METHOD AND APPARATUS FOR SOFT BUFFER PARTITIONING IN TIME-DIVISION DUPLEXING SYSTEM
    11.
    发明申请
    METHOD AND APPARATUS FOR SOFT BUFFER PARTITIONING IN TIME-DIVISION DUPLEXING SYSTEM 有权
    用于软件缓冲区在时分双工系统中的方法和装置

    公开(公告)号:US20130051289A1

    公开(公告)日:2013-02-28

    申请号:US13551614

    申请日:2012-07-18

    CPC classification number: H04L1/1845 H04L1/1822

    Abstract: A method for partitioning a soft buffer in a time-division duplex system and an apparatus using the same are disclosed. The method includes the following steps. A total number of soft channel bits, a maximum number of transport blocks transmittable to a user equipment (UE) in a transmission time interval (TTI), a maximum number of downlink (DL) hybrid automatic retransmit request (HARQ) processes, and a configured maximum number of HARQ processes are determined. A partition size of the soft buffer is selected according at least to the total number of soft channel bits, the maximum number of transport blocks transmittable to the UE in the TTI, the maximum number of DL HARQ processes, and the preconfigured maximum number of HARQ processes.

    Abstract translation: 公开了一种用于对时分双工系统中的软缓冲器进行分区的方法及其使用方法。 该方法包括以下步骤。 软通道位的总数,在传输时间间隔(TTI)中传输到用户设备(UE)的最大数量的传输块,最大数量的下行链路(DL)混合自动重传请求(HARQ)处理和 确定配置的最大数量的HARQ进程。 软缓冲器的分区大小至少根据软信道比特的总数,在TTI中可传送给UE的最大传输块数,DL HARQ进程的最大数目和预先配置的HARQ最大数量进行选择 过程。

    TDD WIRELESS COMMUNICATION SYSTEM AND METHOD FOR REPORTING HARQ-ACK
    12.
    发明申请
    TDD WIRELESS COMMUNICATION SYSTEM AND METHOD FOR REPORTING HARQ-ACK 有权
    TDD无线通信系统和用于报告HARQ-ACK的方法

    公开(公告)号:US20130034029A1

    公开(公告)日:2013-02-07

    申请号:US13565766

    申请日:2012-08-02

    Applicant: Chien-Min Lee

    Inventor: Chien-Min Lee

    CPC classification number: H04L1/1861 H04L2001/0096

    Abstract: A method for reporting Hybrid Automatic Repeat Request Acknowledgement (HARQ-ACK) is provided. The method is applicable to a time-division duplex (TDD) wireless communication system and includes the following steps: receiving downlink information from a base station with multiple serving cells, calculating a report number of each serving cell, which is a number of subframes of the corresponding serving cell whose acknowledgements have to be reported, and providing report information to the base station in an uplink subframe of a serving cell specified by the base station. The multiple serving cells use multiple uplink-downlink configurations. The report number of at least one of the serving cells is determined according to a downlink association set of the uplink subframe of the serving cell specified by the base station. The report information includes the acknowledgements that have to be reported by each of the serving cells.

    Abstract translation: 提供了一种用于报告混合自动重传请求确认(HARQ-ACK)的方法。 该方法适用于时分双工(TDD)无线通信系统,包括以下步骤:从具有多个服务小区的基站接收下行链路信息,计算每个服务小区的报告号码,其为多个子帧 必须报告其确认的相应服务小区,并且在由基站指定的服务小区的上行链路子帧中向基站提供报告信息。 多个服务小区使用多个上行链路 - 下行链路配置。 根据由基站指定的服务小区的上行链路子帧的下行链路关联集来确定至少一个服务小区的报告号码。 报告信息包括必须由每个服务小区报告的确认。

    PHASE CHANGE MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME
    13.
    发明申请
    PHASE CHANGE MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME 审中-公开
    相变存储器件及其制造方法

    公开(公告)号:US20110312150A1

    公开(公告)日:2011-12-22

    申请号:US13219568

    申请日:2011-08-26

    Abstract: A phase change memory device is provided, including a substrate, a first dielectric layer disposed over the substrate, a first electrode disposed in the first dielectric layer, a second dielectric layer formed over the first dielectric layer, covering the first electrode, a heating electrode disposed in the second dielectric layer, contacting the first electrode, a phase change material layer disposed over the second dielectric layer, contacting the heating electrode, and a second electrode disposed over the phase change material layer. In one embodiment, the heating electrode includes a first portion contacting the first electrode and a second portion contacting the phase change material layer, and the second portion of the heating electrode includes metal silicides and the first portion of the heating electrode includes no metal silicides.

