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    SECURE IN-SERVICE FIRMWARE UPDATE
    11.
    发明申请
    SECURE IN-SERVICE FIRMWARE UPDATE 审中-公开

    公开(公告)号：WO2022162457A1

    公开(公告)日：2022-08-04

    申请号：PCT/IB2021/061995

    申请日：2021-12-19

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： SFADIA, Mor Hoyda ,  ITKIN, Yuval ,  ATAMLI, Ahmad ,  SHAHAR, Ariel ,  STRASSBERG, Yaniv ,  LEVI, Itsik

    IPC: G06F21/57

    Abstract: A computer system (100) includes a volatile memory and at least one processor (102). The volatile memory includes a protected storage segment (PSS - 112) configured to store firmware-authentication program code for authenticating firmware of the computer system. The at least one processor is configured to receive a trigger to switch to a given version of the firmware, to obtain, in response to the trigger, a privilege to access the PSS, to authenticate the given version of the firmware by executing the firmware-authentication program code from the PSS, to switch to the given version of the firmware upon successfully authenticating the given version, and to take an alternative action upon failing to authenticate the given version.

    INTEGRATED PLASMONIC MODULATOR
    13.
    发明申请
    INTEGRATED PLASMONIC MODULATOR 审中-公开

    公开(公告)号：WO2020249984A1

    公开(公告)日：2020-12-17

    申请号：PCT/GR2019/000039

    申请日：2019-06-10

    Applicant: MELLANOX TECHNOLOGIES, LTD. ,  ETH, Zurich ,  ARISTOTLE UNIVERSITY OF THESSALONIKI

    Inventor： HOESSBACHER, Claudia ,  LEUTHOLD, Juerg ,  MENTOVICH, Elad ,  BAKOPOULOS, Paraskevas ,  KALAVROUZIOTIS, Dimitrios ,  TSIOKOS, Dimitrios

    IPC: G02F1/225 ,  G02F1/01

    Abstract: An optoelectronic device (20) includes thin film structures (56) disposed on a semiconductor substrate (54) and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack (42) of alternating metal layers (44, 46) and dielectric layers (50) is disposed over the thin film structures. The metal layers include a modulator layer (48), which contains a plasmonic waveguide (36, 99, 105) and a plurality of electrodes (30, 32, 34, 96, 98, 106), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes. An optical input coupler (38, 82) is configured to couple light into the modulator layer, whereby the light is modulated by the modulation of the SPPs, and an optical output coupler (38, 82) is configured to couple the modulated light out of the modulator layer.

    OPTICAL INTERPOSERS
    17.
    发明申请
    OPTICAL INTERPOSERS 审中-公开

    公开(公告)号：WO2021033000A1

    公开(公告)日：2021-02-25

    申请号：PCT/GR2019/000058

    申请日：2019-08-21

    Applicant: MELLANOX TECHNOLOGIES LTD. ,  KALAVROUZIOTIS, Dimitrios ,  BAKOPOULOS, Paraskevas

    Inventor： RUBINSTEIN, Alon ,  MENTOVICH, Elad

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/125 ,  G02B6/42 ,  G02B6/43 ,  G02B6/28

    Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide an optical interposer and associated communication system. An example optical interposer includes a substrate having a first end that receives a first optical fiber welded thereto and a second end that receives a plurality of photonic integrated circuits (PICs) attached thereto. The interposer further includes an optical waveguide network defined by the substrate that provides optical communication between the first welded optical fiber and the plurality of PICs. The optical waveguide network also includes optical redistribution elements supported by the substrate. In an operational configuration, the optical interposer receives a first input optical signal from the first welded optical fiber, and the plurality of optical redistribution elements successively split the first input optical signal such that a plurality of output optical signals is directed to the plurality of PICs.

