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公开(公告)号：ES2718462T3
公开(公告)日：2019-07-02
申请号：ES13159035
申请日：2013-03-13
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： ZENG XIANPING
IPC: C08L71/12 , B32B15/20 , C08J5/24 , C08K3/00 , C08K3/36 , C08K5/00 , C08K5/14 , C08K5/3417 , C08K5/5425 , C08K5/5435 , C08L9/06
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公开(公告)号：AU2014411037B2
公开(公告)日：2018-10-25
申请号：AU2014411037
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： LI HUI , FANG KEHONG
Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and the laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
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公开(公告)号：AU2014411039A1
公开(公告)日：2016-12-01
申请号：AU2014411039
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： LI HUI , FANG KEHONG
IPC: C08L63/00 , B32B15/092 , C08G59/40 , C08L71/12
Abstract: The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator; and 20-100 parts of a filler. The prepreg and the laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.
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公开(公告)号：AU2014411040B2
公开(公告)日：2018-10-25
申请号：AU2014411040
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： LI HUI , FANG KEHONG
Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.
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公开(公告)号：AU2014411039B2
公开(公告)日：2017-09-14
申请号：AU2014411039
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： LI HUI , FANG KEHONG
IPC: C08L63/00 , B32B15/092 , C08G59/40 , C08L71/12
Abstract: The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator; and 20-100 parts of a filler. The prepreg and the laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.
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Patent Agency Ranking
公开(公告)号：AU2014411038A1
公开(公告)日：2017-06-08
申请号：AU2014411038
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： FANG KEHONG , LI HUI
Abstract: The present invention relates to a thermoset resin composition and prepreg made of the same and laminated board. The thermoset resin composition comprises the following constituents in parts by weight: 50-150 parts of cyanate; 30-120 parts of epoxy resin; 20-70 parts of allyl benzene maleic anhydride; 20-100 parts of polyphenyl ether; 30-100 parts of halogen-free flame retardant; 0.05-5 parts of curing accelerant; 50-200 parts of filler. The prepreg and the laminated board made of the thermoset resin composition have comprehensive performance such as low dielectric constant, low dielectric loss, superior flame retardancy, thermal resistance and wet resistance etc., and is suitable for use in a halogen-free high-frequency multilayer circuit board.
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公开(公告)号：AU2014411037A1
公开(公告)日：2017-06-08
申请号：AU2014411037
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： LI HUI , FANG KEHONG
Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and the laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
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公开(公告)号：AU2013201482B2
公开(公告)日：2015-07-30
申请号：AU2013201482
申请日：2013-03-13
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： ZENG XIANPING , TANG JUNQI
Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of 5 which the melt viscosity is not more than 0.5 Pa.s under the temperature of 150 'C; (B) phenolic resin, of which the structure is as shown in the formula 1: formula 1 _ H I N. H I wherein, n represents an integer of 0-10. The epoxy resin composition of 10 the present invention can provide the prepreg and copper clad laminate made therefrom with high glass transition temperature, high heat resistance, low expansion coefficient and low moisture absorption, which can meet demands of high reliability of high density multi-layer PCBs.
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19.发明专利
公开(公告)号：AU2013202044B2
公开(公告)日：2015-03-12
申请号：AU2013202044
申请日：2013-03-27
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： ZENG XIANPING
Abstract: The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper clad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, 5 (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure 10 comprises 10-50wt%, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat 15 resistance.
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公开(公告)号：AU2013202046B2
公开(公告)日：2015-02-12
申请号：AU2013202046
申请日：2013-03-27
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： ZENG XIANPING , REN NANA , ZHOU BIAO
Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises: (A) epoxy resin containing two or over two epoxy groups, (B) active 5 ester curing agent, and (C) phosphate salt compound. The epoxy resin composition of the present invention adopts epoxy resin with specific molecular structure, which has comparatively high functionality, so the cured products have high glass transition temperature and low hydroscopic property; active ester is adopted as the curing agent to make full use of the advantages that 10 polar groups will not be produced when the active ester reacts with the epoxy resin; the prepreg and copper clad laminate made therefrom of the present invention can achieve halogen-free flame retardance, and meanwhile have excellent dielectric properties and good resistance to humidity and heat.
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