公开(公告)号：WO2006091276A1

公开(公告)日：2006-08-31

申请号：PCT/US2006/000920

申请日：2006-01-10

Applicant: U.S. MONOLITHICS, L.L.C. ,  BUER, Kenneth, V. ,  COOK, Dean, L. ,  TORKINGTON, Richard ,  WACHTER, Friedhelm

Inventor： BUER, Kenneth, V. ,  COOK, Dean, L. ,  TORKINGTON, Richard ,  WACHTER, Friedhelm

IPC: H01Q5/00 ,  H01Q9/04 ,  H01Q13/02 ,  H01Q21/28 ,  H01Q19/17

CPC classification number: H01Q3/2658 ,  H01Q21/065 ,  H01Q21/28

Abstract: A Ka/Ku-band transmitter-receiver comprises a Ka-band transceiver, in conjunction with an array of phase combined patch receiving, antennas that operate at the Ku-band frequencies.

Abstract translation: Ka / Ku波段发射机 - 接收机包括Ka波段收发器，与相位组合补片接收阵列相结合，在Ku波段频率下工作。

公开(公告)号：WO2002099965A1

公开(公告)日：2002-12-12

申请号：PCT/US2002/013576

申请日：2002-05-01

Applicant: U.S. MONOLITHICS, L.L.C.

Inventor： BUER, Kenneth, V. ,  DENDY, Deborah, S.

IPC: H03F3/195

CPC classification number: H03F3/195 ,  H03F3/211

Abstract: A MMIC (microwave monolithic integrated circuit) driver amplifier having a zig-zag RF signal flow and method for the same is provided. A smaller die size and higher output gain are realized with the improved amplification stage geometry provided herein. In particular, the stages are configured in a "stacked" topology permitting a zig-zag RF signal flow through the stages. Additionally, the DC bias circuitry may be is centralized and adjacent stages may share vias. The die area for a typical K-band driver amplifier may be reduced by about 56 % over a conventional amplifier design.

Abstract translation: 提供具有Z字形RF信号流的MMIC（微波单片集成电路）驱动放大器及其方法。 通过本文提供的改进的放大级几何实现较小的管芯尺寸和较高的输出增益。 特别地，这些级被配置成允许Z字形RF信号流过级的“堆叠”拓扑。 另外，DC偏置电路可以是集中的，并且相邻的级可以共享通孔。 典型的K波段驱动放大器的管芯面积可以比传统的放大器设计减少约56％。

公开(公告)号：WO2002075959A1

公开(公告)日：2002-09-26

申请号：PCT/US2002/007389

申请日：2002-03-11

Applicant: U.S. MONOLITHICS, L.L.C.

Inventor： BUER, Kenneth, V.

IPC: H04B7/185

CPC classification number: H04B7/18513

Abstract: An uplink power control system (Fig. 4) and method of the present invention includes a current sensing technique for predicting the P1 db power compression point. A dc current sensor (332) detects the level of dc current transmitted from a control unit to an antenna unit (324) of the system. The current measurements are analyzed to generate a theoretical prediction of amplifier linearity as the power levels are increased. The change in dc current indicates an inflection point (404) where the amplifier no longer behaves linearly to an increase in RF power. Using this inflection point, an accurate assessment of the P1 db compression point of the system can be determined and the signal power levels adjusted accordingly.

Abstract translation: 本发明的上行链路功率控制系统（图4）和方法包括用于预测P1db功率压缩点的电流检测技术。 直流电流传感器（332）检测从系统的控制单元传输到天线单元（324）的直流电流的电平。 分析电流测量值以产生功率电平增加时放大器线性度的理论预测。 直流电流的变化指示拐点（404），其中放大器不再像RF功率的增加线性地表现。 使用该拐点，可以确定系统的P1 db压缩点的准确评估，并相应地调整信号功率电平。

公开(公告)号：WO2007008269A1

公开(公告)日：2007-01-18

申请号：PCT/US2006/014771

申请日：2006-04-17

Applicant: U.S. MONOLITHICS, L.L.C. ,  BUER, Kenneth, V. ,  GRONDAHL, Chris

Inventor： BUER, Kenneth, V. ,  GRONDAHL, Chris

IPC: H03H11/20 ,  H03H7/20 ,  H03K17/693

CPC classification number: H03H11/20 ,  H03H7/20

Abstract: The invention provides a phase shifter with flexible control voltage that is useful with all RF systems that phase shift a RF signal. The phase shifter according to the present invention may comprise transistors used as switching elements. In one aspect, the phase shifter provides the option of controlling a phase shifter with either a positive or a negative voltage control signal. For example, the dc ground of the transistors included in the phase shifter may be floated. The RF grounding of the transistors may be achieved by in-band resonant capacitors. Thus, the control voltage provided to the transistors is flexible in that it may be connected to a positive or negative control voltage, or it may be connected to ground, or it may swing from a positive control voltage to a negative control voltage or vice versa.

