公开(公告)号：US20120263257A1

公开(公告)日：2012-10-18

申请号：US13449231

申请日：2012-04-17

Applicant: Joon-Hyung KIM ,  Sung-Jun LEE ,  Jae-Ho JUNG

Inventor： Joon-Hyung KIM ,  Sung-Jun LEE ,  Jae-Ho JUNG

IPC: H04L25/49

CPC classification number: H04L27/2614 ,  H03F1/025

Abstract: A signal amplifying apparatus, a wireless transmitting apparatus, and a signal amplifying method are provided. The signal amplifying apparatus modulates an envelope signal using a multi-bit quantizer, thereby increasing coding efficiency and tracking optimal supply voltage with respect to envelope variation due to the use of the multi-bit quantizer.

Abstract translation: 提供信号放大装置，无线发送装置和信号放大方法。 信号放大装置使用多位量化器对包络信号进行调制，由于使用多位量化器，相对于包络变化，提高了编码效率并跟踪最佳供电电压。

公开(公告)号：US20120128536A1

公开(公告)日：2012-05-24

申请号：US13297556

申请日：2011-11-16

Applicant: Sang Won Jeong ,  Eun Joo Kim ,  Hyun-Chul Kim ,  Se Geun Lee ,  Sung Jun Lee

Inventor： Sang Won Jeong ,  Eun Joo Kim ,  Hyun-Chul Kim ,  Se Geun Lee ,  Sung Jun Lee

IPC: G01N33/53 ,  C08F12/08 ,  G01N1/28 ,  C07F9/09 ,  C08F2/46 ,  B82Y30/00

CPC classification number: G01N33/6872 ,  C07F9/117 ,  G01N33/531 ,  G01N33/6893 ,  G01N2333/4737 ,  G01N2600/00 ,  G01N2610/00 ,  Y10T436/11

Abstract: The present disclosure relates to a molecularly imprinted structure for detection of a pentraxin protein and a method for preparing the same by synthesizing a reactive group-pentraxin protein ligand complex specifically reacting with the pentraxin protein and being polymerizable with a crosslink agent to detect a pentraxin protein by using the complex. The present disclosure also provides a chip for detection of a C-reactive protein and a method for preparing the same, the chip including a molecularly imprinted layer having excellent sensitivity to a C-reactive protein and an improved binding force to a metal substrate by using click chemistry.

Abstract translation: 本公开内容涉及用于检测五倍体蛋白的分子印迹结构及其制备方法，其通过合成与五倍体蛋白特异性反应的反应性基 - 五聚蛋白配体复合物，并与交联剂聚合以检测五倍体蛋白 通过使用复合体。 本公开还提供了用于检测C反应蛋白的芯片及其制备方法，该芯片包括对C-反应蛋白具有优异敏感性的分子印迹层和通过使用对金属底物的改善的结合力 点击化学。

公开(公告)号：US20110250867A1

公开(公告)日：2011-10-13

申请号：US13081937

申请日：2011-04-07

Applicant: Sung-Jun LEE

Inventor： Sung-Jun LEE

IPC: H04W12/08

CPC classification number: H04M3/382 ,  H04W12/06 ,  H04W12/08 ,  H04W12/12

Abstract: A method and an apparatus for restricting network access in a mobile communication terminal are provided. The method for restricting the network access in the mobile communication terminal includes when network access is attempted, receiving a password for a Subscriber Identification Module (SIM) card inserted into the terminal, transmitting the password to a SIM management server, receiving a password authentication result from the SIM management server, and determining whether to allow the network access according to the password authentication result.

Abstract translation: 提供了一种用于限制移动通信终端中的网络接入的方法和装置。 用于限制移动通信终端中的网络接入的方法包括当尝试网络接入时，接收插入终端的用户识别模块（SIM）卡的密码，将密码发送到SIM管理服务器，接收密码认证结果 从SIM管理服务器，并根据密码认证结果确定是否允许网络访问。

公开(公告)号：USD638250S1

公开(公告)日：2011-05-24

申请号：US29357280

申请日：2010-03-10

Applicant: Sung Jun Lee ,  Ji Young Shin

Designer： Sung Jun Lee ,  Ji Young Shin

公开(公告)号：US20100093301A1

公开(公告)日：2010-04-15

申请号：US12492213

申请日：2009-06-26

Applicant: Sung-Jun LEE ,  Seong-Min KIM ,  Taek-Jin HWANG ,  Kwang-Chun LEE

Inventor： Sung-Jun LEE ,  Seong-Min KIM ,  Taek-Jin HWANG ,  Kwang-Chun LEE

IPC: H04B1/26

CPC classification number: H04B1/28

Abstract: A heterodyne receiver of a wireless communication system using an analog discrete-time signal processing is provided. The heterodyne receiver includes: a radio signal processing unit configured to extract a signal of a desired band from a received radio signal and convert the extracted signal into an intermediate frequency (IF) signal that is an integer multiple of a sample rate specified in a specification of the wireless communication system; a discrete-time signal processing unit configured to charge-sample the IF signal in unit of a predetermined time and perform an anti-aliasing filtering and a successive decimation on the charge-sampled signal, a final output rate according to the decimation being an integer multiple of the specified sample rate; and an analog-to-digital conversion unit configured to convert the successively-decimated analog signal into a digital signal.

