Microstructure, process for manufacturing thereof and devices incorporating the same
    180.
    发明公开
    Microstructure, process for manufacturing thereof and devices incorporating the same 失效
    Mikromechanisches Element,Herstellungsverfahrendafürund Vorrichtungen mit diesem Element。

    公开(公告)号:EP0665590A2

    公开(公告)日:1995-08-02

    申请号:EP95300521.2

    申请日:1995-01-27

    Abstract: A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1).
    The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure.
    The microstructure can have application as electrostatic actuator etc., depending on choice of shape and composition.

    Abstract translation: 一种微结构,其包括衬底(1),悬挂在衬底(1)上的图案化结构(梁构件)(2),其间具有空气空间(4)和用于将图案化结构(2)悬挂在其上的支撑结构(3) 基板(1)。 通过使用牺牲层(7)来制备微结构,所述牺牲层被除去以形成衬底(1)和附着到牺牲层的图案化结构(2)之间的空间。 在使用树脂作为牺牲层的材料的情况下,可以除去牺牲层而不引起粘附,并且可以在图案化结构上提供电极。 根据形状和组成的选择,微结构可以作为静电致动器等应用。

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