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    BLOWER
    12.
    发明申请
    BLOWER 审中-公开
    鼓风机

    公开(公告)号：US20070140836A1

    公开(公告)日：2007-06-21

    申请号：US11309579

    申请日：2006-08-25

    Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

    Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

    IPC: F04D29/66

    CPC classification number: F04D29/282 ,  F04D29/666

    Abstract: A blower includes a fan blade assembly. The fan blade assembly includes a cylinder, fan blades, and damping ribs. The fan blades are fixed by an upper ring, a lower outer ring, and a lower inner ring. The cylinder is surrounded by the fan blades and coupled to the lower inner ring. The damping ribs are set between each two adjacent fan blades for enhancing structural integrity of the fan blade assembly thereby acting as a vibration damper of the fan blades when the blower operates at high-speed.

    Abstract translation: 鼓风机包括风扇叶片组件。 风扇叶片组件包括气缸，风扇叶片和阻尼肋。 风扇叶片由上环，下外环和下内环固定。 气缸被风扇叶片包围并联接到下内圈。 阻尼肋设置在两个相邻的风扇叶片之间，用于增强风扇叶片组件的结构完整性，从而当鼓风机以高速运转时用作风扇叶片的减振器。

    CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE
    13.
    发明申请
    CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE 审中-公开
    载体，芯片包装结构和电路板包装结构

    公开(公告)号：US20050230828A1

    公开(公告)日：2005-10-20

    申请号：US10907780

    申请日：2005-04-15

    Applicant: Jeng-Da Wu

    Inventor： Jeng-Da Wu

    IPC: H01L23/498 ,  H01L29/40 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09418 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A chip package structure is provided. The chip package structure has a chip and a carrier, wherein the carrier has a package substrate and a plurality of contacts. The package substrate has a carrying surface and a back surface. The chip is disposed on the carrying surface of the package substrate, and the contacts are disposed on the back surface of the package substrate in a pattern of a plurality of concentric circles. Additionally, the chip package structure can be disposed on a circuit board with solder balls formed on the contacts to form a circuit board package structure. The thermal stress exerted on the solder balls may be uniformly distributed in the carrier, the chip package structure, and the circuit board package structure. The bonding strength between the package substrate and the circuit board is improved.

    Abstract translation: 提供了芯片封装结构。 芯片封装结构具有芯片和载体，其中载体具有封装基板和多个触点。 封装衬底具有承载表面和后表面。 芯片设置在封装基板的承载表面上，并且触点以多个同心圆的图案设置在封装基板的背面上。 此外，可以将芯片封装结构设置在电路板上，其中形成在触点上的焊球形成电路板封装结构。 施加在焊球上的热应力可以均匀分布在载体，芯片封装结构和电路板封装结构中。 提高了封装基板与电路基板的接合强度。

    Motherboard
    14.
    发明授权
    Motherboard 失效
    母板

    公开(公告)号：US08154879B2

    公开(公告)日：2012-04-10

    申请号：US11849306

    申请日：2007-09-03

    Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

    Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

    IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC classification number: H05K1/0271 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10734

    Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

    Abstract translation: 主板包括平行布置在印刷电路板上的印刷电路板，第一芯片和第二芯片。 在第一芯片周围的印刷电路板中限定多个固定孔。 在第二芯片和由靠近第二芯片的两个固定孔确定的第一线之间的印刷电路板中限定至少一个隔离孔。 如果印刷电路板受到冲击，则可以有效地最小化或防止对芯片的损坏。

    ELECTRONIC APPARATUS WITH AIR GUIDING ELEMENT
    16.
    发明申请
    ELECTRONIC APPARATUS WITH AIR GUIDING ELEMENT 失效
    具有空气导向元件的电子设备

    公开(公告)号：US20090190309A1

    公开(公告)日：2009-07-30

    申请号：US12137781

    申请日：2008-06-12

    Applicant: LIANG-QING SHAN ,  YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LIANG-LIANG CAO ,  LEI GUO

    Inventor： LIANG-QING SHAN ,  YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LIANG-LIANG CAO ,  LEI GUO

    IPC: H05K7/20

    CPC classification number: H05K7/20563 ,  H05K7/186

    Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.

    Abstract translation: 电子设备包括外壳（30），电路板（40），风扇模块（20）和安装在外壳中的空气引导元件（10）。 电路板包括至少一个发热部件（41）。 风扇模块具有与风扇对应的风扇（22）和输出开口（213）。 空气引导元件包括阻挡板（11），并且引导板（12）包括朝向风扇模块的输出开口延伸的自由端。 所述至少一个发热部件和所述输出开口位于所述抵抗板的同一侧。 引导板限定了连接抵抗板的自由端（127）和连接端（125）。 由引导板的端部限定的平面相对于电阻板以大于90度的角度排列。

    BUTTON ASSEMBLY
    17.
    发明申请
    BUTTON ASSEMBLY 失效
    按钮组合

    公开(公告)号：US20090166164A1

    公开(公告)日：2009-07-02

    申请号：US12102019

    申请日：2008-04-14

    Applicant: ZHI-PING WU ,  CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

    Inventor： ZHI-PING WU ,  CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

    IPC: H01H3/20

    CPC classification number: H01H3/46 ,  G06F1/181

    Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.

    Abstract translation: 用于按压计算机挡板中的开关的按钮组件包括连接到臂的按钮。 计算机挡板中定义了一个切口。 按钮插入切口，臂可枢转地安装在计算机挡板上。 按压部从臂的一侧向外延伸。 在按压部上形成有倾斜的按压面。 按下按钮可移动手臂，使倾斜按压平面远离手臂的一端接触开关。 开关抵抗按压部，使臂旋转，使得倾斜按压面的另一端向前移动，由此倾斜的按压面完全接触并启动开关。

    Feeding mechanism for pickup head
    19.
    发明申请
    Feeding mechanism for pickup head 失效
    拾取头的送料机构

    公开(公告)号：US20070202712A1

    公开(公告)日：2007-08-30

    申请号：US11309868

    申请日：2006-10-16

    Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

    Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

    IPC: H01R12/00

    CPC classification number: G11B7/08582

    Abstract: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

    Abstract translation: 一种示例性的光盘驱动装置，包括构造成可移动地支撑拾取头的引导轴和可弹性变形的构件。 弹性变形构件包括主体，并且悬臂从主体的前边缘的中间部分倾斜。 悬臂在其下部较宽，在其上部较窄，并且悬臂用于弹性地按压导向轴的相应端。 可弹性变形的构件减小了悬臂与引导轴之间的应力表面，延长了其使用寿命。

    CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME
    20.
    发明申请
    CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME 有权
    芯片包装结构及其制造方法

    公开(公告)号：US20070132107A1

    公开(公告)日：2007-06-14

    申请号：US11679131

    申请日：2007-02-26

    Applicant: Jeng-Da Wu

    Inventor： Jeng-Da Wu

    IPC: H01L23/48

    CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/05099

    Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps is formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

    Abstract translation: 芯片封装结构包括载体，芯片和底部填充物。 芯片具有形成多个凸起的活性表面。 该芯片以有源表面面向载体的方式倒装芯片结合到载体上，并通过凸块与载体电连接。 底部填充物填充在芯片和载体之间。 芯片附近的一部分底部填充物用作第一底部填充部分。 载体附近的底部填充部分用作第二底部填充部分。 第一底部填充部分的杨氏模量小于第二底部填充部分的杨氏模量。 第二底部填充部分可以任选地用选择的封装代替。 所选择的封装覆盖芯片周围的芯片和载体。

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