公开(公告)号：US20170108649A1

公开(公告)日：2017-04-20

申请号：US15246925

申请日：2016-08-25

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: G02B6/27 ,  G02F1/09 ,  G02F1/00 ,  G02B6/126

CPC classification number: G02B6/2746 ,  G02B5/3058 ,  G02B6/105 ,  G02B6/126 ,  G02B6/26 ,  G02B6/2726 ,  G02B6/2766 ,  G02B2006/12061 ,  G02F1/0036 ,  G02F1/093

Abstract: An integrated non-reciprocal polarization rotator comprises a substrate, a Faraday crystal, a first waveguide, and a second waveguide. The substrate has a recess extending to a predetermined depth. The Faraday crystal is mounted in the recess and optically coupled with the first waveguide and the second waveguide.

公开(公告)号：US20170090118A1

公开(公告)日：2017-03-30

申请号：US15262937

申请日：2016-09-12

Applicant: Skorpios Technologies, Inc.

Inventor： Majid Sodagar ,  Murtaza Askari ,  Guoliang Li

IPC: G02B6/14 ,  G02B6/122

CPC classification number: G02B6/14 ,  G02B5/20 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/262 ,  G02B2006/12035 ,  G02B2006/12097 ,  G02B2006/12109 ,  G02F1/3501 ,  G02F1/365 ,  G02F2001/3509

Abstract: An optical filter for attenuating higher-order modes in an optical waveguide includes a shoulder slab formed of a first material having a first index of refraction and disposed on a second material having a second index of refraction, the first index of refraction being higher than the second index of refraction. The shoulder slab defines a near end having a first width, an intermediate section, adjacent to the first end section, and a far end section, adjacent to the intermediate section and opposite the first end section along a direction of beam propagation. The optical filter also includes a waveguide ridge, formed of the first material and disposed atop the shoulder slab, that traverses the shoulder slab, and is configured to guide light of a fundamental mode along the direction of beam propagation from the near end section to the far end section.

公开(公告)号：US09531159B2

公开(公告)日：2016-12-27

申请号：US14642415

申请日：2015-03-09

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Nikhil Kumar

IPC: G02B6/12 ,  H01S5/12 ,  G02B6/125 ,  H01S3/03 ,  H01S3/063 ,  H01S3/067 ,  H01S3/08 ,  H01S3/10 ,  H01S3/1055 ,  H01S5/06 ,  H01S5/30 ,  H01S5/0683 ,  H01S5/14 ,  G02B6/122 ,  H01S5/02 ,  H01S5/10

CPC classification number: H01S5/12 ,  G02B6/1228 ,  G02B6/125 ,  G02B2006/12097 ,  G02B2006/12147 ,  H01S3/0315 ,  H01S3/063 ,  H01S3/0635 ,  H01S3/0675 ,  H01S3/08009 ,  H01S3/1003 ,  H01S3/1055 ,  H01S5/021 ,  H01S5/0612 ,  H01S5/0683 ,  H01S5/1032 ,  H01S5/1218 ,  H01S5/1234 ,  H01S5/141 ,  H01S5/3013

Abstract: An optical, directional coupler has a first input, a second input, a first output, and a second output. The coupler is made with a shoulder disposed on a substrate and a first ridge and a second ridge disposed on the shoulder. The first ridge extends from the first input to the first output. The second ridge extends from the second input to the second output. The shoulder, the first ridge, and the second ridge taper to provide coupling and are modified to select a coupling ratio.

Abstract translation: 光学定向耦合器具有第​​一输入，第二输入，第一输出和第二输出。 耦合器由设置在基板上的肩部和设置在肩部上的第一脊部和第二脊部制成。 第一个脊从第一个输入延伸到第一个输出。 第二脊从第二输入延伸到第二输出。 肩部，第一脊和第二脊锥形以提供联接并被修改以选择耦合比。

公开(公告)号：US09465163B2

公开(公告)日：2016-10-11

申请号：US14642429

申请日：2015-03-09

Applicant: Skorpios Technologies, Inc.

Inventor： Nikhil Kumar ,  Guoliang Li

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/14 ,  G02F1/35 ,  G02B5/20 ,  G02F1/365

CPC classification number: G02B6/122 ,  G02B5/20 ,  G02B6/14 ,  G02B2006/12109 ,  G02F1/3501 ,  G02F1/365 ,  G02F2001/3509

Abstract: A high-order-mode (HOM) filter for thick silicon waveguides has a shoulder slab, a waveguide ridge, a first filter ridge, and a second filter ridge. The first filter ridge and the second filter ridge help attenuate higher-order modes from the waveguide ridge while the waveguide ridge guides a fundamental mode.

