公开(公告)号：WO2013025264A1

公开(公告)日：2013-02-21

申请号：PCT/US2012/032679

申请日：2012-04-09

Applicant: OSRAM SYLVANIA INC. ,  RAUKAS, Madis ,  SCOTCH, Adam M. ,  ZHENG, Yi ,  KUNDALIYA, Darshan

Inventor： RAUKAS, Madis ,  SCOTCH, Adam M. ,  ZHENG, Yi ,  KUNDALIYA, Darshan

IPC: H01L33/50 ,  C30B29/28

CPC classification number: H01L33/505 ,  H01L2933/0041 ,  H01L2933/0091

Abstract: A wavelength-converting structure for a wavelength-converted light emitting diode (LED) assembly. The wavelength-converting structure includes a thin film structure having a non-uniform top surface. The non-uniform top surface is configured to increase extraction of light from the top surface of a wavelength-converting structure.

Abstract translation: 用于波长转换发光二极管（LED）组件的波长转换结构。 波长转换结构包括具有不均匀顶表面的薄膜结构。 非均匀顶表面被配置为增加从波长转换结构的顶表面提取光。

公开(公告)号：WO2013003525A1

公开(公告)日：2013-01-03

申请号：PCT/US2012/044512

申请日：2012-06-28

Applicant: OSRAM SYLVANIA INC. ,  SCOTCH, Adam M. ,  HAMBY, David

Inventor： SCOTCH, Adam M. ,  HAMBY, David

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/189 ,  H05K1/0259 ,  H05K1/16 ,  H05K2201/0329 ,  H05K2201/10106

Abstract: A method and apparatus for providing electro-static discharge (ESD) protection to light emitting diode (LED) systems on printed circuit boards (PCBs). Protection is provided by ESD diodes deposited on the PCBs configured as flexible substrates. Various deposition techniques are employed including chemical vapor deposition, pulsed laser deposition and atomic layer deposition.

Abstract translation: 一种用于向印刷电路板（PCB）上的发光二极管（LED）系统提供静电放电（ESD）保护的方法和装置。 保护由沉积在配置为柔性基板的PCB上的ESD二极管提供。 采用各种沉积技术，包括化学气相沉积，脉冲激光沉积和原子层沉积。

公开(公告)号：WO2011159484A1

公开(公告)日：2011-12-22

申请号：PCT/US2011/038895

申请日：2011-06-02

Applicant: OSRAM SYLVANIA INC. ,  LAPATOVICH, Walter P. ,  HAMBY, David ,  KOENIGSBERG, William D. ,  SCOTCH, Adam M.

Inventor： LAPATOVICH, Walter P. ,  HAMBY, David ,  KOENIGSBERG, William D. ,  SCOTCH, Adam M.

IPC: F21V29/00

CPC classification number: F21V29/56 ,  F21K9/00 ,  F21V7/06 ,  F21V7/08 ,  F21V7/09 ,  F21V7/22 ,  F21V29/004 ,  F21V29/86 ,  F21V29/89 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: A lamp (10) has a concave reflector (12) that includes an opening (14) in the bottom thereof and is substantially symmetrically arrayed about a longitudinal axis (16). A light source (18) is positioned in the opening (14) and has a symmetry axis (19) that is coaxial with the longitudinal axis (16) of the reflector (12). The light source (18) comprises a hollow ceramic member (20) with an inner surface (22) and an outer surface (24). First and second electrically conductive traces (26, 28) and first and second rows (29, 31) of first and second electrically conductive pads (30, 32) connected by the electrically conductive traces (26, 28) are formed on the outer surface (24). Light emitting diodes (34) are associated with at least some of the electrically conductive pads (30, 32); and a heat-conducting mechanism (36) is contained within the hollow ceramic member (20) for removing heat generated by the light emitting diodes (34) when the light emitting diodes (34) are operating.

