Abstract:
A composition containing an alkoxysilyl-functional polymer, a phenylsilicone resin, and a non-reactive plasticizer, when cured, exhibits very high elongation without loss of tensile strength. The compositions are particularly well suited for flexible adhesives.
Abstract:
Moisture-curable resin compositions comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and cured compositions produced by contacting such resin compositions with water are disclosed. The moisture-curable resin composition is useful in the production of adhesives, including hot melt adhesives, primers, sealants, and coatings.
Abstract:
The present invention provides curable compositions comprising non-tin metal accelerators that accelerate the condensation curing of moisture-curable silicones/non-silicones. In particular, the present invention provides an accelerator comprising amino acid compounds that are suitable as replacements for organotin in sealant and RTV formulations.
Abstract:
The invention relates to a two-component composition, including a component A, which includes at least one silane-functional polymer and at least one hardener or accelerator for epoxy resins, and a component B, which includes at least one aqueous emulsion of at least one epoxy resin. Two-component compositions according to the invention are suitable as adhesives, sealants or coatings.
Abstract:
A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
Abstract:
The present invention provides curable compositions comprising (A) an polymer having a reactive silicon-containing group, (B) a cross-linker and/or a chain extender, (C) a non-tin metal catalyst, (D) an adhesion promoter, (E) optionally a filler, (F) optionally cure accelerator. The above curable compositions exhibit excellent adhesiveness, deep section cure, stable curability even after storage and/or retained physical properties even after subjecting to the accelerated humidity and temperatures.
Abstract:
Provided is a waterborne adhesive composition comprising (i) an aqueous medium; (ii) one or more isocyanate compounds dispersed in said aqueous medium, and (iii) one or more functional silane compounds dispersed in said aqueous medium. Also provided is a method of bonding a metal foil to a polymeric film comprising the steps of (A) applying a layer of the waterborne adhesive composition to a surface of said metal foil, (B) drying said layer of said adhesive composition to produce a layer of dried adhesive, and (C) after said drying, bringing a surface of a polymeric film into contact with said layer of said dried adhesive composition.
Abstract:
The present invention relates to an one-component adhesive composition, comprising a moisture cross-linking silyl modified polymer and an organoclay-based rheology controller being an alkyl ammonium salt modified mineral clay mixture. The present invention relates moreover to a two-component adhesive composition, comprising a first component A) comprising a moisture cross-linking polymer and an organoclay-based rheology controller; and a second water-based component B) that is reactive with component A) upon mixing thereof. The present invention moreover relates to a method of production of said adhesive composition.
Abstract:
A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.
Abstract:
Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.