含有以下成分。 (A)通过在≤10质量%底物浓度下水解具有至少一个碳 - 碳双键的烷氧基硅烷或酰氧基硅烷获得的水解产物。 (B)分子中具有选自碳 - 碳双键和碳 - 碳三键中的至少两个键的化合物和(C)溶剂。 版权所有(C)2008,JPO&INPIT

    Ethynyl compound
    165.
    发明专利
    Ethynyl compound 审中-公开
    乙基化合物

    公开(公告)号:JP2008222690A

    公开(公告)日:2008-09-25

    申请号:JP2007067917

    申请日:2007-03-16

    Abstract: PROBLEM TO BE SOLVED: To provide an ethynyl compound having high heat resistance.
    SOLUTION: A compound represented by formula (1) is disclosed. It is desirable that Ar in the compound represented by formula (1) is a residue derived by removing n
    1 hydrogen atoms from a benzene ring. That is to say, the compound represented by formula (1) is a compound represented by formula (2). In formulae (1) and (2), Ar is an n
    1 -valent aryl group; n
    1 is an integer of 2-4; and n
    2 is an integer of 1 or 2.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 待解决的问题:提供具有高耐热性的乙炔基化合物。 解决方案:公开了由式(1)表示的化合物。 期望式(1)表示的化合物中的Ar是通过从苯环除去n 1 氢原子得到的残基。 也就是说,由式(1)表示的化合物是由式(2)表示的化合物。 在式(1)和(2)中,Ar是n 1价的芳基; n 1 是2-4的整数; 并且n 2 是1或2的整数。版权所有(C)2008,JPO&INPIT

    Composition for forming low dielectric constant film, insulating film and electronic device
    166.
    发明专利
    Composition for forming low dielectric constant film, insulating film and electronic device 有权
    用于形成低介电常数膜,绝缘膜和电子器件的组合物

    公开(公告)号:JP2008166384A

    公开(公告)日:2008-07-17

    申请号:JP2006352273

    申请日:2006-12-27

    Inventor: IWATO KAORU

    CPC classification number: C08G73/00 C08L79/00 H01B3/18 H01L21/312

    Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming a low dielectric constant film which can form an insulating film that is used for an interlayer film of an electronic device or the like, has a low dielectric constant and superior mechanical strength and has a sufficient film characteristic, and to provide the insulating film obtained by using the composition and the electronic device having the insulating film.
    SOLUTION: The composition for forming low dielectric constant film comprises a compound having a structure where aryl groups are diazo-coupled. The insulating film obtained by using the composition and the electronic device having the insulating film are provided.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 解决的问题:提供一种用于形成用于电子器件等的中间膜的绝缘膜的低介电常数膜的组合物,其介电常数低,机械强度优异, 具有足够的膜特性,并提供通过使用该组合物获得的绝缘膜和具有绝缘膜的电子器件。 解决方案:用于形成低介电常数膜的组合物包括具有芳基重氮结合的结构的化合物。 提供通过使用该组合物获得的绝缘膜和具有绝缘膜的电子器件。 版权所有(C)2008,JPO&INPIT

    Method for polymerizing compound having carbon-carbon triple bond and polymer polymerized by the polymerization method, and composition containing the polymer and used for forming films, insulated film and electronic device
    167.
    发明专利
    Method for polymerizing compound having carbon-carbon triple bond and polymer polymerized by the polymerization method, and composition containing the polymer and used for forming films, insulated film and electronic device 审中-公开
    聚碳酸酯化合物的聚合方法和由聚合方法聚合的聚合物的方法以及包含聚合物并用于形成膜,绝缘膜和电子器件的组合物

    公开(公告)号:JP2008081540A

    公开(公告)日:2008-04-10

    申请号:JP2006260429

    申请日:2006-09-26

    Inventor: IWATO KAORU

    Abstract: PROBLEM TO BE SOLVED: To provide a polymer having a high purity cage type structure and having a low dielectric constant, to provide a composition containing the same and used for forming insulated films having low dielectric constants and excellent mechanical strengths for interlayer films for electronic devices and the like, to provide an interlayer insulated film for an electronic device and obtained from the composition, and to provide an electronic device using the insulated film as a layer-constituting layer.
    SOLUTION: This method for polymerizing or oligomerizing a carbon-carbon triple bond-having compound is characterized by using a radical generator as a polymerization or oligomerization-initiator and using a phenoxy compound having a specific structure as a solvent.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供具有高纯度笼型结构并具有低介电常数的聚合物,以提供含有该组合物的组合物,并用于形成具有低介电常数的绝缘膜和用于中间膜的优异的机械强度 为了电子器件等,提供一种电子器件的层间绝缘膜,由该组合物得到,并且提供一种使用绝缘膜作为层构成层的电子器件。 解决方案:用于聚合或低聚含碳 - 碳三键化合物的方法的特征在于使用自由基发生剂作为聚合或低聚引发剂,并使用具有特定结构的苯氧基化合物作为溶剂。 版权所有(C)2008,JPO&INPIT