Abstract translation: 灯（10）具有在其底部包括开口（14）并围绕纵向轴线（16）基本上对称排列的凹面反射器（12）。 光源（18）定位在开口（14）中并且具有与反射器（12）的纵向轴线（16）同轴的对称轴线（19）。 光源（18）包括具有内表面（22）和外表面（24）的中空陶瓷构件（20）。 通过导电迹线（26,28）连接的第一和第二导电迹线（26,28）和由导电迹线（26,28）连接的第一和第二导电焊盘（30,32）的第一和第二行（29,31）形成在外表面 （24）。 发光二极管（34）与至少一些导电焊盘（30,32）相关联; 并且在所述中空陶瓷构件（20）内容纳有导热机构（36），用于当所述发光二极管（34）工作时除去由所述发光二极管（34）产生的热量。

公开(公告)号：WO2010033347A3

公开(公告)日：2010-03-25

申请号：PCT/US2009/054725

申请日：2009-08-24

Applicant: OSRAM SYLVANIA INC. ,  SELVERIAN, John ,  HAMBY, David ,  SCOTCH, Adam, M.

Inventor： SELVERIAN, John ,  HAMBY, David ,  SCOTCH, Adam, M.

IPC: H01L33/48

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

公开(公告)号：WO2010033341A2

公开(公告)日：2010-03-25

申请号：PCT/US2009/054633

申请日：2009-08-21

Applicant: OSRAM SYLVANIA INC. ,  HAMBY, David ,  SCOTCH, Adam, M. ,  SELVERIAN, John ,  LAPATOVICH, Walter, P.

Inventor： HAMBY, David ,  SCOTCH, Adam, M. ,  SELVERIAN, John ,  LAPATOVICH, Walter, P.

IPC: H01L33/50

CPC classification number: C09K11/02 ,  C09K11/08 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

Abstract: An optical disk for use in converting light emitted from a light-emitting diode chip to white light. The optical disk includes a tapered surface such that a center area of the disk has a width greater than a width of an outer area of the disk. The optical disk is formed of a silicone having at least one weight percent mix of phosphor. Various embodiments of this generally described optical disk are also presented.

Abstract translation: 用于将从发光二极管芯片发射的光转换成白光的光盘。 光盘包括锥形表面，使得盘的中心区域的宽度大于盘的外部区域的宽度。 光盘由具有至少一个重量百分比的磷光体混合物的硅树脂形成。 还介绍了这种一般描述的光盘的各种实施例。

公开(公告)号：WO2010033301A1

公开(公告)日：2010-03-25

申请号：PCT/US2009/051662

申请日：2009-07-24

Applicant: OSRAM SYLVANIA INC. ,  SCOTCH, Adam, M. ,  SELVERIAN, John ,  HAMBY, David

Inventor： SCOTCH, Adam, M. ,  SELVERIAN, John ,  HAMBY, David

IPC: H01L33/62

CPC classification number: H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

Abstract translation: 照明模块包括基板和直接附接到基板的多个发光二极管（LED）芯片。 LED芯片与基板上的导电迹线电连通，其向LED芯片传送电流。 还介绍了这种一般描述的照明模块的各种实施例。 此外，还介绍了制备这种照明模块的方法以及照明模块的系统组件。

公开(公告)号：WO2010033299A1

公开(公告)日：2010-03-25

申请号：PCT/US2009/051488

申请日：2009-07-23

Applicant: OSRAM SYLVANIA INC. ,  HAMBY, David ,  SCOTCH, Adam, M. ,  SELVERIAN, John

Inventor： HAMBY, David ,  SCOTCH, Adam, M. ,  SELVERIAN, John

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

Abstract translation: 一种照明模块，包括基板和直接附接到基板的多个发光二极管（LED）芯片。 LED芯片与基板上的导电迹线电连通，其向LED芯片传送电流。 还提供了这个一般描述的照明模块的各种实施例。 另外，提出了制备这种照明模块的方法以及照明模块的系统组件。

公开(公告)号：WO2007044472A2

公开(公告)日：2007-04-19

申请号：PCT/US2006/038994

申请日：2006-10-06

Applicant: OSRAM SYLVANIA INC. ,  SCOTCH, Adam, M. ,  WEI, George, C.

Inventor： SCOTCH, Adam, M. ,  WEI, George, C.

IPC: H01L33/00

CPC classification number: H01L33/641 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.

Abstract translation: 可以从具有第一表面的大功率LED芯片和第二表面形成更有效或更高亮度的LED组件，第一表面安装到基板; 第二表面与导热率大于30瓦每米开尔文的透光散热器紧密地热接触。 LED芯片否则与至少第一电连接和用于为LED芯片供电的第二电连接电接触。 提供透光散热器可以使来自LED芯片的热传导加倍，从而增加寿命或效率或亮度或三者之间的平衡。