Abstract:
Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.
Abstract:
In one embodiment, the invention provides a method for fabricating a microelectromechanical system device. The method comprises fabricating a first layer (14) comprising a film (14) having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer (14) by at least reducing charge build up thereon during activation of the microelectromechanical systems device.
Abstract:
A field-sequential color architecture is included in a reflective mode display. The reflective mode display may be a direct-view display such as an interferometric modulator display. In some implementations, the reflective mode display may include three or more different subpixel types, each of which corresponds to a color. In some such implementations, the colors include primary colors. Data for each color may be written sequentially to subpixels for that color, while subpixels of the remaining colors are written to black. Alternatively, data for each color may be written sequentially to all subpixels of the display. Flashing of a corresponding colored light, e.g., from a front light of the display, may be timed to immediately follow a process of writing data for that color.
Abstract:
Illumination systems and methods of manufacturing the same. In one implementation, an illumination system includes a plurality of light sources (631, 633, 635, 637) configured to emit light into a light panel (610) and a plurality of light turning features (690) disposed on the light panel configured to turn, light out of the light panel. The light sources can be configured to emit different colors of light than one another and the light turning features can be arranged such that a first light turning feature turns more light having a first color than any other color of light and such that a second light turning feature turns more light having a second color than any other color of light. In another implementation, a method of manufacturing an illumination system includes providing a light panel and positioning a luminance altering element on the light panel such that a luminance characteristic of the panel changes.
Abstract:
A method of driving electromechanical devices such as interferometric modulators includes applying a voltage along a common line to release the electromechanical devices along the common line, followed by applying an address voltage along the common line to actuate selected electromechanical devices along the common line based on voltages applied along segment lines. Hold voltages may be applied along common lines between applications of release and address voltages, and the segment voltages may be selected to be sufficiently small that the segment voltages will not affect the state of the electromechanical devices along other common lines not being written to.
Abstract:
Devices and systems are provided for free space optical communication using optical films. Some embodiments involve using an optical film for the transmission and/or reception of light in a free space optical communication system. Some free space optical communication systems may involve devices, such as laptop computers, desktop computers, mobile communications devices, etc., that are configured for communication via an optical film. The optical film may be disposed on a device, on a wall, a window, furniture, etc., according to the implementation. Many types of free space optical communication systems are provided, including line of sight and non line of sight free space optical communication systems.
Abstract:
A microelectromechanical (MEMS) device (1300) includes a substrate (20), a movable element (1340) over the substrate (20), and an actuation electrode (142) above the movable element (1340). The movable element (1340) includes a deformable layer (1302) and a reflective element (1314), The deformable layer (1302) is spaced from the reflective element (1314).
Abstract:
A microelectromechanical (MEMS) device (2000) includes a first reflective layer (904), a movable element (2220), and an actuation electrode (902). The movable element (2220) is over the first reflective layer (904). The movable element (2220) includes a deformable layer (1302) and a reflective element (914). The actuation electrode (902) is between the deformable layer (1302) and the reflective element (914).
Abstract:
A method and system for fabricating a light guide is disclosed. The method and system comprise providing a light guide element which includes a plurality of scattering elements located therein and adjusting at least a portion of the scattering elements to maintain their optical scattering character. The different embodiments of the present invention provide a system and method for fabricating a front light technology that is inexpensive and can compete on a cost basis with LCD backlight technologies while maintaining reasonable performance.
Abstract:
A microelectromechanical systems device (730) having a transparent substrate (710) joined to a planar backplate (720) with a raised perimeter structure (740a) forming a recessed cavity or cell (780). The raised perimeter structure (740a) is formed by applying a first layer (740a) around the peripheral area of the backplate (720) to form a recessed cell (780). A second layer (740b) is applied over the first layer. The first layer (740a) is thicker than the second layer (740b). The thicker layer (740a) comprises a viscous material. A second layer (740b) is a thinner adhesive layer, and is applied over the thicker layer (740a) to join the backplate (720) to the transparent substrate (710) to encapsulate the microelectromechanical systems device (730) formed on the transparent substrate (710).