公开(公告)号：US20190094464A1

公开(公告)日：2019-03-28

申请号：US16115104

申请日：2018-08-28

Applicant: Skorpios Technologies, Inc.

Inventor： Majid Sodagar ,  Murtaza Askari ,  Guoliang Li

IPC: G02B6/14 ,  G02B5/20 ,  G02B6/122 ,  G02B6/26 ,  G02B6/12 ,  G02F1/35 ,  G02F1/365

Abstract: An optical filter for attenuating higher-order modes in an optical waveguide includes a shoulder slab formed of a first material having a first index of refraction and disposed on a second material having a second index of refraction, the first index of refraction being higher than the second index of refraction. The shoulder slab defines a near end having a first width, an intermediate section, adjacent to the first end section, and a far end section, adjacent to the intermediate section and opposite the first end section along a direction of beam propagation. The optical filter also includes a waveguide ridge, formed of the first material and disposed atop the shoulder slab, that traverses the shoulder slab, and is configured to guide light of a fundamental mode along the direction of beam propagation from the near end section to the far end section.

公开(公告)号：US10243314B2

公开(公告)日：2019-03-26

申请号：US15268951

申请日：2016-09-19

Applicant: Skorpios Technologies, Inc.

Inventor： John Y. Spann

IPC: H01S3/063 ,  H01S5/022 ,  G02B6/12 ,  H01S5/026 ,  H01S5/02 ,  H01S5/343

Abstract: A device for a gain medium for a semiconductor laser has an active region, a buffer layer, a substrate, and an etch stop between the buffer layer and the substrate. The device is bonded to a silicon platform having silicon devices, such as a waveguide and mirror. The substrate is removed, after bonding the device to the platform. The buffer layer is made of different material than the substrate to reduce undercut of the buffer layer during substrate removal compared to a buffer layer made of the same material as the substrate.

公开(公告)号：US10234626B2

公开(公告)日：2019-03-19

申请号：US15426366

申请日：2017-02-07

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  H01S5/02 ,  H01S5/026 ,  H01S5/028 ,  H01S5/22 ,  H01S5/30 ,  H01S5/343 ,  H01S5/40 ,  H04B10/50 ,  H04J14/02 ,  H01S5/022

Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.

公开(公告)号：US20180308834A1

公开(公告)日：2018-10-25

申请号：US15900590

申请日：2018-02-20

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena ,  John Dallesasse

IPC: H01L25/00 ,  G02B6/13 ,  H01L21/48 ,  H01L21/74 ,  H01L21/762 ,  H01L31/18 ,  H01L21/8258 ,  H01L21/84 ,  G02B6/00 ,  H01L33/00 ,  H01L25/16 ,  H01S5/02 ,  H01S5/022

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

公开(公告)号：US09922967B2

公开(公告)日：2018-03-20

申请号：US14862435

申请日：2015-09-23

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick

IPC: H01L25/16 ,  H01L25/00 ,  H01L21/48 ,  H01L21/74 ,  H01L21/84 ,  G02B6/13 ,  H01L21/8258 ,  H01L21/762 ,  H01L31/18 ,  H01S5/02 ,  H01L33/00 ,  H01S5/022

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

公开(公告)号：US20180069542A1

公开(公告)日：2018-03-08

申请号：US15655654

申请日：2017-07-20

Applicant: Skorpios Technologies, Inc.

Inventor： Andrew Bonthron ,  Phuoc Nguyen ,  Viktor Novozhilov ,  Michael Nilsson ,  Wei-Min Kuo

IPC: H03K7/02 ,  H04L25/49 ,  H04B14/02 ,  H03K19/00

CPC classification number: H03K7/02 ,  H03K19/0002 ,  H04B14/023 ,  H04L25/4917

Abstract: A PAM (Pulse Amplitude Modulation) modulator driver is configured to receive a PAM input signal having N input amplitude levels and provide a PAM output signal having N output amplitude levels, where N is an integer. The PAM modulator driver circuit configured to electrically adjust amplitude levels in the PAM output signal.

公开(公告)号：US20180052283A1

公开(公告)日：2018-02-22

申请号：US15633343

申请日：2017-06-26

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/12 ,  H01S5/022 ,  H01L25/16 ,  H01L25/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02 ,  H01L33/00

CPC classification number: H01L25/167 ,  G02B6/12002 ,  G02B6/1225 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/0753 ,  H01L25/16 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272 ,  H01S5/1003

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

公开(公告)号：US09882073B2

公开(公告)日：2018-01-30

申请号：US14509979

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01L31/102 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/026 ,  H01S5/30 ,  H01S5/02

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.

公开(公告)号：US09829631B2

公开(公告)日：2017-11-28

申请号：US15133898

申请日：2016-04-20

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: G02B6/125 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/125 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12104 ,  G02B2006/12147 ,  G02B2006/12169

Abstract: A method forms a vertical output coupler for a waveguide that propagates light along a horizontal propagation direction, through a waveguide material that overlies a buried oxide layer. The method includes etching the waveguide to remove a portion of the waveguide. The etching forms at least a first plane that is at an edge of the waveguide, is adjacent to the removed portion of the waveguide, and is tilted at a vertical angle between 20 degrees and 70 degrees with respect to the propagation direction. The method further includes coating the first tilted plane with a reflective metal to form a mirror, such that the mirror reflects the light into a direction having a vertical component.

公开(公告)号：US09664855B2

公开(公告)日：2017-05-30

申请号：US15262937

申请日：2016-09-12

Applicant: Skorpios Technologies, Inc.

Inventor： Majid Sodagar ,  Murtaza Askari ,  Guoliang Li

IPC: G02B6/12 ,  G02B6/14 ,  G02B6/122

CPC classification number: G02B6/14 ,  G02B5/20 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/262 ,  G02B2006/12035 ,  G02B2006/12097 ,  G02B2006/12109 ,  G02F1/3501 ,  G02F1/365 ,  G02F2001/3509

Abstract: An optical filter for attenuating higher-order modes in an optical waveguide includes a shoulder slab formed of a first material having a first index of refraction and disposed on a second material having a second index of refraction, the first index of refraction being higher than the second index of refraction. The shoulder slab defines a near end having a first width, an intermediate section, adjacent to the first end section, and a far end section, adjacent to the intermediate section and opposite the first end section along a direction of beam propagation. The optical filter also includes a waveguide ridge, formed of the first material and disposed atop the shoulder slab, that traverses the shoulder slab, and is configured to guide light of a fundamental mode along the direction of beam propagation from the near end section to the far end section.