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    Coplaner waveguide and fabrication method thereof
    172.
    发明申请
    Coplaner waveguide and fabrication method thereof 审中-公开
    平面波导及其制造方法

    公开(公告)号：US20100059896A1

    公开(公告)日：2010-03-11

    申请号：US12461610

    申请日：2009-08-18

    Applicant: Takeshi Makita ,  Isao Tamai ,  Shinichi Hoshi

    Inventor： Takeshi Makita ,  Isao Tamai ,  Shinichi Hoshi

    IPC: H01L23/52 ,  H01L21/768

    CPC classification number: G02B6/136 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02F2201/06 ,  G02F2202/10 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: A coplanar waveguide includes a substrate, a signal line formed on the substrate, a pair of ground conductors formed on the substrate on mutually opposite sides of the signal line, a signal line insulating film disposed between the signal line and the substrate, and a ground conductor insulating film disposed between the pair of ground conductors and the substrate. No corresponding insulating film is present on the substrate between the signal line and the ground conductors. Even if a silicon substrate is used, the attenuation characteristics of the coplanar waveguide are comparable to the attenuation characteristics of coplanar waveguides formed on compound semiconductor substrates.

    Abstract translation: 共面波导包括基板，形成在基板上的信号线，形成在信号线的相对相对侧的基板上的一对接地导体，设置在信号线和基板之间的信号线绝缘膜，以及接地 导体绝缘膜设置在一对接地导体和基板之间。 在信号线和接地导体之间的衬底上不存在对应的绝缘膜。 即使使用硅衬底，共面波导的衰减特性与在化合物半导体衬底上形成的共面波导的衰减特性相当。

    Schemes for controlling optical signals in optically functional waveguide structures
    173.
    发明授权
    Schemes for controlling optical signals in optically functional waveguide structures 失效
    用于控制光功能波导结构中光信号的方案

    公开(公告)号：US07215851B2

    公开(公告)日：2007-05-08

    申请号：US11268316

    申请日：2005-11-07

    Applicant: David W. Nippa ,  Richard W. Ridgway ,  Steven M. Risser ,  Dirk Schoellner ,  Louis P. Vassy

    Inventor： David W. Nippa ,  Richard W. Ridgway ,  Steven M. Risser ,  Dirk Schoellner ,  Louis P. Vassy

    IPC: G02B6/26 ,  G02B6/42

    CPC classification number: G02F1/065 ,  G02B6/122 ,  G02F2201/06 ,  G02F2201/127 ,  G02F2202/022 ,  G02F2203/06 ,  G02F2203/48 ,  G02F2203/50

    Abstract: Methods of attenuating, delaying the phase, and otherwise controlling an optical signal propagating along a waveguide are provided. According to one method, a variable optical attenuator structure is provided comprising a waveguide core, a cladding, an electrooptic polymer, and a set of control electrodes. The core, the cladding, and the electrooptic polymer are configured such that an increase in the index of refraction of the polymer causes a substantial portion of an optical signal propagating along the waveguide core to couple into a relatively high index region of the electrooptic polymer above the waveguide core, so as to inhibit return of the coupled signal to the waveguide core. Another embodiment of the present invention introduces a phase delay in the coupled optical signal and permits return of the coupled signal to the waveguide core. An additional embodiment contemplates the use of a ridge waveguide structure to enable control of the optical signal. Additional embodiments are disclosed and claimed.

    Abstract translation: 提供衰减，延迟相位以及以其它方式控制沿着波导传播的光信号的方法。 根据一种方法，提供了包括波导芯，包层，电光聚合物和一组控制电极的可变光衰减器结构。 芯，包层和电光聚合物被配置为使得聚合物的折射率的增加导致沿着波导芯传播的光信号的大部分耦合到上述电光聚合物的相对高的折射率区域 波导芯，以便抑制耦合信号返回到波导芯。 本发明的另一实施例引入耦合的光信号中的相位延迟并允许耦合信号返回到波导芯。 附加实施例考虑使用脊波导结构来实现光信号的控制。 公开并要求保护附加实施例。

    Optical I/O chip for use with distinct electronic chip
    175.
    发明申请
    Optical I/O chip for use with distinct electronic chip 审中-公开
    用于独特电子芯片的光学I / O芯片