Abstract translation: 本发明提供了具有灵活控制电压的移相器，其对于相移RF信号的所有RF系统是有用的。 根据本发明的移相器可以包括用作开关元件的晶体管。 在一个方面，移相器提供了使用正或负电压控制信号来控制移相器的选项。 例如，包括在移相器中的晶体管的直流地可以浮置。 晶体管的RF接地可以通过带内谐振电容器实现。 因此，提供给晶体管的控制电压是灵活的，因为它可以连接到正或负的控制电压，或者它可以连接到地，或者它可以从正的控制电压摆动到负的控制电压，反之亦然 。

公开(公告)号：WO2004013929A1

公开(公告)日：2004-02-12

申请号：PCT/US2002/027835

申请日：2002-08-30

Applicant: U.S. MONOLITHICS, L.L.C.

Inventor： BUER, Kenneth ,  DARAPU, Ramana ,  DECAMP, John ,  DENDY, Deborah ,  DENISUK, Phillip ,  LOPEZ, Noel ,  STANFIELD, Edwin

IPC: H01P7/10

CPC classification number: H05K1/0243 ,  H01P1/20309 ,  H01P7/10 ,  H05K3/341 ,  H05K2201/10068 ,  H05K2201/2036

Abstract: A method for affixing a resonator to a printer circuit board is provided. The method uses a thin metal film which may be affixed to a surface of a stand off, or directly to a surface of a resonator. The metalized surface may be affixed to a printer circuit board using a molten agent with a surface tension which withstands the downward force exerted by the puck's weight. The metalized surface may be affixed to a printed circuit board using a solder paste and the solder is allowed to reflow. The surface tension of the molten solder causes the resonator (or resonator puck) to self-center, ensuring proper placement and eliminating the need for repositioning. Since the resonator is not positioned using traditional glues which are subject to shifting during transportation or curing, then the resonator is not subject to shifting, eliminating the need to reposition the resonator after the resonator become fixed.

Abstract translation: 提供了一种将谐振器固定到打印机电路板的方法。 该方法使用可以固定在支架表面上或直接连接到谐振器表面的薄金属膜。 金属化表面可以使用具有表面张力的熔化剂固定到打印机电路板，该表面张力可承受由游击盘重量施加的向下的力。 金属化表面可以使用焊膏固定到印刷电路板上，并允许焊料回流。 熔融焊料的表面张力导致谐振器（或谐振器圆盘）自我中心，确保正确放置，并消除对重新定位的需要。 由于谐振器不是使用在运输或固化期间经受移动的传统胶水定位，所以谐振器不会发生偏移，从而无需在谐振器固定之后重新定位谐振器。

公开(公告)号：EP1374447B1

公开(公告)日：2010-03-03

申请号：EP02753610.1

申请日：2002-03-11

Applicant: U.S. Monolithics, L.L.C.

Inventor： BUER, Kenneth, V.

IPC: H04B7/185 ,  H03G3/30 ,  H04W52/04

CPC classification number: H03G3/3042 ,  H04B7/18513

公开(公告)号：EP1396080B1

公开(公告)日：2005-11-09

申请号：EP02746323.1

申请日：2002-05-01

Applicant: U.S. Monolithics, L.L.C.

Inventor： BUER, Kenneth, V. ,  DENDY, Deborah, S.

IPC: H03F3/195 ,  H01L27/02 ,  H03F3/60

CPC classification number: H03F3/195 ,  H03F3/211

Abstract: A MMIC (microwave monolithic integrated circuit) driver amplifier having a zig-zag RF signal flow and method for the same is provided. A smaller die size and higher output gain are realized with the improved amplification stage geometry provided herein. In particular, the stages are configured in a "stacked" topology permitting a zig-zag RF signal flow through the stages. Additionally, the DC bias circuitry may be is centralized and adjacent stages may share vias. The die area for a typical K-band driver amplifier may be reduced by about 56 % over a conventional amplifier design.

