METHOD OF FABRICATING INTERFEROMETRIC MODULATOR DEVICES USING LIFT-OFF PROCESSING TECHNIQUES
    11.
    发明申请
    METHOD OF FABRICATING INTERFEROMETRIC MODULATOR DEVICES USING LIFT-OFF PROCESSING TECHNIQUES 审中-公开
    使用提升加工技术制造干涉式调制器器件的方法

    公开(公告)号:WO2006036470A1

    公开(公告)日:2006-04-06

    申请号:PCT/US2005/031693

    申请日:2005-09-02

    CPC classification number: G02B26/001

    Abstract: Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.

    Abstract translation: 本公开的实施例包括使用剥离处理技术制造干涉仪的方法。 在诸如光学堆叠或柔性层的各种干涉式调制器的制造中使用剥离处理有利地避免了与与其每层相关联的多种材料相关联的个体化化学物质。 此外,使用剥离处理可以在可用于制造干涉式调制器的材料和设备中进行更大的选择。

    CONTROLLING ELECTROMECHANICAL BEHAVIOR OF STRUCTURES WITHIN A MICROELECTROMECHANICAL SYSTEMS DEVICE
    12.
    发明申请
    CONTROLLING ELECTROMECHANICAL BEHAVIOR OF STRUCTURES WITHIN A MICROELECTROMECHANICAL SYSTEMS DEVICE 审中-公开
    控制微电子系统设备中结构的电化学行为

    公开(公告)号:WO2004026757A3

    公开(公告)日:2004-06-24

    申请号:PCT/US0330016

    申请日:2003-09-18

    CPC classification number: G02B26/001 B81B3/0035

    Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical system device. The method comprises fabricating a first layer (14) comprising a film (14) having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer (14) by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

    Abstract translation: 在一个实施例中,本发明提供了一种制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜(14)和特征光学响应的​​第一层(14),其中特征光学响应是期望的并且特征机电响应是不希望的; 以及通过在所述微机电系统装置的激活期间至少减少其上积累的电荷来修改所述第一层(14)的特征机电响应。

    FIELD-SEQUENTIAL COLOR ARCHITECTURE OF REFLECTIVE MODE MODULATOR
    13.
    发明申请
    FIELD-SEQUENTIAL COLOR ARCHITECTURE OF REFLECTIVE MODE MODULATOR 审中-公开
    反射模式调制器的场序列颜色结构

    公开(公告)号:WO2013015970A1

    公开(公告)日:2013-01-31

    申请号:PCT/US2012/045844

    申请日:2012-07-06

    Abstract: A field-sequential color architecture is included in a reflective mode display. The reflective mode display may be a direct-view display such as an interferometric modulator display. In some implementations, the reflective mode display may include three or more different subpixel types, each of which corresponds to a color. In some such implementations, the colors include primary colors. Data for each color may be written sequentially to subpixels for that color, while subpixels of the remaining colors are written to black. Alternatively, data for each color may be written sequentially to all subpixels of the display. Flashing of a corresponding colored light, e.g., from a front light of the display, may be timed to immediately follow a process of writing data for that color.

    Abstract translation: 反射模式显示中包含场顺序色彩架构。 反射模式显示可以是诸如干涉式调制器显示器的直视显示器。 在一些实现中,反射模式显示可以包括三个或更多个不同的子像素类型,每个子像素类型对应于颜色。 在一些这样的实现中,颜色包括原色。 每个颜色的数据可以顺序地写入用于该颜色的子像素,而剩余颜色的子像素被写入黑色。 或者,每个颜色的数据可以顺序写入显示器的所有子像素。 可以定时闪烁相应的彩色光,例如来自显示器的前灯,以便立即遵循为该颜色写入数据的过程。

    ILLUMINATION LIGHTGUIDE AND METHODS OF MANUFACTURING
    14.
    发明申请
    ILLUMINATION LIGHTGUIDE AND METHODS OF MANUFACTURING 审中-公开
    照明灯和制造方法

    公开(公告)号:WO2012027294A1

    公开(公告)日:2012-03-01

    申请号:PCT/US2011/048683

    申请日:2011-08-22

    CPC classification number: G02B6/0036 G02B6/006 G02B6/0068

    Abstract: Illumination systems and methods of manufacturing the same. In one implementation, an illumination system includes a plurality of light sources (631, 633, 635, 637) configured to emit light into a light panel (610) and a plurality of light turning features (690) disposed on the light panel configured to turn, light out of the light panel. The light sources can be configured to emit different colors of light than one another and the light turning features can be arranged such that a first light turning feature turns more light having a first color than any other color of light and such that a second light turning feature turns more light having a second color than any other color of light. In another implementation, a method of manufacturing an illumination system includes providing a light panel and positioning a luminance altering element on the light panel such that a luminance characteristic of the panel changes.

