Abstract:
PROBLEM TO BE SOLVED: To provide a device comprising at least one module configured to form such a predetermined pattern on an insulative planar substrate as to collect conductive particles in accordance with that pattern, a method, the insulative planar substrate and a chipset.SOLUTION: At least different one module is configured to transfer conductive particles to the insulative planar substrate and disposed to collect the conductive particles in accordance with the predetermined pattern. A sinter module is configured to fuse the conductive particles on the insulative planar substrate and disposed to form a conductive plane on the insulative planar substrate by fusing the conductive particles in accordance with the predetermined pattern. The embodiment of the present invention relates to printable electronics or printing electronics on a fiber web.
Abstract:
The present invention relates to a paper or paperboard product comprising a furnish wherein said furnish comprises a cationic polymer in an amount of above 1.5% by weight, an anionic polymer and microfibrillated cellulose. The invention further relates to a process for the production of said product.
Abstract:
The invention relates to a method and an apparatus for jointing members made of plastic-coated paper or board. In accordance with the invention, the sealable members are retained in position with clamps and sealing is performed with a laser sealing means moving along the sealing line, a means for opening the seal point pressing the members apart to continue keeping the seal point open, a laser beam being directed to the open seal point for melting the coating plastic and a means for closing the seal pressing finally the members against each other, the plastic jointing the members when solidified. The method is applicable to lateral sealing of bag or container packages formed of blanks, among other things.
Abstract:
The invention relates to a method for treating thermally modified wood, to thermally modified wood treated according to the method and the use of resins as the protective agent for thermally modified wood. According to the invention, on the wood there is applied a liquid resin-based protective agent, which is dried and/or hardened, so that there is obtained a transparent protective surface for protecting the wood against the effects of weather. The protective agent can be phenol formaldehyde resin, melamine formaldehyde resin or urea formaldehyde resin, which is applied on the wood as an aqueous solution and dried by means of heat. Resin decreases the absorption of water in the wood and reduces the cracking of wood. Particularly phenol formaldehyde resin also prevents the wood from turning gray in the open air.