Device and method for forming conductive pattern on insulative planar substrate, insulative planar substrate and chipset therefor
    11.
    发明专利
    Device and method for forming conductive pattern on insulative planar substrate, insulative planar substrate and chipset therefor 审中-公开
    绝缘平板基板,绝缘平板基板及其基板上形成导电图案的装置及方法

    公开(公告)号:JP2014027323A

    公开(公告)日:2014-02-06

    申请号:JP2013232186

    申请日:2013-11-08

    Abstract: PROBLEM TO BE SOLVED: To provide a device comprising at least one module configured to form such a predetermined pattern on an insulative planar substrate as to collect conductive particles in accordance with that pattern, a method, the insulative planar substrate and a chipset.SOLUTION: At least different one module is configured to transfer conductive particles to the insulative planar substrate and disposed to collect the conductive particles in accordance with the predetermined pattern. A sinter module is configured to fuse the conductive particles on the insulative planar substrate and disposed to form a conductive plane on the insulative planar substrate by fusing the conductive particles in accordance with the predetermined pattern. The embodiment of the present invention relates to printable electronics or printing electronics on a fiber web.

    Abstract translation: 要解决的问题:提供一种包括至少一个模块的装置,其被配置为在绝缘平面基板上形成这样的预定图案,以根据该图案收集导电颗粒,方法,绝缘平面基板和芯片组。解决方案: 至少不同的一个模块被配置为将导电颗粒转移到绝缘平面基板并且被设置成根据预定图案收集导电颗粒。 烧结模块被构造成将绝缘平面基板上的导电颗粒熔合并且通过根据预定图案融合导电颗粒而设置在绝缘平面基板上形成导电平面。 本发明的实施例涉及光纤网上的可印刷电子器件或印刷电子器件。

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