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公开(公告)号：JP2010111744A
公开(公告)日：2010-05-20
申请号：JP2008284440
申请日：2008-11-05
Inventor： ONO KAZUHISA
IPC: C08L101/10 , C09D7/12 , C09D123/26 , C09D167/00 , C09D171/00 , C09D201/10 , C09J11/06 , C09J123/26 , C09J157/00 , C09J167/00 , C09J171/00 , C09J201/10 , C09K3/10
Abstract: PROBLEM TO BE SOLVED: To provide a room temperature curable composition having a silicon-functional group-containing polymer that cures at room temperature, has enough curing speed, and shows good depth curability and adhesion.
SOLUTION: This room temperature curable composition includes (A) 100 pts.wt. of a silicon-functional group-containing polymer having at least one silicon-functional group selected from among a hydroxy group and a hydrolyzable group, as well as (B) 0.0001-2 pts.wt., equivalent in metals, of a curing catalyst selected from among a platinum containing compound, a rhodium containing compound, an iridium containing compound, and a palladium containing compound.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供具有在室温下固化的含硅官能团的聚合物的室温固化性组合物，具有足够的固化速度，并且显示出良好的深度固化性和粘合性。 解决方案：该室温固化性组合物包含（A）100重量份 具有至少一个选自羟基和可水解基团的硅官能团的含硅官能团的聚合物，以及（B）0.0001-2重量份的金属当量的固化催化剂 选自含铂化合物，含铑化合物，含铱化合物和含钯化合物。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2010084063A
公开(公告)日：2010-04-15
申请号：JP2008256382
申请日：2008-10-01
Inventor： ONO KAZUHISA
Abstract: PROBLEM TO BE SOLVED: To provide a dealcoholization type room temperature-curable organopolysiloxane composition excellent in curability, and giving an adhesive rubber with high strength and high modulus, and excellent in moisture resistance and warm water resistance. SOLUTION: This room temperature-curable organopolysiloxane composition comprises (A) 100 pts.wt. of polyorganosiloxane with molecular chain terminals blocked by a hydroxy- or alkoxysilyl-group and having 50-100,000 mPa s viscosity at 23°C; (B) 3-500 pts.wt. of an inorganic filler; (C) 0.1-20 pts.wt. of a specific long-chain alkyl group-containing siloxane compound; and (D) 0.001-10 pts.wt. of a curing catalyst. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供固化性优异的脱醇型室温可固化的有机基聚硅氧烷组合物，并提供高强度和高模量的粘合橡胶，并且具有优异的耐湿性和耐温水性。 解决方案：该室温可固化的有机聚硅氧烷组合物包含（A）100重量份 分子链末端被羟基或烷氧基甲硅烷基封端并在23℃下具有50-100,000mPa·s粘度的聚有机硅氧烷; （B）3-500重量份 的无机填料; （C）0.1-20重量份 的特定长链烷基的硅氧烷化合物; 和（D）0.001-10重量份 的固化催化剂。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2010043282A
公开(公告)日：2010-02-25
申请号：JP2009255904
申请日：2009-11-09
Inventor： TABEI SHINGO , IIDA ISAO
Abstract: PROBLEM TO BE SOLVED: To maintain low viscosity as liquid rubber composition while giving good conductivity in a conductive liquid silicone rubber composition containing carbon black as a conductive material. SOLUTION: The conductive liquid silicone rubber composition includes (A) 100 pts.mass of polyorganosiloxane having a polymerization degree of 100 to 2,000; (B) 0.5-30 pts.mass of silicone oil having a monovalent group (R 2 group) selected from an aryl group and an aralkyl group, having a 2C or more alkyl group as a side chain group when the R 2 group is an aryl group, further having a polymerization degree of 5 to 1,000, and containing at least 5 mol% of an SiO unit having the R 2 group; (c) 5-100 pts.mass of carbon black; and (D) a necessary amount of a curing agent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：在含有炭黑作为导电材料的导电性液体硅橡胶组合物中，同时给予良好的导电性，以保持低粘度作为液体橡胶组合物。 导电性液体硅橡胶组合物包含（A）100聚合度为100〜2000的聚有机硅氧烷的100质量份; （B）具有选自具有2C个或更多个烷基作为侧链基团的芳基和芳烷基的具有一价基团（R
2 基团）的0.5-30重量份的硅油 当R 2 基团为芳基时，聚合度为5〜1000，含有至少5摩尔％的具有R SP SP 2基团的SiO单元 ; （c）5-100磅碳黑; 和（D）必需量的固化剂。 版权所有（C）2010，JPO＆INPIT -
公开(公告)号：JP2009249523A
公开(公告)日：2009-10-29
申请号：JP2008100104
申请日：2008-04-08
Inventor： TANIGAWA EIJI
Abstract: PROBLEM TO BE SOLVED: To provide a sealing composition which is excellent in thixotropic properties, hardly slumps and is excellent in preservation stability at high temperature and the slump resistance or the like of which is not deteriorated.