Abstract translation: 用于厚硅波导的高阶模（HOM）滤波器具有肩板，波导脊，第一滤光片和第二滤光片。 第一滤波器脊和第二滤波器脊有助于衰减来自波导脊的高阶模，而波导脊引导基模。

公开(公告)号：US20160248516A1

公开(公告)日：2016-08-25

申请号：US15048222

申请日：2016-02-19

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/556 ,  H04B10/079 ,  H04J14/02 ,  H04B10/564

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号，并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分，在BPSK调制器的第二臂处接收第二部分，向BPSK调制器的第一臂应用第一音调，并向第 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率，并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

公开(公告)号：US20160133496A1

公开(公告)日：2016-05-12

申请号：US14933694

申请日：2015-11-05

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： Damien Lambert ,  John Spann ,  Stephen Krasulick

IPC: H01L21/683 ,  H01L21/027 ,  H01L23/00

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract translation: 使用具有顺应性树脂的转印衬底将一个或多个芯片结合到目标晶片。 植入区域形成在转印衬底中。 转印衬底的一部分被蚀刻以形成提升器。 将合适的材料施加到转印基板上。 芯片被固定到柔性材料上，其中芯片被固定到提升管上方的柔性材料。 当芯片固定到顺应性材料时，芯片被结合到目标晶片。 从芯片上去除转印衬底和柔顺材料。 转印衬底对UV光是不透明的。

公开(公告)号：US20160111407A1

公开(公告)日：2016-04-21

申请号：US14862435

申请日：2015-09-23

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick

IPC: H01L25/00 ,  H01L21/84 ,  H01L21/74 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: A multilayer semiconductor has stacks of composite semiconductor materials. Multiple composite devices are bonded on a silicon-on-insulator wafer forming an integrated device.

Abstract translation: 多层半导体具有堆叠的复合半导体材料。 多个复合器件结合在形成集成器件的绝缘体上硅晶片上。

公开(公告)号：US09316785B2

公开(公告)日：2016-04-19

申请号：US14509914

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/12 ,  G02B6/122 ,  H01S5/022 ,  H01S5/00

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。

公开(公告)号：US09287984B2

公开(公告)日：2016-03-15

申请号：US13722132

申请日：2012-12-20

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： Robert J. Stone ,  Amit Mizrahi

IPC: H04B10/40

CPC classification number: H04B10/40

Abstract: A transceiver includes an optical waveguide and a first filter optically coupled to the optical waveguide and operable to filter a first optical signal in a first wavelength band propagating downstream. A center wavelength of the first wavelength band is tunable. The transceiver also includes a first receiver optically coupled to the first filter and a second filter optically coupled to the optical waveguide and operable to filter a second optical signal in a second wavelength band propagating downstream. The second wavelength band is different from the first wavelength band. The transceiver further includes a second receiver optically coupled to the second filter to receive the second optical signal and a laser optically coupled to the optical waveguide and operable to output radiation in a third wavelength band propagating upstream. The third wavelength band is different from both the first wavelength band and the second wavelength band.

Abstract translation: 收发器包括光波导和光学耦合到光波导的第一滤光器，并且可操作以对在下游传播的第一波长带中的第一光信号进行滤波。 第一波长带的中心波长是可调谐的。 收发器还包括光耦合到第一滤波器的第一接收器和光耦合到光波导的第二滤波器，并且可操作以对在下游传播的第二波长带中的第二光信号进行滤波。 第二波长带与第一波长带不同。 收发器还包括光耦合到第二滤波器以接收第二光信号的第二接收器和与光波导光耦合的激光器，并可操作以输出在上游传播的第三波长带中的辐射。 第三波长带与第一波长带和第二波长带不同。

公开(公告)号：US20150364441A1

公开(公告)日：2015-12-17

申请号：US14741181

申请日：2015-06-16

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/30 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/04026 ,  H01L2224/05557 ,  H01L2224/05638 ,  H01L2224/1161 ,  H01L2224/13013 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13138 ,  H01L2224/136 ,  H01L2224/14131 ,  H01L2224/29017 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/3003 ,  H01L2224/3012 ,  H01L2224/32145 ,  H01L2224/32147 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/8301 ,  H01L2224/83012 ,  H01L2224/83048 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/83902 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: Micro pillars are formed in silicon. The micro pillars are used in boding the silicon to hetero-material such as III-V material, ceramics, or metals. In bonding the silicon to the hetero-material, indium is used as a bonding material and attached to the hetero-material. The bonding material is heated and the silicon and the hetero-material are pressed together. As the silicon and the hetero-material are pressed together, the micro pillars puncture the bonding material. In some embodiments, pedestals are used in the silicon as hard stops to align the hetero-material with the silicon.

Abstract translation: 微柱形成在硅中。 微柱用于将硅掺入诸如III-V材料，陶瓷或金属的异质材料中。 在将硅键合到异质材料时，使用铟作为结合材料并附着到异质材料上。 加热接合材料，并将硅和异质材料压在一起。 当硅和异质材料被压在一起时，微柱刺穿接合材料。 在一些实施例中，在硅中使用基座作为硬止动器以使异质材料与硅对准。