Abstract:
Methods of providing a delay for access to a memory device can include adjusting a delay for access to data during memory operations based on at least one parameter associated with a reduction in voltage levels provided to the memory. Related circuits are also disclosed.
Abstract:
A frequency measuring circuit may include an edge detector, a charge pump, and an analog-to-digital (A/D) converter. The edge detector may be configured to generate an output pulse responsive to an edge of an input clock signal. The charge pump may be configured to generate an output signal responsive to the output pulse from the edge detector. The analog-to-digital (A/D) converter may be configured to convert the output signal into a digital value representing a frequency of the input clock signal. Related methods and integrated circuit memory devices are also discussed.
Abstract:
The memory device includes a memory cell array, and an output buffer receiving data addressed from the memory cell array and outputting the data based on a latency signal. A latency circuit selectively associates at least one transfer signal with at least one sampling signal based on CAS latency information to create a desired timing relationship between the associated sampling and transfer signals. The latency circuit stores read information in accordance with at least one of the sampling signals, and generates a latency signal based on the transfer signal associated with the sampling signal used in storing the read information.
Abstract:
A current sense amplifier includes first and second P type MOS transistors having source nodes connected to first and second sensing inputs, respectively, and gate and drain nodes being cross-coupled to each other. First and second N type MOS transistors have drain nodes connected to first and second sensing outputs, respectively, the first and second sensing outputs corresponding to the drain nodes of the first and second P type MOS transistors, respectively, the first and second N type MOS transistors having respective gate nodes connected to a power supply voltage. Third and fourth N type MOS transistors have drain nodes connected to the first and second sensing outputs, respectively, and gate nodes connected to a bias voltage node so that respective current paths are established from the first and second sensing outputs to a common reference node.
Abstract:
A semiconductor memory device having an operation delay function of a CAS command, and a buffer and a signal transmission circuit which are applied to the semiconductor memory device, are provided. The signal transmission circuit includes a plurality of transmission units each for delaying an input signal by a different number of delay clock cycles. The transmission unit includes a transmission switch and a clock delay unit. The semiconductor memory device can delay a received signal for different numbers of delay clocks in response to first through third control signals. Therefore, a predetermined delay time between when a row-type command is received and when a column-type command is received can be shortened.
Abstract:
A semiconductor package substrate may include a first semiconductor chip, a second semiconductor chip, plugs and interconnection terminals. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The first and second semiconductor chips may have corresponding first regions and corresponding second regions. Conductive plugs may be built only in a first region of the first semiconductor chip. Circuitry of the second semiconductor chip may only be electrically connected to the first semiconductor chip through the conductive connectors corresponding to the first regions of the first and second semiconductor chips.
Abstract:
A semiconductor memory device that may correct error data using an error correction circuit is disclosed. The semiconductor memory device may include a DRAM cell array, a parity generator, a nonvolatile memory cell array and an error correction circuit. The parity generator is configured to generate a first set of parity bits having at least one bit based on input data. The nonvolatile memory cell array may store the input data and the first set of parity bits corresponding to the input data, and to output first data corresponding to the input data, and a second set of parity bits corresponding to the first set of parity bits. The error correction circuit is configured to generate second data as corrected data based on the first data.
Abstract:
A memory device includes a decoder that sets an operational control signal and a column select line signal at a first logical level simultaneously. In addition, a local sense amplifier has at least one switching device that is turned on by the operational control signal that is at the first logical level to couple at least one local I/O line to at least one global I/O line. Furthermore, signal lines, that are disposed to be parallel, transmit the operational control signal and the column select line signal from the decoder.
Abstract:
A signal amplification circuit for a semiconductor memory device includes a current sense amplifier configured to receive a first signal pair and generate a second signal pair on a first pair of lines, an equalizer configured to equalize the first pair of lines, and a latch amplifier configured to generate a latch data output on a second pair of lines in response to the second signal pair.
Abstract:
A current sense amplifier includes first and second P type MOS transistors having source nodes connected to first and second sensing inputs, respectively, and gate and drain nodes being cross-coupled to each other. First and second N type MOS transistors have drain nodes connected to first and second sensing outputs, respectively, the first and second sensing outputs corresponding to the drain nodes of the first and second P type MOS transistors, respectively, the first and second N type MOS transistors having respective gate nodes connected to a power supply voltage. Third and fourth N type MOS transistors have drain nodes connected to the first and second sensing outputs, respectively, and gate nodes connected to a bias voltage node so that respective current paths are established from the first and second sensing outputs to a common reference node.