SOLUTION: The curable polyurethane sealing composition includes a urethane prepolymer containing an isocyanate group and an inorganic filler having 100-400 m
2 /g BET specific surface area but does not contain a curing catalyst. The urethane prepolymer containing the isocyanate group is obtained by reacting polyether polyol (A) comprising polyoxyalkylene diol (a1) having 2,000-10,000 Mw (weight-average molecular weight) and polyoxyalkylene triol (a2) having 300-900 Mw, polyoxyalkylene polyol (B) having 300-4,000 Mw, and a compound having the isocyanate group. A gasket is formed by curing the curable polyurethane sealing composition.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种触变性优异，几乎不塌陷且在高温下的保存稳定性优异，防塌陷性等不劣化的密封组合物。 解决方案：可固化聚氨酯密封组合物包含含异氰酸酯基团的氨基甲酸酯预聚物和BET比表面积为100-400m 2 / SP / g的无机填料，但不含固化催化剂。 含有异氰酸酯基的氨基甲酸酯预聚物通过使具有2,000-10,000Mw（重均分子量）的聚氧化烯二醇（a1）和300-900Mw的聚氧亚烷基三醇（a2）的聚醚多元醇（A）与聚氧化烯多元醇（B ）和具有异氰酸酯基的化合物。 通过固化可固化的聚氨酯密封组合物形成垫圈。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009149736A
公开(公告)日：2009-07-09
申请号：JP2007327488
申请日：2007-12-19
Inventor： ROO GEORGE CHII YUU , HOSHINO CHISATO , HIRAI NOBUO
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a composition which has a low viscosity suitable for the potting of electronic parts and which, after cured, forms a silicone gel having a low density and a high heat conductivity. SOLUTION: The heat-conductive silicone composition contains (A) 100 pts.wt. of a polyorganosiloxane which has on an average ≥0.1 of an alkenyl group bonded with a silicon atom in one molecule; (B) a polyorganohydrogensiloxane having in one molecule two or more hydrogen atoms bonded with silicon atoms, in an amount for the hydrogen atoms in this component to make 0.1-4.0 per the alkenyl group in the component (A); (C) a catalytic amount of a platinum-based catalyst; and (D) boron nitride having an average particle size of 20-180 μm, in an amount to make 30-60 wt.% of the total composition. The composition has a viscosity of 0.5-10 Pa s (23°C). COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种适用于电子部件灌封的低粘度的组合物，其在固化后形成具有低密度和高导热性的硅凝胶。 导热硅氧烷组合物含有（A）100重量份 的一个分子中平均具有与硅原子键合的烯基≥0.1的聚有机硅氧烷; （B）在一个分子中具有与硅原子键合的两个或多个氢原子的聚有机氢硅氧烷，该组分中的氢原子的量使得组分（A）中的烯基为0.1-4.0; （C）催化量的铂系催化剂; 和（D）平均粒径为20-180μm的氮化硼，其量为总组合物的30-60重量％。 该组合物的粘度为0.5-10Pa·s（23℃）。 版权所有（C）2009，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2009144024A
公开(公告)日：2009-07-02
申请号：JP2007321531
申请日：2007-12-13
Inventor： MATSUKURA TOSHIHIKO , IIJIMA HIROYOSHI , TAGAI HIDEFUMI