    Abstract translation: 提供一种相变存储器件,包括:衬底,设置在衬底上的第一电介质层,设置在第一电介质层中的第一电极,形成在第一电介质层上的第二电介质层,覆盖第一电极;加热电极 设置在所述第二电介质层中,与所述第一电极接触,设置在所述第二电介质层上方的与所述加热电极接触的相变材料层和设置在所述相变材料层上的第二电极。 在一个实施例中,加热电极包括接触第一电极的第一部分和与相变材料层接触的第二部分,加热电极的第二部分包括金属硅化物,加热电极的第一部分不包括金属硅化物。

    SYSTEMS AND METHODS FOR REPORTING RADIO LINK FAILURE
    14.
    发明申请
    SYSTEMS AND METHODS FOR REPORTING RADIO LINK FAILURE 审中-公开
    用于报告无线链路故障的系统和方法

    公开(公告)号:US20110194630A1

    公开(公告)日:2011-08-11

    申请号:US12971736

    申请日:2010-12-17

    CPC classification number: H04L5/0053 H04L1/0025 H04L1/201 H04L5/001 H04L5/0055

    Abstract: A mobile communications device is provided with a wireless module and a controller module. The wireless module receives a plurality of downlink signals from a service node and determines a plurality of status indicators respectively corresponding to the downlink signals. The controller module determines whether a radio link failure has occurred according to the status indicators, and transmits at least one uplink signal via the wireless module to indicate information of the radio link failure to the service node in response to the occurrence of the radio link failure.

    Abstract translation: 移动通信设备设置有无线模块和控制器模块。 无线模块从服务节点接收多个下行链路信号,并分别对应于下行链路信号确定多个状态指示符。 控制器模块根据状态指示器确定是否发生无线电链路故障,并且经由无线模块发送至少一个上行链路信号,以响应于无线电链路故障的发生来指示到服务节点的无线电链路故障的信息 。

    PHASE CHANGE MEMORY DEVICE
    16.
    发明申请
    PHASE CHANGE MEMORY DEVICE 有权
    相变存储器件

    公开(公告)号:US20090194759A1

    公开(公告)日:2009-08-06

    申请号:US12189087

    申请日:2008-08-08

    CPC classification number: H01L45/06 H01L45/1233 H01L45/144 H01L45/1625

    Abstract: A phase change memory device is disclosed, including a substrate, a phase change layer over the substrate, a first electrode electrically connecting a first side of the phase change layer, a second electrode electrically connecting a second side of the phase change layer, wherein the phase change layer composes mainly of gallium (Ga), antimony (Sb) and tellurium (Te) and unavoidable impurities, having the composition range of GaxTeySbz, 5

    Abstract translation: 公开了一种相变存储器件,包括衬底,衬底上的相变层,电连接相变层的第一侧的第一电极,电连接相变层的第二侧的第二电极,其中, 相变层主要由镓(Ga),锑(Sb)和碲(Te)和不可避免的杂质构成,其组成范围为GaxTeySbz,5

    Phase change memory device and fabrication method thereof
    17.
    发明授权
    Phase change memory device and fabrication method thereof 有权
    相变存储器件及其制造方法

    公开(公告)号:US07538043B2

    公开(公告)日:2009-05-26

    申请号:US11615909

    申请日:2006-12-22

    Applicant: Chien-Min Lee

    Inventor: Chien-Min Lee

    Abstract: A phase change memory device comprising an electrode, a phase change layer crossing and contacting the electrode at a cross region thereof, and a transistor comprising a source and a drain, wherein the drain of the transistor electrically connects the electrode or the phase change layer is disclosed.

