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    Mountable Arm Assembly for Fitness Equipment
    11.
    发明申请
    Mountable Arm Assembly for Fitness Equipment 有权

    公开(公告)号：US20230081926A1

    公开(公告)日：2023-03-16

    申请号：US17500541

    申请日：2021-10-13

    Applicant: Cheng Cheng CHANG

    Inventor： Cheng Cheng CHANG

    IPC: A63B21/00 ,  A63B21/06

    Abstract: The present invention provides a mountable arm assembly for fitness equipment, comprising two arm members and a connector for pivot connection of the two arm members. The two arm members respectively provide a plurality of assembly portions for length adjustment of the tension arm. The connector is formed with a pivot connection portion and a plurality of eccentric positioning portions. Specifically, an adjustable disposing angle is formed between the two arm members, and at least one of the two arm members sets the disposing angle through at least one eccentric positioning portion. The arm assembly can be mounted on fitness equipment and can swing back and forth through the pivot connection portion. The users can select one assembly portion on each of the two arm members for required tension arm lengths and add an applied force and a resistance force respectively on the two assembly portions. The invention effectively solves the problem that the existing fitness apparatuses do not offer adjustment of the tension arm length or the disposing angle.

    Wafer transfer system with temperature control apparatus
    13.
    发明授权
    Wafer transfer system with temperature control apparatus 有权
    带温度调节装置的晶圆传送系统

    公开(公告)号：US06679064B2

    公开(公告)日：2004-01-20

    申请号：US10144521

    申请日：2002-05-13

    Applicant: Chih-Wei Chang ,  Fa-Yuan Chang ,  Cheng-Ting Tseng ,  Chin-Chang Chen ,  Cheng-Cheng Chang ,  Shih-Fang Chen

    Inventor： Chih-Wei Chang ,  Fa-Yuan Chang ,  Cheng-Ting Tseng ,  Chin-Chang Chen ,  Cheng-Cheng Chang ,  Shih-Fang Chen

    IPC: F25B2102

    CPC classification number: H01L35/32 ,  F25B21/04 ,  F25B2321/021

    Abstract: A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.

    Abstract translation: 一种具有温度控制装置的晶片传送系统。 温度控制装置被构造和布置成使得材料，元素或原子粒子可以流过其中以加热或冷却由晶片传送系统承载的晶片。 流过温度控制装置的材料，元素或原子粒子使得热量被泵送到上表面或下表面。 优选地，温度控制装置是热电装置。 优选地，热电装置包括多个交替的N型和P型半导体芯片，其电串联并联并联并且并联连接到DC电源。 提供开关或继电器，用于从直流电源改变到热电装置的电流的方向。

    Reliable low thermal resistance package for high power flip clip ICs
    14.
    发明授权
    Reliable low thermal resistance package for high power flip clip ICs 失效
    适用于大功率倒装夹IC的可靠低热阻封装

    公开(公告)号：US5585671A

    公开(公告)日：1996-12-17

    申请号：US319764

    申请日：1994-10-07

    Applicant: Voddarahalli K. Nagesh ,  Kim H. Chen ,  Cheng-Cheng Chang ,  Bahram Afshari ,  Jacques Leibovitz

    Inventor： Voddarahalli K. Nagesh ,  Kim H. Chen ,  Cheng-Cheng Chang ,  Bahram Afshari ,  Jacques Leibovitz

    IPC: H01L23/367 ,  H01L23/373 ,  H01L23/10 ,  H01L23/34

    CPC classification number: H01L23/3675 ,  H01L23/367 ,  H01L23/3737 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253

    Abstract: A flip-chip IC package (10) provides a thermally-conductive lid (20) attached to a backside of the chip (12) by a die attach layer (18) of a predetermined thickness range. A rim (22), preferably KOVAR iron-nickel alloy, is formed on the lid (20) with a depth (44) less than a sum (42) of a thickness of the chip, the interconnects (16), and a minimum final thickness (40) of the die attach layer (18) by a predetermined margin (46). An initial thickness of thermally-filled epoxy is applied to the backside of the chip and a layer of lid attach epoxy (24) is applied to the rim of the lid in a thickness sufficient to span the predetermined margin. The lid is floated on the die attach layer (18) with the rim of the lid surrounding the chip and floating on the lid attach material. The lid is clamped against the chip with a force sufficient to compress the die attach material to a predetermined thickness in a range less than the initial thickness and not less than the minimum final thickness (40). An oxide layer, such as an iron or iron-alloy oxide layer, is formed on the bottom surface of the rim. A spacer is placed on the backside of the chip within the die attach material (18), to define the minimum final thickness (40) of the die attach layer. A beveled or stepped vent hole is formed in the lid and plugged and sealed.

    Abstract translation: 倒装芯片IC封装（10）通过预定厚度范围的管芯附着层（18）提供安装在芯片（12）背面的导热盖（20）。 在盖子（20）上形成一个边缘（22），其深度（44）小于芯片厚度（16）和互连件（16）的总和（42） 芯片附着层（18）的最终厚度（40）预定的边缘（46）。 将热填充环氧树脂的初始厚度施加到芯片的背面，并且将盖子附着环氧树脂层（24）以足以跨越预定边缘的厚度施加到盖的边缘。 盖子悬挂在芯片附着层（18）上，盖子的边缘围绕着芯片并漂浮在盖子附着材料上。 盖子以足以在小于初始厚度并且不小于最小最终厚度（40）的范围内将管芯附接材料压缩到预定厚度的力夹紧在芯片上。 在边缘的底面上形成氧化物层，例如铁或铁 - 合金氧化物层。 间隔件被放置在芯片附接材料（18）内的芯片的背面，以限定芯片附着层的最小最终厚度（40）。 在盖子上形成一个倾斜或有级的通风孔，并将其密封。

    Method for minimizing peeling at the surface of spin-on glasses
    15.
    发明授权
    Method for minimizing peeling at the surface of spin-on glasses 失效
    用于最小化旋涂眼镜表面剥离的方法

    公开(公告)号：US5567658A

    公开(公告)日：1996-10-22

    申请号：US299269

    申请日：1994-09-01

    Applicant: Chin-Kun Wang ,  Cheng-Cheng Chang

    Inventor： Chin-Kun Wang ,  Cheng-Cheng Chang

    IPC: C23C16/02 ,  H01L21/311 ,  H05H1/00 ,  H01L21/469 ,  H01L21/4757

    CPC classification number: C23C16/0236 ,  H01L21/31111 ,  H01L21/31133

    Abstract: A gas discharge through nitrous oxide or nitrogen is used to remove polymeric deposits that form on the surface of a layer of a spin-on glass that was etched in an atmosphere of carbon-fluorine compounds. Removal of the polymeric deposit greatly improves adhesion to the spin-on glass layer of subsequently deposited layers. The removal is accomplished without increasing any tendency of the spin-on glass layer to absorb moisture.

    Abstract translation: 使用通过一氧化二氮或氮气的气体排放来去除在碳氟化合物的气氛中蚀刻的旋涂玻璃层的表面上形成的聚合物沉积物。 去除聚合物沉积物大大提高了对随后沉积层的旋涂玻璃层的粘附性。 去除是在不增加旋涂玻璃层吸收水分的任何倾向的情况下实现的。

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