Abstract: PROBLEM TO BE SOLVED: To provide a flame-retardant silicone rubber composition which is excellent in flame retardance and maintains physical properties inherent in silicone rubber as they are. SOLUTION: The flame-retardant silicone rubber composition is obtained by adding a platinum complex in an amount of 0.1-1,000 ppm expressed in terms of platinum element based on 100 pts.wt. of a thermosetting polyorganosiloxane composition, wherein the platinum complex is solid at ordinary temperature and pressure, and the temperature at which the weight loss rate becomes higher than 50 wt.% is ≥300°C, as measured with a thermogravimetric analyzer. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供阻燃性优异的硅酮橡胶固有的物理性能的阻燃性硅橡胶组合物。 解决方案：阻燃性硅橡胶组合物通过以铂重量百分比表示的铂金配合物的添加量为0.1-1,000ppm而获得。 的热固性聚有机硅氧烷组合物，其中铂络合物在常温常压下为固体，并且用热重分析仪测量的重量损失率高于50重量％的温度为≥300℃。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2008078106A
公开(公告)日：2008-04-03
申请号：JP2006320935
申请日：2006-11-29
Inventor： FUJIMURA KENSUKE , MIYAHARA AKIRA , HIGUCHI TAKASHI
CPC classification number: H01L21/67103 , H05B3/143
Abstract: PROBLEM TO BE SOLVED: To provide an assembly for adjusting a temperature of a heating target such as a semiconductor substrate, a metal/ceramic mold or other heating targets such as degassing and annealing which needs a temperature adjustment and for supporting the heating target.
SOLUTION: In an application example, the assembly is composed of a heating target supporting body to support the heating target, a ceramic heating body to heat the heating target at least up to a temperature of 300°C, a first heat conductive layer arranged between a substrate supporting body and the ceramic heating layer and a second layer arranged below the ceramic heating layer. In a heater assembly, both of the first layer and the second layer have an elastic modulus of 5 GPa or less and supply continuously a uniform and excellent heating to the substrate and energize the ceramic heating layer without damaging the ceramic layer.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种用于调节诸如半导体衬底，金属/陶瓷模具或诸如脱气和退火的其它加热靶的加热靶的温度的组件，其需要温度调节并用于支撑加热 目标。 解决方案：在应用实例中，组件由加热靶支撑体构成以支撑加热靶，陶瓷加热体至少加热到300℃的温度加热加热靶，第一导热 布置在基板支撑体和陶瓷加热层之间的层，以及布置在陶瓷加热层下方的第二层。 在加热器组件中，第一层和第二层都具有5GPa或更小的弹性模量，并且连续地向衬底提供均匀和优异的加热并激励陶瓷加热层而不损坏陶瓷层。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008071728A
公开(公告)日：2008-03-27
申请号：JP2006323731
申请日：2006-11-30
Inventor： GIDDINGS ROBERT ARTHUR , D EVELYN MARK PHILIP , DEY SUBHRAJIT , BADDING BRUCE JOHN , ZENG LARRY QIANG
Abstract: PROBLEM TO BE SOLVED: To provide a heater that may include an outer housing and an inner tube. SOLUTION: The inner tube is in a coaxial relation to and within the outer housing. An inward facing surface of the inner tube defines a volume sufficient to receive a reaction capsule, and the outward facing surface is radially spaced from an inward facing surface of the outer housing sufficient to define a gap. A filler material is disposed within the gap. The filler material responds to pressure such that the filler volume is reduced by less than 5 volume percent at the pressure greater than 500 MPa and at the temperature greater than 500°C. One or more heating elements are disposed in the gap. The heating elements are in thermal communication with the inner tube. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供可以包括外壳和内管的加热器。
