Abstract:
An appts. has a screened conveyor belt (9) which receives waste via a U-shaped, inclined plate (2). A wind cover (5) lies over part of the upper run of the belt and contains a blower (6) and water absorbers (7). A blower (10) on the lower run of the belt cleans away any residues. Liquid is separated from the waste by the combined action of the blower, (6), absorbers (7) and by passage through the belt. The appts. also includes two cylinders (18,23) to collect the dry materials after filtration.
Abstract:
To overcome lack of flexibility, complication of manufacture and susceptibility to corrosion, a roller skate base 31 is moulded from plastics material and provided with an embedded metal channel section reinforcing spine 21 having apertures 214 formed therethrough to improve the connection between spine 21 and the plastics. Secured to spine 21 is a reinforcing support cross member 211 formed with apertures 212 for securing the fixing belts 35. Downwardly depending members 213, 215 reinforce the connection between axle mounting lugs 32 and the main body of base 31, and axle bearing sleeves 33 are embedded in the lugs 32 wherein they are secured against rotation by radial pins 331. The rear lug 32 is inclined rearwardly to assist the balance of the wearer.
Abstract:
An appts. has a screened conveyor belt (9) which receives waste via a U-shaped, inclined plate (2). A wind cover (5) lies over part of the upper run of the belt and contains a blower (6) and water absorbers (7). A blower (10) on the lower run of the belt cleans away any residues. Liquid is separated from the waste by the combined action of the blower, (6), absorbers (7) and by passage through the belt. The appts. also includes two cylinders (18,23) to collect the dry materials after filtration.
Abstract:
A pizeoresistive type Z-axis accelerometer is provided, including a substrate; a plurality of anchors formed over the substrate; a plurality of cantilever beams, wherein the cantilever beams include a piezoresistive material; and a proof mass, wherein the proof mass is suspended over the substrate by respectively connecting the proof mass with the anchors, and the accelerometer senses a movement of the proof mass by the piezoresistive material.
Abstract:
The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.
Abstract:
A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined.
Abstract:
A multi-layer interconnect structure for stacked die configurations is provided. Through-substrate vias are formed in a semiconductor substrate. A backside of the semiconductor substrate is thinned to expose the through-substrate vias. An isolation film is formed over the backside of the semiconductor substrate and the exposed portion of the through-substrate vias. A first conductive element is formed electrically coupled to respective ones of the through-substrate vias and extending over the isolation film. One or more additional layers of isolation films and conductive elements may be formed, with connection elements such as solder balls being electrically coupled to the uppermost conductive elements.
Abstract:
A vehicle window assembly includes a vehicle structure, a window panel and a light source. The vehicle structure defines a viewing aperture. The window panel is mounted to the vehicle structure and covers the viewing aperture. The window panel has a peripheral edge surrounding a first window surface and a second window surface opposite the first window surface. The first window surface includes an etched section. The light source is mounted to the vehicle structure adjacent to a portion of the peripheral edge of the window panel such that light from the light source is directed to the portion of the peripheral edge of the window panel. The light travels in a lateral direction through the window panel selectively illuminating the etched section.
Abstract:
A feeder with variable rhomboidal walls includes a base housing, a soft hopper, a plurality of extrusion mechanisms, a pusher screw pole, a motor, and a decelerator. The extrusion mechanisms are respectively provided at four appropriate positions of the soft hopper, and are activated by protruding wheels with the aid of the motor in conjunction with the decelerator, so that the four extrusion mechanisms operate in pairs to squeeze the soft hopper while rendering a rhomboidal space change. Accordingly, a bridge effect associated with the prior art is eliminated to allow a raw material to fall and then to be dispensed by the pusher screw rod for further processing.
Abstract:
An apparatus capable of detecting location of object contained in image data and its detecting method are disclosed. The apparatus comprises an image capturing module, a weight assignment module, and a processing module. The image capturing module is for capturing an image. The weight assignment module performs the pixel weight/probability assignment according to the priori information and the image, and figures out the initial gravity center of the object according to the object location initialization. The processing module performs the statistical analysis according to the result of the pixel weight/probability assignment and the initial gravity center of the object so as to obtain the analysis result and update the object location. The processing module determines whether or not the analysis result meets the preset value, if it does, the processing module outputs an estimated result; if it doesn't, the processing module repeats the foregoing processes.