公开(公告)号：US12025886B2

公开(公告)日：2024-07-02

申请号：US18092205

申请日：2022-12-30

Applicant: HKC CORPORATION LIMITED

Inventor： Hailong He ,  Haijiang Yuan

IPC: G02F1/1339 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1345

CPC classification number: G02F1/1339 ,  G02F1/13332 ,  G02F1/133354 ,  G02F1/133528 ,  G02F1/13452 ,  G02F2201/07 ,  G02F2202/28 ,  G02F2202/36

Abstract: The disclosure relates to a display panel, a method of manufacturing a display panel, and a display device. The display panel includes a first polarizer, an array substrate and a color film substrate that are sequentially stacked. The array substrate includes a binding region. A first sealing adhesive is filled between the binding region and the first polarizer, covers an end of a flexible circuit board away from a mainboard, and covers the binding region, which avoids using a decorative member, reduces a wide frame of a fourth side of the display panel, and increases a real frameless display effect.

公开(公告)号：US11903240B2

公开(公告)日：2024-02-13

申请号：US17851914

申请日：2022-06-28

Applicant: Wuhan Tianma Microelectronics Co., Ltd. ,  Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch

Inventor： Xingchen Qian

IPC: H10K50/844 ,  B32B3/04 ,  B32B5/18 ,  B32B7/14 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00 ,  G02F1/1333 ,  H10K71/00 ,  H10K50/84 ,  H10K50/842 ,  H10K59/131 ,  H10K59/12 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K50/844 ,  B32B3/04 ,  B32B5/18 ,  B32B7/14 ,  B32B37/12 ,  B32B37/18 ,  B32B38/0012 ,  G02F1/133305 ,  H10K71/00 ,  B32B2305/022 ,  B32B2457/206 ,  G02F2201/07 ,  G02F2201/50 ,  G02F2202/28 ,  H10K50/841 ,  H10K50/8426 ,  H10K59/1201 ,  H10K59/131 ,  H10K77/111 ,  H10K2102/311

Abstract: Provided are a display device and a preparation method thereof. The display device includes a first substrate, where the first substrate includes a display portion and a bending portion located on at least one side of the display portion; and a second substrate, where the second substrate and the first substrate are disposed opposite to each other, the second substrate includes a first region portion corresponding to the bending portion, and the bending portion is bent towards one side facing away from the second substrate. A protective layer is provided between the bending portion of the first substrate and the first region portion of the second substrate and the bending portion of the first substrate is bent towards one side of the second substrate.

公开(公告)号：US11901618B2

公开(公告)日：2024-02-13

申请号：US17929907

申请日：2022-09-06

Applicant: InnoLux Corporation

Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343 ,  G02F1/1333

CPC classification number: H01Q1/38 ,  G02F1/13439 ,  H01L21/045 ,  H01L27/1237 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/0407 ,  G02F1/133345 ,  G02F2201/07

Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

公开(公告)号：US11835751B2

公开(公告)日：2023-12-05

申请号：US17264027

申请日：2020-05-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiandong Meng ,  Jifeng Tan ,  Shuilang Dong ,  Wei Wang ,  Wenqu Liu ,  Wenqing Zhao ,  Qiuyu Ling ,  Xianqin Meng ,  Yishan Tian ,  Zhao Kang

IPC: G02F1/1335 ,  F21V8/00 ,  G02F1/1362 ,  G02F1/13357 ,  G02F1/1333

CPC classification number: G02B6/0093 ,  G02B6/0065 ,  G02F1/133357 ,  G02F1/133368 ,  G02F1/133512 ,  G02F1/133524 ,  G02F1/133615 ,  G02F1/136209 ,  G02F2201/07 ,  G02F2201/30 ,  G02F2201/50

Abstract: A display panel and a manufacturing method thereof, and a display device. The display panel includes a light guide plate, an array substrate, a liquid crystal layer between the light guide plate and the array substrate, a plurality of light-extracting gratings located on one side of a light exit surface of the light guide plate, and a transparent protection layer between a film layer where the light-extracting gratings are located and the light guide plate. The light guide plate includes a plurality of light-extracting port areas, and transparent areas besides the light-extracting port areas; each light-extracting port area is provided with one light-extracting grating; the protection layer is at least provided on the transparent areas, and the protection layer is configured to prevent the light guide plate in the transparent areas from being excessively etched to form a plurality of depressions.

公开(公告)号：US20230367155A1

公开(公告)日：2023-11-16

申请号：US18314135

申请日：2023-05-09

Applicant: Japan Display Inc.

Inventor： Yuta WAKABAYASHI ,  Yasuyuki HANAZAWA ,  Michikazu NOGUCHI ,  Hiromichi TANAKA

IPC: G02F1/1335 ,  G02F1/1333 ,  G02F1/1334 ,  G02F1/13357

CPC classification number: G02F1/133628 ,  G02F1/133331 ,  G02F1/133385 ,  G02F1/1334 ,  G02F1/133615 ,  G02F2201/07 ,  G02F1/133322 ,  G02F2203/01

Abstract: The following structure mitigates problems caused by heat generated by the LED and the driver IC. A liquid crystal display device including a liquid crystal display panel in which liquid crystal is sandwiched between a TFT substrate, having a pixel, and a counter substrate including: a display area being formed in an area in which the TFT substrate and the counter substrate overlap each other, a terminal area being formed on the TFT substrate, in which the counter substrate does not overlap, the terminal area being formed along a first side of the counter substrate which extends in a first direction, a second cover glass being disposed on the counter substrate, and a first cover glass being disposed under the TFT substrate, in which a width of the first cover glass in the first direction is larger than a width of the second cover glass in the first direction.