解决方案：内管与外壳内同轴关系。 内管的面向内的表面限定足以容纳反应胶囊的体积，并且面向外的表面与外壳的面向内的表面径向间隔开，足以限定间隙。 填充材料设置在间隙内。 填充材料响应于压力，使得在大于500MPa的压力和大于500℃的温度下，填料体积减少小于5体积％。 一个或多个加热元件设置在间隙中。 加热元件与内管热连通。 版权所有（C）2008，JPO＆INPIT
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189.发明专利
公开(公告)号：JP2008057771A
公开(公告)日：2008-03-13
申请号：JP2007181187
申请日：2007-07-10
Inventor： STUDENT JOERG , SUN RICKSON , YOM-TOV OPHER , LELONIS DONALD , HANS PAUL , MARCHIANDO ROBERT , KLUG JENNIFER , SHAFFER GREGORY W
CPC classification number: C23C30/00 , F16B33/06 , F16L15/001
Abstract: PROBLEM TO BE SOLVED: To provide a seizure preventive method for easily fixing a fastener to an assembly.
SOLUTION: For example, a nail driven by a hammer, or a threaded nail or a screw screwed in a shaft joint, a nut or a building block, is cited as the fastener. In one embodiment, a composition includes a sufficient quantity of boron nitride to be applied to a contact surface of the fastener, and the fastener can be quickly fixed without causing seizure and/or frictional wear. An effective quantity of boron nitride powder composition is also applied to the contact surface of the fastener, that is, the pointed tip or a thread surface of a shaft part.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种用于容易地将紧固件固定到组件上的防止咬住的方法。 解决方案：例如，被锤子驱动的钉子，或螺纹钉或拧在轴接头中的螺钉，螺母或构件被引用作为紧固件。 在一个实施方案中，组合物包含足够量的氮化硼以施加到紧固件的接触表面，并且紧固件可以快速固定而不引起卡住和/或摩擦磨损。 有效量的氮化硼粉末组合物也施加到紧固件的接触表面，即尖端或轴部分的螺纹表面。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008001587A
公开(公告)日：2008-01-10
申请号：JP2006320937
申请日：2006-11-29
Inventor： MORIKAWA YUJI , KAWASAKI KAZUO , HWANG SUN-JOONG , SCHAEPKENS MARC
CPC classification number: C30B15/00 , B22D7/00 , B22D33/00 , C30B23/066 , C30B25/02 , C30B35/00 , Y10S117/90 , Y10T117/10 , Y10T117/1016 , Y10T117/1064
Abstract: PROBLEM TO BE SOLVED: To provide a unibody, multi-piece crucible for use in elemental purification, compounding, and growth of semiconductor crystals, e.g., in the process of molecular beam epitaxy (MBE) for melting silicon or the like at high temperature. SOLUTION: The crucible has an outer coating layer that fixedly joins the multi pieces making up the crucible. The invention also provides a method for making a unibody containing a structure comprising pyrolytic boron nitride having a negative draft, which method obviates the need of complicated overhang structure of graphite mandrels or the removal of the graphite mandrels by burning at high temperatures. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供用于半导体晶体的元素纯化，配混和生长的单体，多件式坩埚，例如在用于熔化硅等的分子束外延（MBE）的过程中 高温。 解决方案：坩埚具有固定连接构成坩埚的多块的外涂层。 本发明还提供一种制备含有包含具有负牵伸的热解氮化硼的结构的单体的方法，该方法避免了石墨心轴的复杂突出结构或通过在高温下燃烧而去除石墨心轴的需要。 版权所有（C）2008，JPO＆INPIT
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