Abstract translation: 提供了使用模拟离散时间信号处理的无线通信系统的外差接收机。 外差接收机包括：无线电信号处理单元，被配置为从接收到的无线电信号中提取期望频带的信号，并将提取的信号转换为中间频率（IF）信号，该中频（IF）信号是规范中规定的采样率的整数倍 的无线通信系统; 离散时间信号处理单元，被配置为以预定时间为单位对IF信号进行充电采样，并且对电荷采样信号执行抗混叠滤波和连续抽取，根据抽取的最终输出速率为整数 指定采样率的倍数; 以及模拟 - 数字转换单元，被配置为将连续抽取的模拟信号转换为数字信号。

公开(公告)号：US20090137073A1

公开(公告)日：2009-05-28

申请号：US12360444

申请日：2009-01-27

Applicant: Ho Joon PARK ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

Inventor： Ho Joon PARK ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC: H01L33/00

CPC classification number: H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

Abstract: The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract translation: 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片连接的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US07491978B2

公开(公告)日：2009-02-17

申请号：US11492754

申请日：2006-07-26

Applicant: Alexander L'Vovich Zakgeym ,  Seog Moon Choi ,  Sung Jun Lee

Inventor： Alexander L'Vovich Zakgeym ,  Seog Moon Choi ,  Sung Jun Lee

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L2224/16

Abstract: A light emitting diode package is provided. The light emitting diode package comprises a submount substrate which includes a mounting region having side walls inclined upwardly, first and second cavities formed around the mounting region, and first and second grooves extending between the mounting region and the first and second cavities on an upper surface of the submount. The package further comprises first and second bump pads formed on a bottom surface of the mounting surface, first and second bonding pads formed on a bottom surface of the first and second cavities, respectively, first and second conductive lines formed along a bottom surface of the first and second grooves for connecting the first and second bump pads to the first and second bonding pads, respectively, and a light emitting diode mounted on the mounting region so as to be connected to the first and second bump pads.

Abstract translation: 提供发光二极管封装。 发光二极管封装包括副安装座基板，其包括具有向上倾斜的侧壁的安装区域，围绕安装区域形成的第一和第二空腔，以及在安装区域与第一和第二空腔之间在上表面上延伸的第一和第二凹槽 的下层。 该封装还包括形成在安装表面的底表面上的第一和第二凸块焊盘，分别形成在第一和第二腔的底表面上的第一和第二焊盘，沿着第一和第二焊盘的底表面形成的第一和第二导电线 用于将第一和第二凸块焊盘分别连接到第一和第二接合焊盘的第一和第二凹槽以及安装在安装区域上以便连接到第一和第二凸块焊盘的发光二极管。

公开(公告)号：US07364287B2

公开(公告)日：2008-04-29

申请号：US11343474

申请日：2006-01-31

Applicant: Suk-Jae Lee ,  Ju-Jae Lee ,  Hyun-Jun Lee ,  Sung-Jun Lee

Inventor： Suk-Jae Lee ,  Ju-Jae Lee ,  Hyun-Jun Lee ,  Sung-Jun Lee

IPC: G02C9/00

CPC classification number: G02C9/00 ,  G02C9/02 ,  G02C2200/02

Abstract: Disclosed herein is a pivotally openable spectacles and sunshade-clip assembly in which a sunshade-clip is pivotally rotatable about a pair of hinge arm units thereof after being attached to spectacles by use of corresponding spectacles magnets and clip magnets. The spectacles include a pair of lens frames, a pair of temple arms, a pair of hinge units each used to hingedly connect one of the lens frames to one of the temple arms. The spectacles magnets are mounted in the hinge units. The sunshade-clip includes a pair of colored clip lenses, a pair of clip lens frames, a pair of hinge arm units, and the clip magnets mounted to the hinge arm units, respectively, to correspond to the spectacles magnets.

Abstract translation: 本文公开了一种可枢转地打开的眼镜和遮阳夹组合件，其中遮阳夹在通过使用相应的眼镜磁体和夹子磁体附接到眼镜之后可围绕其一对铰链臂单元枢转地旋转。 眼镜包括一对透镜框，一对镜腿臂，一对铰链单元，每个铰链单元用于将一个透镜框铰接地连接到其中一个镜腿臂。 眼镜磁体安装在铰链单元中。 遮阳夹包括一对彩色夹子透镜，一对夹子透镜框架，一对铰链臂单元和分别安装到铰链臂单元的夹子磁体，以对应于眼镜磁体。

公开(公告)号：US07326964B2

公开(公告)日：2008-02-05

申请号：US11312365

申请日：2005-12-21

Applicant: Chang Hyun Lim ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Sang Hyun Choi

Inventor： Chang Hyun Lim ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Sang Hyun Choi

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H02H3/20 ,  H02H9/04 ,  H02H3/00 ,  H02H7/00 ,  H02H9/02

CPC classification number: H01L33/62 ,  H01L24/17 ,  H01L25/167 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

Abstract translation: 一种具有由静电力操作的MEMS开关的LED封装，能够连续地保护LED免受由静电放电引起的过大电流的影响。 LED封装包括其上形成有第一和第二电极图案的基座; 安装在所述基座上的LED，具有电连接到所述第一电极图案的n电极和与所述第二电极图案电连接的p电极; 以及包括第一导电板和第二导电板的MEMS开关，所述第一导电板和第二导电板被弯曲成具有与所述第一导电板上方并垂直分开的面积，其中所述第一和第二导电板电连接到所述第一和第二电极图案， 导电板通过施加高于预定电压电压的静电力与第一导电板接触。

公开(公告)号：US07262440B2

公开(公告)日：2007-08-28

申请号：US11320968

申请日：2005-12-30

Applicant: Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

Inventor： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC: H01L29/22 ,  H01L23/498 ,  H01L21/00

CPC classification number: H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract translation: 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。