    公开(公告)号：US20060024067A1

    公开(公告)日：2006-02-02

    申请号：US10901828

    申请日：2004-07-28

    Applicant: Elisabeth Koontz

    Inventor： Elisabeth Koontz

    IPC: H04B10/04

    CPC classification number: G02B6/43 ,  G02F1/025 ,  G02F2201/06 ,  H01L31/12

    Abstract: Generally, an embodiment of the present invention provides an optical input/output (I/O) chip that is fabricated separately and distinctly from an electrical integrated circuit chip having core circuitry thereon. The electronic and optical I/O chips are later electrically connected (e.g., using packing technology) to form a hybrid optical-electronic chip system that utilizes optical I/O components on the optical I/O chip to communicate at least some of the I/O signals into and out of the electrical integrated circuit on the distinct electronic chip.

    Abstract translation: 通常，本发明的实施例提供了与其上具有核心电路的电集成电路芯片分离制造的光输入/输出（I / O）芯片。 电子和光学I / O芯片随后电连接（例如，使用打包技术）以形成混合光电子芯片系统，其利用光学I / O芯片上的光学I / O组件来通信至少一些I / O信号进入和离开不同电子芯片上的电气集成电路。

    CASCADED RESONATORS PHOTON PAIR SOURCE
    177.
    发明公开
    CASCADED RESONATORS PHOTON PAIR SOURCE 审中-公开

    公开(公告)号：US20240231181A9

    公开(公告)日：2024-07-11

    申请号：US18383415

    申请日：2023-10-24

    Applicant: Psiquantum, Corp.

    Inventor： Mihai Dorian Vidrighin ,  Dylan Saunders

    IPC: G02F1/35 ,  G02F1/365

    CPC classification number: G02F1/3526 ,  G02F1/3536 ,  G02F1/365 ,  G02F2201/06

    Abstract: A frequency conversion system includes a bus waveguide, a first pump laser coupled to the bus waveguide and characterized by a first frequency, a second pump laser coupled to the bus waveguide and characterized by a second frequency, an input light combining device coupled to the bus waveguide and configured to combine light from the first pump laser and the second pump laser to produce a combined light, and a plurality of optical resonators coupled to the bus waveguide. Each optical resonator of the plurality of optical resonators has a respective resonance line width, wherein for each optical resonators of the plurality the respective resonance line width overlaps with a resonance line width of at least one adjacent optical resonator of the plurality of optical resonators, and wherein each optical resonator of the plurality is configured to generate output light at a converted frequency via frequency mixing.

    PROGRAMMABLE TWO-DIMENSIONAL SIMULTANEOUS MULTI-BEAM OPTICALLY OPERATED PHASED ARRAY RECEIVER CHIP AND MULTI-BEAM CONTROL METHOD
    179.
    发明公开
    PROGRAMMABLE TWO-DIMENSIONAL SIMULTANEOUS MULTI-BEAM OPTICALLY OPERATED PHASED ARRAY RECEIVER CHIP AND MULTI-BEAM CONTROL METHOD 审中-公开

    公开(公告)号：US20230291483A1

    公开(公告)日：2023-09-14

    申请号：US18197751

    申请日：2023-05-16

    Applicant: ZHEJIANG LAB

    Inventor： Qiang ZHANG ,  Hui YU

    IPC: H04B10/60 ,  G02F1/295 ,  G02F1/31 ,  G02F1/313

    CPC classification number: H04B10/60 ,  G02F1/2955 ,  G02F1/311 ,  G02F1/3131 ,  G02F2202/10 ,  G02F2201/307 ,  G02F2203/70 ,  G02F2201/06 ,  G02F2201/205 ,  G02F2203/58

    Abstract: A programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip is manufactured based on silicon-on-insulator (SOI) and indium phosphide (InP) semiconductor manufacturing processes, including the SiN process. The InP-based semiconductor is used for preparing a laser array chip and a semiconductor optical amplifier array chip, the SiN is used for preparing an optical power divider, and the SOI semiconductor is used for preparing a silicon optical modulator, a germanium-silicon detector, an optical wavelength multiplexer, a true delay line, and other passive optical devices. The whole integration of the receiver chip is realized through heterogeneous integration of the InP-based chip and the SOI-based chip. Simultaneous multi-beam scanning can be realized through peripheral circuit programming control. The chip not only can realize two-dimensional multi-beam scanning, but also has strong expansibility, such that the chip can be used for ultra-wideband high-capacity wireless communication and simultaneous multi-target radar recognition systems.

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