Abstract:
Defective or missing solder bumps (18) on a surface (13) of an article (10) such as a chip carrier are detected by first illuminating the surface with dark field illumination. Next, the image of the surface of the article is captured, typically by a television camera (30). The captured image is processed to detect defects by first creating a window (57) in the image about each group of solder bumps and then creating a bounding box (58) about each bump in each window. Each of a set of attributes, including: the number, size and location of the windows, the size location and number of boxes in each window, and the dimensions, shape and brightness of the image in each box, is measured. The value of each attribute is compared to a reference value, representing the value of the attribute when no defects are present. If the attribute differs by more than a predetermined tolerance for its reference value, than a particular defect is prevent. Verification of certain defects may be accomplished by repeating the above-described process using bright field illumination.
Abstract:
An engineered lighting system for use in an inspection system is comprised of an array of light emitting diodes. A specimen is brought into the viewing area, and a current pulse is provided to the diodes of the array to selectively flash all or a portion of the diodes of the array. Reflected light from the specimen is sensed and a digitized image is generated therefrom. An illumination level of the digitized image is adjustable, in whole or in part, by varying the effective lighting intensity of one or more of the diodes of the array during a flash period. The digitized image of the specimen is compared to data indicative of acceptability of the specimen, and acceptance or rejection of the specimen is decided on a basis of a comparison therebetween.
Abstract:
A method and apparatus for detecting through-hole voids in a multi-layer printed circuit board. The through-hole is formed with an electrical conductor for interconnecting wiring patterns of upper layers and wiring patterns of lower layers of the printed wiring board and is illuminated with a beam having a wavelength falling within a specified wavelength band capable of exciting an luminescent beam from a layer material. The layer material is exposed by a through-hole void in the through-hole of the printed wiring board. The luminescent beam excited by the illumination beam impinging upon the layer material by way of the through-hole void in the through-hole is focussed by means of a focussing optical system and a photoelectric converter. The photoelectric converter converts the luminescent beam into an electrical signal. The presence of a through-hole void is indicated by the electrical signal.
Abstract:
An inspection method and apparatus for searching a fabric in strip form to find lump type and void type flaws on both faces of the fabric. Strobes and image pickup elements are arranged at opposite sides of the fabric in transportation. The strobes at one side of the fabric are caused to emit light, and the image pickup elements at the same side detect light reflected by the fabric while the image pickup elements at the other side detect light passing through the fabric.
Abstract:
PURPOSE: A device for inspecting crystallization is provided to minimize time and efforts required for the crystallization inspection and to enhance the accuracy of the inspection. CONSTITUTION: A device for inspecting crystallization comprises a body, a cover, a specimen container rotating unit(130), a heater(140), and a photographing member(150). The body comprises a mounting unit where the specimen container is fitted in. The over is joined to be slid in a horizontal direction for opening/closing the top of the body. The specimen container rotating unit rotates the mounting unit for the rotation of the specimen container. The heater is installed in the body to supply heat to the specimen container. The photographing member obtains images of a specimen with respect to the specimen container.
Abstract:
PURPOSE: A pipe probing apparatus is provided to easily adjust a position of a camera according to the size of the pipe by attaching the camera to a running member for moving forward and backward in a cylindrical pipe. CONSTITUTION: A pipe apparatus includes a running member for moving forward and backward in a cylindrical pipe while pulling a cable and a camera having a lens. The pipe apparatus arranges the camera and a link appliance on the running member by using a lifting adjustment unit. The link appliance integrally lifts the camera and a radar device(8) positioned at the upper part of the camera. The pipe apparatus includes arm members which individually lift the radar device. The lifting adjustment unit simultaneously lifts the camera and the radar device in a state in which the pivoting arm members are contracted. When the camera is positioned in the center of a pipe, the radar device has not abutted against an upper inner surface of the pipe but is located inside the pipe.
Abstract:
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously, a pH indicator is employed to monitor the dielectric fluid.
Abstract:
A method and device for automatically identifying a point of interest (e.g., the deepest or highest point) on a viewed object using a video inspection device. The method involves placing a first cursor on an image of the object to establish a first slice plane and first surface contour line, as well as placing another cursor, offset from the first cursor, used to establish an offset (second) slice plane and an offset (second) surface contour line. Profile slice planes and profile surface contour lines are then determined between corresponding points on the first surface contour line and the offset (second) surface contour line to automatically identify the point of interest.