公开(公告)号：US20200207611A1

公开(公告)日：2020-07-02

申请号：US16813967

申请日：2020-03-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen Cook ,  James F. HALLAS ,  Randy LONG

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14 ,  G01M3/32 ,  G01L9/00

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US20200176251A1

公开(公告)日：2020-06-04

申请号：US16206050

申请日：2018-11-30

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Daniel Lee Revier

IPC: H01L21/02 ,  H01L21/3205 ,  H01L21/8238 ,  H01L21/66

Abstract: A microelectronic device is formed by forming at least a portion of a substrate of the microelectronic device by one or more additive processes. The additive processes may be used to form semiconductor material of the substrate. The additive processes may also be used to form dielectric material structures or electrically conductive structures, such as metal structures, of the substrate. The additive processes are used to form structures of the substrate which would be costly or impractical to form using planar processes. In one aspect, the substrate may include multiple doped semiconductor elements, such as wells or buried layers, having different average doping densities, or depths below a component surface of the substrate. In another aspect, the substrate may include dielectric isolation structures with semiconductor material extending at least partway over and under the dielectric isolation structures. Other structures of the substrate are disclosed.

公开(公告)号：US20200166404A1

公开(公告)日：2020-05-28

申请号：US16203536

申请日：2018-11-28

Applicant: Texas Instruments Incorporated

Inventor： Adam Joseph Fruehling ,  Benjamin Stassen Cook ,  Simon Joshua Jacobs ,  Juan Alejandro Herbsommer

IPC: G01J3/02 ,  G04F5/14 ,  H04B1/38 ,  G01J3/42

Abstract: Millimeter wave energy is provided to a spectroscopy cavity of a spectroscopy device that contains interrogation molecules. The microwave energy is received after it traverses the spectroscopy cavity. The amount of interrogation molecules in the spectroscopy cavity is adjusted by activating a precursor material in one or more sub-cavities coupled to the spectroscopy cavity by a diffusion path to increase the amount of interrogation molecules or by activating the getter material in one or more sub-cavities coupled to the spectroscopy cavity by a diffusion path to decrease the amount of interrogation molecules.

公开(公告)号：US10547350B2

公开(公告)日：2020-01-28

申请号：US15146965

申请日：2016-05-05

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Swaminathan Sankaran

IPC: H01P7/10 ,  H01P7/04 ,  H04B5/00 ,  H01P3/16 ,  H01Q7/00

Abstract: A system is provided in which a first waveguide has a first resonator coupled to an end of the first waveguide. A second waveguide has a second resonator coupled to the second waveguide. The first resonator is spaced apart from the second resonator by a gap distance. Transmission of a signal propagated by the first waveguide across the gap to the second waveguide is enhanced by a confined near field mode magnetic field produced by the first resonator in response to the propagating wave that is coupled to the second resonator.

公开(公告)号：US10425793B2

公开(公告)日：2019-09-24

申请号：US15638194

申请日：2017-06-29

Applicant: Texas Instruments Incorporated

Inventor： Swaminathan Sankaran ,  Benjamin Stassen Cook ,  Nathan Brooks ,  Bradley Allen Kramer ,  Mark W. Morgan ,  Baher Haroun

IPC: H04B5/00 ,  H04W4/80 ,  H04L29/06 ,  G06F13/14 ,  H04L29/08

Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. The port region is offset laterally from the NFC coupler. The field confiner is skewed to provide a pathway between the NFC coupler and the port region.

公开(公告)号：US10424523B2

公开(公告)日：2019-09-24

申请号：US15697505

申请日：2017-09-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook

IPC: H01L23/08 ,  B81C1/00 ,  H01L21/768

Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

公开(公告)号：US20190131250A1

公开(公告)日：2019-05-02

申请号：US15799757

申请日：2017-10-31

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Daniel Lee Revier

IPC: H01L23/552 ,  H01L21/56 ,  G02B1/00 ,  H01L23/495 ,  H01L23/29

Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. An electromagnetic interference (EMI) shield is provided by a photonic bandgap (PBG) structure that is included within the encapsulation material. The PBG structure is configured to have a photonic bandgap with a frequency range approximately equal to a range of frequencies that may cause EMI.

公开(公告)号：US20190074270A1

公开(公告)日：2019-03-07

申请号：US15693985

申请日：2017-09-01

Applicant: Texas Instruments Incorporated

Inventor： Daniel Lee Revier ,  Steven Alfred Kummerl ,  Benjamin Stassen Cook

IPC: H01L25/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/367 ,  H01F7/02 ,  H01L21/687 ,  H01F7/20

Abstract: Integrated circuits may be assembled by placing a batch of integrated circuit (IC) die on a leadframe. Each of the IC die includes a magnetically responsive structure that may be an inherent part of the IC die or may be explicitly added. The IC die are then agitated to cause the IC die to move around on the leadframe. The IC die are captured in specific locations on the leadframe by an array of magnetic domains that produce a magnetic response from the plurality of IC die. The magnetic domains may be formed on the lead frame, or may be provided by a magnetic chuck positioned adjacent the leadframe.

公开(公告)号：US20190067139A1

公开(公告)日：2019-02-28

申请号：US15693368

申请日：2017-08-31

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Daniel Lee Revier

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/495

Abstract: An encapsulated integrated circuit that includes an integrated circuit (IC) die and an encapsulation material encapsulating the IC die. A first portion of the encapsulation material is solid and a second portion of the encapsulation material includes spaces filled with a second material.

公开(公告)号：US20190028146A1

公开(公告)日：2019-01-24

申请号：US16036652

申请日：2018-07-16

Applicant: Texas Instruments Incorporated

Inventor： Mark William Morgan ,  Swaminathan Sankaran ,  Benjamin Stassen Cook ,  Ali Djabbari ,  Lutz Albrecht Naumann

IPC: H04B5/00 ,  H02J50/20 ,  H02J50/10 ,  H02J50/40

Abstract: A removable module includes circuitry, a near field communication (NFC) coupler to provide a data signal to the circuitry, and a second NFC coupler to supply operating voltage to the circuitry.