Abstract:
An optical device (110) has a substrate (101) with an outer surface (103) and an optical component (117) having a base (115) which interfaces with the outer surface of the substrate. In one embodiment at least one gap (109) is disposed between the outer surface of the substrate and the base of the optical device, the at least one gap containing an adhesive (125) which adheres the substrate and the optical device together and at least one interface (123,133) between the base and the outer surface. In another embodiment a plurality of spaced-apart gaps are disposed between the outer surface of the substrate and the base of the optical device, each gap containing an adhesive which adheres the substrate and optical device together.
Abstract:
In electronic apparatus, a coaxial signal cable is connected to a semiconductor circuit using a coaxial connector 24 to convert the coaxial signal to a coplanar wave (CPW) mode, the CPW mode signal being transferred from the connector 24 to the circuit 27 via a flexible connection 23 comprising a CPW transmission line 25 on a flexible substrate 26.
Abstract:
A system (10) comprises a carrier (1) which is adapted to carry an optical fiber (9) and an optical chip (3) having a circuit element (4). The carrier and the optical chip are provided with co-operable alignment features (13,14) for aligning the carrier with the optical chip so that the optical fiber and the circuit element are optically coupled.
Abstract:
A rib waveguide structure comprising a layer (4) of light conductive material defined between two planar faces with a rib (9) formed on one of the faces and an optical components e.g. a tapered waveguide (6) optically coupled to the other face. An inverted rib waveguide comprising a light conductive layer (11) and a rib (10) that projects from the light conductive layer (11) into a substrate (4, 8) is also described as well as other optical devices comprising a light conductive layer separated from a substrate by a non-planar layer (3) of light confining material and optical devices comprising two or more layers (2, 3; 18, 19, 20) of light confining material buried within a rib with a light conducting component (10; 17; 22) at least a part of which is formed between planes defined by the two layers of light confining material. A method of forming such devices is also described.
Abstract:
A method of controlling birefringence in a rib waveguide structure manufactured in silicon, the rib waveguide structure comprising an elongated rib element having an upper face and two side faces, the method comprising forming a layer of thermal oxide to a predetermined thickness on said upper face and side faces of at least a portion of said rib waveguide structure.
Abstract:
An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.
Abstract:
An asymmetric MEMS thermal actuator device includes a base portion, typically a pair of bond pads, and an actuator element connected to the base portion by a flexure portion. The actuator element has a first arm and a second arm alongside the first arm and spaced from the first arm. The second arm is wider than the first arm so that the actuator element deflects about the flexure element due to differential heating in the first and second arms when an electrical current is passed therethrough. A cut-out portion is provided in the second arm adjacent the first arm so as to increase the spacing therefrom over at least a portion of the second arm. Preferably, a heat sink is also provided laterally adjacent the second arm.
Abstract:
A method for integrating optical devices in a single growth step by utilizing a combination of Selective Area Growth and Etch (SAGE) is provided. An first device is formed between a set of oxide-masked regions, whilst a second device is formed in an adjacent planar region. By use of Selected Area Growth and Etch (SAGE), in which the growth between the oxide-masked regions is greater than the growth in the planar region, and in which the etch rate in the area between the oxide-masked regions is substantially the same as that in the planar region, the number of active quantum layers for the first device are formed between the oxide-masked regions, and a different number of layers for the second device is formed in the planar region.
Abstract:
A thermo-optic semiconductor device has one semiconductor region providing an optical waveguide and an adjacent semiconductor region providing a resistive heater between two doped regions, current may be passed through the resistive heater within the adjacent semiconductor region to heat it and thereby vary the optical characteristics of the waveguide.
Abstract:
An optical waveguide structure formed on an optical chip comprising a first waveguide layer 3 of a first material supported on a substrate 7 and a second waveguide layer 6 of a second material supported on the first waveguide layer 3. The first waveguide layer 3 is separated from the substrate 7 by an optical confinement layer 8 and the second waveguide layer 6 is separated from the first waveguide layer 3 by an etch-stop layer 9. The etch-stop layer 9 is thin compared to the thickness of the first waveguide layer 3 and/or the second waveguide layer 6 and is of a material which enables it to act as an etch-stop when features are etched in the second waveguide layer 6.)