    OPTICAL COUPLER
    18.
    发明申请
    OPTICAL COUPLER 审中-公开

    公开(公告)号：WO2020141336A1

    公开(公告)日：2020-07-09

    申请号：PCT/GR2020/000003

    申请日：2020-01-02

    Applicant: MELLANOX TECHNOLOGIES, LTD. ,  KALAVROUZIOTIS, Dimitrios

    Inventor： KALAVROUZIOTIS, Dimitrios ,  LUFF, Jonathan ,  QIAN, Wei ,  MENTOVICH, Elad ,  FENG, Dazeng

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/14 ,  G02B6/30 ,  G02B6/32 ,  G02B6/42 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26

    Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode- transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non- linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

    METHOD AND APPARATUS FOR OPTICAL COUPLING OF OPTICAL SIGNALS FOR A PHOTONIC INTEGRATED CIRCUIT
    19.
    发明申请
    METHOD AND APPARATUS FOR OPTICAL COUPLING OF OPTICAL SIGNALS FOR A PHOTONIC INTEGRATED CIRCUIT 审中-公开
    用于光子集成电路的光学信号的光耦合的方法和设备

    公开(公告)号：WO2018002675A1

    公开(公告)日：2018-01-04

    申请号：PCT/GR2016/000029

    申请日：2016-06-30

    Applicant: MELLANOX TECHNOLOGIES, LTD ,  POULOPOULOS, Giannis

    Inventor： POULOPOULOS, Giannis ,  MENTOVICH, Elad ,  KALIFA, Itshak ,  ROCKMAN, Sylvie ,  SANDOMIRSKY, Anna ,  POULOPOULOS, Giannis ,  KALAVROUZIOTIS, Dimitrios ,  BAKOPOULOS, Paraskevas ,  AVRAMOPOULOS, Hercules ,  YIN, Xin ,  VAN STEENBERGE, Geert

    IPC: G02B6/42 ,  G02B6/122

    CPC classification number: G02B6/4214 ,  G02B6/1221 ,  G02B6/1223 ,  G02B6/1228

    Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by-a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.

    Abstract translation: 描述了一种光耦合器和组装方法，其提供从光子集成电路（PIC）波导层到外部组件（诸如光纤，VCSEL，光电探测器和增益模块等）的有效耦合 。 光耦合器包括可由印刷电路板支撑的PIC，由PIC支持的可在光信号和相应电信号之间转换的光电换能器，以及耦合波导组件。 耦合波导组件包括低折射率波导，高折射率波导和反射表面，其改变光信号的路径以将来自光电换能器的光信号引导到低折射率波导中或从低折射率波导 波导到光电转换器中。

    INTERCONNECTION BETWEEN SILICON PHOTONICS DEVICES AND OPTICAL FIBERS
    20.
    发明申请
    INTERCONNECTION BETWEEN SILICON PHOTONICS DEVICES AND OPTICAL FIBERS 审中-公开
    硅光电器件和光纤之间的互连

    公开(公告)号：WO2015001429A1

    公开(公告)日：2015-01-08

    申请号：PCT/IB2014/060688

    申请日：2014-04-13

    Applicant: MELLANOX TECHNOLOGIES LTD.

    Inventor： LEVY, Shmuel ,  BADIHI, Avner ,  ROCKMAN, Sylvie ,  MENTOVICH, Elad

    IPC: G02B6/30 ,  G02B6/26 ,  G02B3/02 ,  G02B6/42 ,  G02B6/36 ,  G02B6/38

    CPC classification number: G02B6/30 ,  G02B6/32 ,  G02B6/3885

    Abstract: An apparatus (20) includes a Silicon Photonics (SiP) device (24, 94) and a ferrule (28, 102), The SiP device includes multiple optical waveguides (36, 106). The ferrule includes multiple optical fibers (68, 114) for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array (32) of micro-lenses (48) is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer (98) is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs - 110, 118) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.

    Abstract translation: 设备（20）包括硅光子（SiP）器件（24,94）和套圈（28,102）。该SiP器件包括多个光波导（36,106）。 套圈包括用于与SiP器件的相应光波导交换光信号的多个光纤（68,114）。 在一些实施例中，微透镜（48）的阵列（32）被配置为耦合SiP器件的光波导与套圈的相应光纤之间的光信号。 在一些实施例中，聚合物层（98）被放置在SiP器件和套圈之间，并且包括多个基于聚合物的点尺寸转换器（SSC-110,118），其被配置为将光信号耦合在光波导 SiP器件和套管的各自的光纤。

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