Abstract:
An amplifying circuit receiving an input voltage and a reference voltage equal to a fraction of the circuit supply voltage, the reference voltage provided by a time constant circuit, including a circuit for, upon power-on, inhibiting the amplifying circuit for as long as the difference between the value of the provided reference voltage and the voltage at the output of the time constant circuit is greater than a determined threshold.
Abstract:
A memory device includes a plurality of memory cells arranged as a matrix. Each memory cell includes a transistor and a capacitor connected in series. Each memory cell is linked to a bit line that connects the memory cells of a column. Each memory cell is also linked to a word line and to a third line. A gate of the transistor of a memory cell is linked to the word line, with each word line being linked to the gates of the transistors in a respective column. A third line is linked to the sources of the transistors of a row of memory cells. A bit line is linked to the capacitors of the transistors of a column. The voltage between the gate and the source of a transistor can thus be controlled via the word column and the third line.
Abstract:
A method for determining r error detection bits that can be associated with a word of m bits to be coded, including the step of calculating the product of a vector with m components representative of the word of m bits to be coded and of a parity control matrix of dimension rnullm. The parity control matrix is such that each column of matrix includes an odd number of null1snull greater than or equal to three. The present invention also relates to a method for determining a syndrome.
Abstract:
There is provided an integrated circuit having active components including junctions formed in a monocrystalline substrate doped locally, and at least one passive component situated above the active components. The integrated circuit includes a first insulating layer separating the active components and abase of the passive component, and a metal terminal for electrically connecting the passive component with at least one of the active components. The metal terminal is formed in the thickness of the first insulating layer and has a contact surface that projects from the limits of a junction of the one active component. In a preferred embodiment, the passive component is a capacitor. Also provided is a method of fabricating an integrated circuit that includes MOS transistors and an onboard memory plane of DRAM cells in a matrix.
Abstract:
A semiconductor package is provided that includes a flat leadframe having front and rear faces. The leadframe includes a central platform and elongate electrical connection leads distributed around this platform. Electrical connection wires connect the chip to the front face of the leads, and encapsulation means encapsulates the chip such that the rear face of the leadframe is visible. The electrical connection leads include an inner end part and an outer end part, the rear faces of the inner and outer end parts lie in the plane of the rear face of the leadframe, and the inner and outer end parts are connected by a branch whose rear face is set back with respect to the plane of the rear face of the leadframe so as to define a rear recess. The electrical connection wires are connected to the leads on the front face of their inner end part.
Abstract:
A MOS transistor with a drain extension includes an isolation block on the upper surface of a semiconductor substrate. The isolation block has a first sidewall next to the gate of the transistor, and a second sidewall that is substantially parallel to the first sidewall. The isolation block further includes a drain extension zone in the substrate under the isolation block, and a drain region in contact with the drain extension zone. The drain region is in the substrate but is not covered by the isolation block.
Abstract:
A bias circuit integrated on a silicon wafer includes first, second and third branches. The first branch includes a first PMOS transistor in series with a first NMOS transistor. The second branch includes a second PMOS transistor, a second NMOS transistor and an electric resistor in series. The gate of the first NMOS transistor is connected to the gate of the second NMOS transistor. The first branch and the second branch are arranged as a current mirror. The third branch includes a third PMOS transistor in series with a third NMOS transistor. The third PMOS and NMOS transistors are arranged to maintain a drain voltage of the first PMOS transistor that is substantially identical to a drain voltage of the second PMOS transistor.
Abstract:
A device for the comparison of two resistors is based upon analog information carried by currents. The device includes a measurement circuit for extracting the currents from the two resistors to be compared, and copies the currents to a parallel analog-digital converter that carries out the division of the extracted currents. The device converts the ratio of the extracted currents into a digital code that is the image of the ratio of the two resistors. The ratio is constantly re-updated as a function of environmental parameters of the circuit, such as the operating temperature. Also disclosed is a system for correcting the value of integrated compensated resistors. The system implements a device of this kind that does not use a reference voltage generator.
Abstract:
An integrated circuit on a silicon substrate includes at least one polysilicon line and at least one antistatic contact connecting the polysilicon line to the silicon substrate. The antistatic contact includes a thin oxide layer between the polysilicon line and the silicon substrate. The thin oxide layer is of a sufficiently small thickness so that a current flows across it by the tunnel effect when the polysilicon line is brought, relatively to the substrate, to a voltage greater or less than determined thresholds.
Abstract:
A read-only memory formed of cells, each of which includes, between a selection line and a bit line, the series connection of a memory element and of a selection MOS transistor with a gate connected to a read control line. The memory elements of blank cells are P-channel MOS transistors and the memory elements of programmed cells are uniformly N-type doped semiconductor regions.