公开(公告)号：EP1397836A2

公开(公告)日：2004-03-17

申请号：EP02737335.6

申请日：2002-05-30

Applicant: U.S. Monolithics, L.L.C.

Inventor： BUER, Kenneth, V.

IPC: H01L23/66

CPC classification number: H01L24/06 ,  H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/665 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/49 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03F3/195 ,  H03F2200/12 ,  H01L2924/00014 ,  H01L2924/20643 ,  H01L2924/20653 ,  H01L2924/20654 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2224/48744

Abstract: In general, the present invention provides an RF signal amplification system having an improved layout. The size of the MMIC can be reduced without loss of functionality and/or additional functionality can be added to the MMIC without increasing the size of the MMIC. The MMIC is configured with an off-chip bias feed system. The MMIC is configured with landing zones (560) for receiving a bond wire (502) such that on-chip bias circuitry can be reduced and/or eliminated.

Abstract translation: 通常，本发明提供具有改进布局的RF信号放大系统。 在不增加MMIC尺寸的情况下，可以减少MMIC的尺寸而不会损失功能和/或可以将额外功能添加到MMIC。 MMIC配置有片外偏置馈电系统。 MMIC配置有用于接收接合线（502）的着陆区（560），使得可以减少和/或消除片上偏置电路。

公开(公告)号：EP1929523A1

公开(公告)日：2008-06-11

申请号：EP06751843.1

申请日：2006-05-01

Applicant: U.S. Monolithics, L.L.C.

Inventor： TORKINGTON, Richard, S. ,  LYONS, Michael, R. ,  BUER, Kenneth, V.

IPC: H01L23/60 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An over-molded leadframe (e.g., a Quad Flat No-lead (QFN) ) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the QFN package are disclosed. The QFN package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip. The capacitance lead may form the first plate of a capacitor with the second lead provided on a printed circuit board (PCB) to which the package is mounted.

Abstract translation: 公开了能够在约5千兆赫（GHz）至约300GHz范围内的频率下操作的重叠模制引线框（例如四方扁平无引线（QFN））封装和制造QFN封装的方法。 QFN封装包括电容引线，该电容引线被配置为基本上减小和/或抵消由用于将封装上的集成电路（IC）芯片连接到输入/输出（I / O）引线的一个或多个引线键合所产生的电感。 IC芯片通过一个或多个引线连接到电容引线，然后通过至少第二引线将电容引线连接到I / O引线。 因此，在由封装输出信号和/或由IC芯片接收信号之前，由封装上的一个或多个引线键合产生的电感基本上被电容引线减小和/或抵消。 电容引线可以形成电容器的第一板，其中第二引线设置在封装安装到的印刷电路板（PCB）上。

公开(公告)号：EP1374447A1

公开(公告)日：2004-01-02

申请号：EP02753610.1

申请日：2002-03-11

Applicant: U.S. Monolithics, L.L.C.

Inventor： BUER, Kenneth, V.

IPC: H04B7/185

CPC classification number: H03G3/3042 ,  H04B7/18513

Abstract: An uplink power control system and method of the present invention includes a current sensing (332) technique for predicting the P1dB power compression point (Fig. 5). A DC current sensor (332) detets the level of DC current transmitted from a control unit to an antenna unit of the system. The current measurements are analyzed to generate a theoretical prediction of amplifier linearity as the power levels are increased. The change in DC current indicates an inflection point (404) where the amplifier no longer behaves linearly to an increase in RF power. The inflection point is found by determining the various derivatives of the DC current curve. Analyzing the derivatives not only provides an accurate and consistent assessment of the P1dB compression point, but also provides a prediction of the output power, and thus future performance of the system.

Abstract translation: 本发明的上行链路功率控制系统和方法包括用于预测P1dB功率压缩点（图5）的电流感测（332）技术。 DC电流传感器（332）检测从控制单元传输到系统的天线单元的DC电流的电平。 分析电流测量结果以随着功率电平的增加产生对放大器线性度的理论预测。 DC电流的变化指示一个拐点（404），其中放大器不再像RF功率的增加那样表现线性。 通过确定直流电流曲线的各种导数来找到拐点。 分析导数不仅可以提供对P1dB压缩点的准确和一致的评估，还可以预测输出功率，从而预测系统的未来性能。