ORGANIC INTERPOSERS FOR INTEGRATED CIRCUIT PACKAGES

    公开(公告)号:US20210082822A1

    公开(公告)日:2021-03-18

    申请号:US16573943

    申请日:2019-09-17

    Abstract: An electronic interposer may be formed comprising an upper section, a lower section and a middle section. The upper section and the lower section may each have between two and four layers, wherein each layer comprises an organic material layer and at least one conductive route comprising at least one conductive trace and at least one conductive via. The middle section may be formed between the upper section and the lower section, wherein the middle section comprises up to eight layers, wherein each layer comprises an organic material and at least one conductive route comprising at least one conductive trace and at least one conductive via, and wherein a thickness of each layer of the middle section is thinner than a thickness of any of the layers of the upper section and thinner than a thickness of any of the layers of the lower section.

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