    Abstract translation: 一种相变存储器件,包括电极,在其交叉区域交叉并接触电极的相变层和包括源极和漏极的晶体管,其中晶体管的漏极电连接电极或相变层是 披露

    PHASE CHANGE MEMORY DEVICE AND FABRICATION METHOD THEREOF
    18.
    发明申请
    PHASE CHANGE MEMORY DEVICE AND FABRICATION METHOD THEREOF 有权
    相变存储器件及其制造方法

    公开(公告)号:US20090078926A1

    公开(公告)日:2009-03-26

    申请号:US12328745

    申请日:2008-12-04

    Applicant: Chien-Min Lee

    Inventor: Chien-Min Lee

    Abstract: A phase change memory device comprising an electrode, a phase change layer crossing and contacting the electrode at a cross region thereof, and a transistor comprising a source and a drain, wherein the drain of the transistor electrically connects the electrode or the phase change layer is disclosed.

    Abstract translation: 一种相变存储器件,包括电极,在其交叉区域交叉并接触电极的相变层和包括源极和漏极的晶体管,其中晶体管的漏极电连接电极或相变层是 披露

    PHASE CHANGE MEMORY DEVICES AND FABRICATION METHODS THEREOF
    19.
    发明申请
    PHASE CHANGE MEMORY DEVICES AND FABRICATION METHODS THEREOF 审中-公开
    相变存储器件及其制造方法

    公开(公告)号:US20080296554A1

    公开(公告)日:2008-12-04

    申请号:US11965557

    申请日:2007-12-27

    Applicant: Chien-Min Lee

    Inventor: Chien-Min Lee

    Abstract: Phase change memory devices and fabrication methods thereof. A phase change memory device includes an array of phase change memory cells. Each phase change memory cell includes a selecting transistor disposed on a substrate. An upright electrode structure is electrically connected to the selecting transistor. An upright phase change memory layer is stacked on the upright electrode structure with a contact area therebetween, wherein the contact area serves as the location where phase transition takes place.

    Abstract translation: 相变存储器件及其制造方法。 相变存储器件包括相变存储器单元的阵列。 每个相变存储单元包括设置在基板上的选择晶体管。 直立电极结构电连接到选择晶体管。 直立相变存储层层叠在直立电极结构上,其间具有接触区域,其中接触区域用作发生相变的位置。

    PHASE CHANGE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
    20.
    发明申请
    PHASE CHANGE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    相变存储器件及其制造方法

    公开(公告)号:US20080164504A1

    公开(公告)日:2008-07-10

    申请号:US11857396

    申请日:2007-09-18

    Abstract: A phase change memory device is provided. The phase change memory device comprises a substrate. An electrode layer is on the substrate. A phase change memory structure is on the electrode layer and electrically connected to the electrode layer, wherein the phase change memory structure comprises a cup-shaped heating electrode on the electrode layer. An insulating layer is on the cup-shaped heating electrode along a first direction covering a portion of the cup-shaped heating electrode. An electrode structure is on the cup-shaped heating electrode along a second direction covering a portion of the insulating layer and the cup-shaped heating electrode. A pair of double spacers is on a pair of sidewalls of the electrode structure covering a portion of the cup-shaped heating electrode, wherein the double spacer comprises a phase change material spacer and an insulating material spacer on a sidewall of the phase change material spacer.

    Abstract translation: 提供了相变存储器件。 相变存储器件包括衬底。 电极层位于基板上。 相变存储器结构在电极层上并电连接到电极层,其中相变存储器结构包括在电极层上的杯形加热电极。 绝缘层沿着覆盖杯状加热电极的一部分的第一方向位于杯状加热电极上。 电极结构沿着覆盖绝缘层和杯状加热电极的一部分的第二方向位于杯状加热电极上。 一对双间隔物位于电极结构的一对侧壁上,覆盖杯状加热电极的一部分,其中双间隔物包括相变材料间隔物和在相变材料间隔物的侧壁上的绝缘材料间隔物 。

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