公开(公告)号：EP1342121A2

公开(公告)日：2003-09-10

申请号：EP01934837.4

申请日：2001-02-16

Applicant: XROS, Inc., Nortel Networks

Inventor： SLATER, Timothy, G. ,  NEUKERMANS, Armand, P. ,  BAJIKAR, Sateesh, S. ,  DOWNING, James, P. ,  SCHUMAN, Marc, R. ,  CALMES, Sam ,  ROMANSOVSKY, Alexander, B. ,  GREEN, John

IPC: G02B26/00

CPC classification number: G02B26/085 ,  G02B26/0841

Abstract: A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. Torsion sensors (244) are provided along the axes of rotation to control deflection of the quadrant deflection electrodes. The shielded sensor structure (240) includes a silicon layer (241), an insulating layer (242) and a metal layer (243). The structure further includes a sensor implant resistor (244) in the silicon layer (241) and a shield (245) that is applied over the sensor implant resistor (244) to stabilise sensor output and eliminate light sensitivity.

公开(公告)号：EP1254479A1

公开(公告)日：2002-11-06

申请号：EP01903124.4

申请日：2001-01-18

Applicant: XROS, Inc., Nortel Networks

Inventor： SLATER, Timothy, G.

IPC: H01L21/20 ,  H01L21/762

CPC classification number: H01L21/2007 ,  H01L21/76251

Abstract: A bonded wafer fabrication mechanism for a micro-mirror structure provides for oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.

公开(公告)号：EP1151343A1

公开(公告)日：2001-11-07

申请号：EP00980917.9

申请日：2000-12-01

Applicant: XROS, Inc., Nortel Networks

Inventor： NEUKERMANS, Armand

IPC: G02B26/02

CPC classification number: G02B6/3582 ,  G02B6/3512 ,  G02B6/352 ,  G02B6/3548 ,  G02B6/3556 ,  G02B6/357 ,  G02B6/3572 ,  G02B6/358 ,  G02B6/3584 ,  G02B6/3588 ,  G02B6/359 ,  G02B26/0833 ,  G02B26/085

Abstract: A compact arrangement of multiple 1xN optical switches in a single optical switch package is described.