Abstract:
PROBLEM TO BE SOLVED: To provide a lead-on paddle type semiconductor package wherein there is no problem in positional deviations and exposure of leads during molding operation and seal bubbles are not generated between the leads and a lead paddle. SOLUTION: The lead-on paddle type semiconductor package includes: a first surface 111; a second surface 112 opposed to the first surface 111; leads 110 of a plurality of lead frames having a plurality of side faces 113 between the first surface 111 and the second surface 112; a first chip 120 stuck to the first surface 111; a lead paddle 130 having a putting surface 131 and an exposed surface 132; an adhesive 140 for sticking the putting surface 131 to the second surface 112 and covering the side faces 113 to combine the lead puddle 130 to the lead 110 group of the lead frames; and a sealing body 150 for sealing off the first chip 120, the adhesive 140, portions of the lead 110 group of the lead frames and portions of the paddle 130 and exposing the exposed surface 132. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame which never causes a position shift due to inclination of a lead and improves wire bonding quality and adhesive strength of die attaching. SOLUTION: The lead frame 200 includes a plurality of leads 210, a branch piece 220, and a coupling bar 230, wherein the leads 210 is formed on a first plane 201 and the branch piece 220 is formed on a second plane 202, so that the branch piece 220 is lower, and a coupling bar 230 is formed between the first plane 201 and second plane 202. The coupling bar 230 has at least two or more folds, for example, a first fold 231A and a second fold 231B, and elastically couples the branch piece 220 and a circumferential lead 211. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for raising temperature of a chamber, and its heating device. SOLUTION: The method for raising the temperature of the chamber includes a process of heating air in the chamber, and a process of injecting dried air into the chamber to mix the injected air with hot air and exhausting wet air. At the same time, the heating device is provided to raise the temperature in the chamber in a short time, and the cost is effectively suppressed by creating an isothermal environment. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a jig for positioning a BGA package waiting for measurement. SOLUTION: The general-purpose jig for positioning the BGA (Ball Grid Array) waiting for measurement mainly includes: a net-type substrate 110, a latch 120 and a plurality of pins 130. The net-type substrate 110 has an element storing hole 111 and a pressurizing/measuring surface 112. A plurality of positioning holes arranged in a matrix and at equal intervals are disposed in the element storing hole 111. The latch 120 holds the BGA package for arranging it in the net-type substrate 110 and adjusting a solder ball group to a part of or whole positioning hole groups by one to one. The pins elastically project to a periphery of the pressuring/measuring surface 112 of the net-type substrate 110. Thus, the general-purpose jig positions the BGA packages of various specifications irrespective of a substrate size, and the number and arrangement of solder balls. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor POP device avoiding the rupture of a solder fine contact during semiconductor lamination. SOLUTION: The semiconductor POP device 200 principally includes semiconductor packages 210 and 220 having a plurality of solder fine contacts and solder materials 230 for soldering and connecting the solder fine contacts. The semiconductor packages 210 and 220 have substrates 211 and 221 and chips 212 and 222 placed on the substrates, respectively. The solder fine contacts of the lower semiconductor package 210 are disposed at a plurality of upper-layer bumps 213 on a top surface 211A of the substrate 211, and the solder fine contacts of the upper semiconductor package 220 are disposed at a plurality of lower-layer bumps 223 on the reverse surface 221B of the substrate 221. The group of lower-layer bumps 223 are aligned with the group of upper-layer bumps 213 so that the group of upper-layer bumps 213 and the group of lower-layer bumps 223 are joined together with the solder materials 230, and they are equally soldered together. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an LGA mounting-type electronic product which can avoid scratches and collisions of a metal pad group or a solder bonding layer. SOLUTION: An LGA semiconductor mounting structure 200 is provided with a substrate 210, a chip 220, the solder bonding layer 230 and a foot stand 240. The substrate 210 has an upper surface 211 and a lower surface 212. A plurality of metal pads 213 are arranged on the lower surface 212 into an array shape. The chip 220 is installed on the upper surface 211 of the substrate 210 and is electrically connected to the metal pads 213. The solder bonding layer 230 is arranged in the metal pad group 213 and has first thickness which slightly projects to the lower surface 212 of the substrate 210. The foot stand 240 is disposed below the substrate 210 and has second thickness projecting to the lower surface 212 of the substrate, and Second thickness becomes thicker than first thickness. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a shared-substrate that can substantially shorten the amount of time required for re-designing and manufacturing substrate wiring. SOLUTION: The shared-substrate has multiple inscribed pads 311, 312 and 313 and circumscribed pads 321, 322 and 323, wherein all the inscribed pads 311, 312 and 313 are electrically connected to the cluster of the circumscribed pads 321, 322 and 323, and to allow a fuse to be blown arbitrarily, multiple branched interconnections 330 and multiple fuses F1, F2, F3, F4, F5, F6, F7, F8, F9, F10, F11 and F12 serially connected to these branched interconnections 330 are formed on one surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a BGA type package structure for preventing oveflow of mold sealant. SOLUTION: The BGA type package structure includes a substrate 310 having an upper surface 311, a lower surface 312, and a hole, a chip 320 mounted on the upper surface 311 and having a plurality of bonding pads for aligning the hole, a plurality of bonding wires for connecting a bonding pad group electrically with the substrate 310 through the hole, a mold sealant 340 having a right cube 341 formed on the upper surface 311 and sealing the chip 320 hermetically and at least one long cube 342 formed in the hole 313 and at a part of the lower surface 312 and sealing the bonding pad group hermetically, and a plurality solder balls 350 arranged on the lower surface 312 wherein a small mouth 316 is formed closely to the hole on the substrate 310 and since the diameter of the small mouth 316 becomes narrower than the average diameter of the hole, speed of the mold sealant 340 flowing around the hole can be moderated. COPYRIGHT: (C)2008,JPO&INPIT