公开(公告)号：US11796847B2

公开(公告)日：2023-10-24

申请号：US17600321

申请日：2021-08-19

Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Yong Xu ,  Fei Ai

IPC: G02F1/1333 ,  G02F1/1362 ,  G02F1/1343 ,  H01L27/12 ,  H01L29/786 ,  H01L29/66

CPC classification number: G02F1/133345 ,  G02F1/133357 ,  G02F1/134309 ,  G02F1/136204 ,  H01L27/1222 ,  H01L27/1274 ,  H01L29/66757 ,  H01L29/78675 ,  G02F2201/07

Abstract: An array substrate, includes: a substrate, a first metal layer, a first buffer layer, and an active layer, a gate insulating layer, a second metal layer, a first insulating layer, a third metal layer and a first planarization layer. The first metal layer is electrically connected with the first doped area of the active layer through the bridge layer of the second metal layer. The third metal layer is electrically connected with the second doped area of the active layer. The array substrate of the present disclosure reduces a size of a thin film transistor by stacking the first metal layer, the second metal layer, and the third metal layer, thereby increasing pixel density. A display panel is also provided.

公开(公告)号：US20230266623A1

公开(公告)日：2023-08-24

申请号：US18098605

申请日：2023-01-18

Applicant: Beijing BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Xiujun CAI ,  Cuie WANG ,  Sa LI ,  Wenli LAN ,  Dong WANG ,  Dawei WANG

IPC: G02F1/13357 ,  F21V8/00 ,  H04M1/02

CPC classification number: G02F1/133608 ,  G02B6/0088 ,  G02B6/0053 ,  G02B6/0051 ,  G02B6/0055 ,  H04M1/0264 ,  H04M1/0266 ,  G02F2201/07

Abstract: The embodiments of the application provide a backlight module and a displaying device, relating to the technical field of display. The backlight module comprises a first support structure, an optical film material and a buffer structure; the first support structure is arranged on a side away from a light-outgoing side of the optical film material, and the first support structure and the optical film material have a through-hole; the buffer structure comprises a first buffer portion arranged in the through-hole, and a rigidity of the first buffer portion is less than a rigidity of the first support structure. The backlight module is internally provided with the buffer structure, and the first buffer portion in the buffer structure is arranged in the through-hole that penetrates through the first support structure and the optical film material.

公开(公告)号：US11693291B2

公开(公告)日：2023-07-04

申请号：US17169983

申请日：2021-02-08

Applicant: Fujitsu Optical Components Limited

Inventor： Shuntaro Makino ,  Yoshinobu Kubota ,  Yasuhiro Ohmori ,  Masaharu Doi ,  Shintaro Takeuchi

IPC: G02F1/225 ,  G02F1/03 ,  F21V8/00

CPC classification number: G02F1/225 ,  G02B6/0065 ,  G02F1/0316 ,  G02F2201/07

Abstract: An optical waveguide device has a substrate, an intermediate layer, a thin-film LN layer containing an X-cut lithium niobate, and a buffer layer stacked on the substrate, and an optical waveguide having a ridge shape formed in the thin-film LN layer. The optical waveguide device includes a plurality of electrodes provided, respectively, at a first side and a second side of the optical waveguide. The electrodes are disposed so that respective bottom surfaces thereof are at positions lower than a position of a surface of the buffer layer.

公开(公告)号：US10061428B2

公开(公告)日：2018-08-28

申请号：US15199307

申请日：2016-06-30

Applicant: SYNAPTICS INCORPORATED

Inventor： Petr Shepelev ,  Byunghwee Park

IPC: G06F3/041 ,  G06F3/044 ,  G02F1/1333 ,  G02F1/1368 ,  G02F1/1335

CPC classification number: G06F3/0416 ,  G02F1/13338 ,  G02F1/133514 ,  G02F1/1368 ,  G02F2201/07 ,  G02F2202/28 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04101 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04105

Abstract: The input devices described herein include force sensor electrodes that use capacitive sensing to measure the force with which an input object (e.g., a finger or stylus) presses down on the input device. To measure this force, the input device includes a compressible layer disposed between a backlight of a display in the input device and a cover window of the display. In one embodiment, the compressible layer is disposed between the backlight and a transparent thin-film transistor (TFT) layer in the display. In one embodiment, the compressible layer includes an air gap which has a thickness defined by adhesive material disposed on at least two edges of the display.

公开(公告)号：US09897825B2

公开(公告)日：2018-02-20

申请号：US15468115

申请日：2017-03-24

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Kei Katou ,  Norikazu Miyazaki ,  Ryo Shimizu

IPC: G02F1/01 ,  G02F1/03 ,  G02F1/035

CPC classification number: G02F1/0327 ,  G02F1/035 ,  G02F2201/07 ,  G02F2201/58

Abstract: An optical modulator includes a substrate having an electro-optic effect, an optical waveguide that is formed in the substrate, and a modulation electrode (not illustrated) for modulating a light wave that propagates through the optical waveguide. In the optical modulator, a light-receiving element is disposed on the substrate, and the light-receiving element includes a light-receiving section that receives a light wave that propagates through the optical waveguide, and the light-receiving section is located on the downstream side of a center of the light-receiving element in a light wave propagating direction.