    Abstract translation: 照明系统及其制造方法。 在一个实施方案中,照明系统包括被配置为将光发射到光板(610)中的多个光源(631,633,635,637)和设置在所述光板上的多个光转向特征(690) 转动,点亮光面板。 光源可以被配置为发射彼此不同颜色的光,并且光转动特征可以被布置成使得第一光转向特征变得具有比任何其它颜色的光具有第一颜色的更多的光,并且使得第二光转向 特征使得具有比任何其它颜色的光具有第二颜色的更多的光。 在另一实施方式中,一种制造照明系统的方法包括提供一个光面板,并将亮度改变元件定位在该光板上,使得面板的亮度特性发生变化。

    FREE SPACE OPTICAL COMMUNICATION WITH OPTICAL FILM
    16.
    发明申请
    FREE SPACE OPTICAL COMMUNICATION WITH OPTICAL FILM 审中-公开
    免费空间光通信与光膜

    公开(公告)号:WO2010048318A2

    公开(公告)日:2010-04-29

    申请号:PCT/US2009/061523

    申请日:2009-10-21

    Abstract: Devices and systems are provided for free space optical communication using optical films. Some embodiments involve using an optical film for the transmission and/or reception of light in a free space optical communication system. Some free space optical communication systems may involve devices, such as laptop computers, desktop computers, mobile communications devices, etc., that are configured for communication via an optical film. The optical film may be disposed on a device, on a wall, a window, furniture, etc., according to the implementation. Many types of free space optical communication systems are provided, including line of sight and non line of sight free space optical communication systems.

    Abstract translation: 提供了使用光学膜的自由空间光通信的设备和系统。 一些实施例涉及在自由空间光通信系统中使用光学薄膜来发射和/或接收光。 一些自由空间光通信系统可以涉及经配置以经由光学膜进行通信的设备,例如膝上型计算机,台式计算机,移动通信设备等。 根据实施例,光学膜可以设置在设备上,墙壁,窗户,家具等上。 提供了许多类型的自由空间光通信系统,包括视线和非视距空间光通信系统。

    LIGHT GUIDE INCLUDING OPTICAL SCATTERING ELEMENTS AND A METHOD OF MANUFACTURE
    19.
    发明申请
    LIGHT GUIDE INCLUDING OPTICAL SCATTERING ELEMENTS AND A METHOD OF MANUFACTURE 审中-公开
    包含光学散射元件的光导和制造方法

    公开(公告)号:WO2008069877A2

    公开(公告)日:2008-06-12

    申请号:PCT/US2007/022736

    申请日:2007-10-26

    Inventor: CHUI, Clarence

    CPC classification number: G02B6/0041 G02B6/0043 G02B6/0065

    Abstract: A method and system for fabricating a light guide is disclosed. The method and system comprise providing a light guide element which includes a plurality of scattering elements located therein and adjusting at least a portion of the scattering elements to maintain their optical scattering character. The different embodiments of the present invention provide a system and method for fabricating a front light technology that is inexpensive and can compete on a cost basis with LCD backlight technologies while maintaining reasonable performance.

    Abstract translation: 公开了一种用于制造光导的方法和系统。 该方法和系统包括提供光导元件,该光导元件包括位于其中的多个散射元件并且调节散射元件的至少一部分以保持它们的光散射特性。 本发明的不同实施例提供了一种用于制造前照灯技术的系统和方法,该前照灯技术便宜并且可以在保持合理性能的同时在成本基础上与LCD背光技术竞争。

    METHOD FOR PACKAGING AN OPTICAL MEMS DEVICE
    20.
    发明申请
    METHOD FOR PACKAGING AN OPTICAL MEMS DEVICE 审中-公开
    封装光学MEMS器件的方法

    公开(公告)号:WO2007149475A3

    公开(公告)日:2008-06-05

    申请号:PCT/US2007014359

    申请日:2007-06-19

    Abstract: A microelectromechanical systems device (730) having a transparent substrate (710) joined to a planar backplate (720) with a raised perimeter structure (740a) forming a recessed cavity or cell (780). The raised perimeter structure (740a) is formed by applying a first layer (740a) around the peripheral area of the backplate (720) to form a recessed cell (780). A second layer (740b) is applied over the first layer. The first layer (740a) is thicker than the second layer (740b). The thicker layer (740a) comprises a viscous material. A second layer (740b) is a thinner adhesive layer, and is applied over the thicker layer (740a) to join the backplate (720) to the transparent substrate (710) to encapsulate the microelectromechanical systems device (730) formed on the transparent substrate (710).

    Abstract translation: 具有连接到平面背板(720)的透明衬底(710)的微机电系统装置(730)具有形成凹腔或电池(780)的凸起周边结构(740a)。 凸起的周边结构(740a)通过围绕背板(720)的周边区域施加第一层(740a)以形成凹陷单元(780)而形成。 在第一层上施加第二层(740b)。 第一层(740a)比第二层(740b)厚。 较厚的层(740a)包括粘性材料。 第二层(740b)是更薄的粘合剂层,并且被施加在较厚层(740a)上以将背板(720)连接到透明基板(710)以封装形成在透明基板上的微机电系统装置(730) (710)。

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