    Positive photosensitive composition material and pattern forming method using it
    168.
    发明专利
    Positive photosensitive composition material and pattern forming method using it 有权
    积极的光敏组合物材料和图案形成方法

    公开(公告)号:JP2007264106A

    公开(公告)日:2007-10-11

    申请号:JP2006086215

    申请日:2006-03-27

    Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive composition material having an excellent line edge roughness (LWR) property and a pattern forming method using it. SOLUTION: The positive type photosensitive composition comprises a chemical compound (A) generating acid when irradiated with active light ray or radiation, a resin (B1) containing a repeat unit having a group decomposed by a monocyclic aliphatic group and acid and producing an alkali soluble group, a positive photosensitive composition material characterized by containing resin (B2) containing a repeat unit having a group decomposed by a single ring aliphatic group and acid different from the repeat unit having a group decomposed by a single ring aliphatic machine and acid of the resin (B1) and producing an alkali soluble group and producing an alkali soluble group. The pattern forming method uses this positive type photosensitive composition. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供具有优异的线边缘粗糙度(LWR)性质的正型感光性组合物材料和使用它的图案形成方法。 解决方案:正型感光组合物包含当用活性光线或辐射照射时产生酸的化合物(A),含有具有由单环脂族基团分解的基团的重复单元的树脂(B1)和酸,并产生 碱溶性基团,正性感光性组合物材料,其特征在于,含有含有具有由单环脂肪族基团分解的基团的重复单元的树脂(B2)和不同于具有通过单环脂族机分解的基团的重复单元的酸和酸 的树脂(B1),生成碱溶性基团并生成碱溶性基团。 图案形成方法使用这种正型光敏组合物。 版权所有(C)2008,JPO&INPIT

    Positive resist composition and pattern forming method using the same
    169.
    发明专利
    Positive resist composition and pattern forming method using the same 有权
    正极性组合物和使用其的图案形成方法

    公开(公告)号:JP2007256641A

    公开(公告)日:2007-10-04

    申请号:JP2006081055

    申请日:2006-03-23

    Abstract: PROBLEM TO BE SOLVED: To solve problems in techniques to improve performances in microprocessing of semiconductor elements using active rays or radiation, particularly, KrF excimer laser light, electron beams or EUV light, and to provide a positive resist composition having high sensitivity, reduced roughness and pattern density dependence, and showing excellent sensitivity and dissolution contrast even in exposure to EUV light, and to provide a pattern forming method using the composition.
    SOLUTION: The resist composition comprises a resin containing an ester group having a structure in which an aliphatic ring is ring-condensed with a benzene ring having an acid-labile group, and a compound which generates an acid by irradiation with active rays or radiation. The pattern forming method is carried out by using the above composition.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 解决的问题:为了解决使用活性射线或辐射,特别是KrF准分子激光,电子束或EUV光提高半导体元件的微处理性能的技术中的问题,并提供具有高灵敏度的正性抗蚀剂组合物 ,降低的粗糙度和图案密度依赖性,并且即使在暴露于EUV光下也显示出优异的灵敏度和溶解对比度,并且提供使用该组合物的图案形成方法。 解决方案:抗蚀剂组合物包含含有脂族环与具有酸不稳定基团的苯环稠合的结构的酯基和通过用活性射线照射产生酸的化合物 或辐射。 图案形成方法通过使用上述组成进行。 版权所有(C)2008,JPO&INPIT

    Positive resist composition and pattern forming method using positive resist composition
    170.
    发明专利
    Positive resist composition and pattern forming method using positive resist composition 审中-公开
    积极抵抗组合物和图案形成方法使用积极抵抗组成

    公开(公告)号:JP2007057604A

    公开(公告)日:2007-03-08

    申请号:JP2005240241

    申请日:2005-08-22

    Abstract: PROBLEM TO BE SOLVED: To provide a positive resist composition which can be suitably used when ArF excimer laser light is used as an exposure light source, excels in line edge roughness, and causes neither pattern collapse nor problem of development defects, and a pattern forming method using the same, and to further provide a positive resist composition excellent in pattern profile and exposure latitude and a pattern forming method using the same. SOLUTION: The positive resist composition contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (B) a resin which is decomposed by the action of an acid to increase its solubility in an alkali developer, and (C) a low-molecular compound having a specific lactone structure. The pattern forming method using the positive resist composition is also provided. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供正极抗蚀剂组合物,当使用ArF准分子激光作为曝光光源时可以适当使用,正面抗蚀剂组合物优于线边缘粗糙度,并且不会引起图案塌陷或显影缺陷的问题,以及 使用该图案形成方法,并且进一步提供图案形状和曝光宽容度优异的正性抗蚀剂组合物和使用其的图案形成方法。 解决方案:正型抗蚀剂组合物含有(A)在用光化射线或辐射照射时能够产生酸的化合物,(B)通过酸的作用分解以提高其在碱中的溶解度的树脂 显影剂,(C)具有特定内酯结构的低分子化合物。 还提供了使用正性抗蚀剂组合物的图案形成方法。 版权所有(C)2007,JPO&INPIT

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