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公开(公告)号:KR1020120045833A
公开(公告)日:2012-05-09
申请号:KR1020100107657
申请日:2010-11-01
Applicant: 삼성전자주식회사
Inventor: 김나리
CPC classification number: H01L33/62
Abstract: PURPOSE: A light emitting device package is provided to increase combining force of solder paste coated on a printed circuit board and a light emitting device by forming a groove on a terminal part of a semiconductor light emitting device. CONSTITUTION: A case part(120) has an internal space for mounting a light emitting device. One or more terminal parts(130) formed on one side of a case electrically connect an external terminal and the light emitting device. A terminal contact part(140) includes a groove on a part in which the terminal part and the external terminal are connected to each other in order to increase surface area. A solder paste is arranged between the groove and the external terminal when the terminal contact part is connected to the external terminal.
Abstract translation: 目的:提供一种发光器件封装,以通过在半导体发光器件的端子部分上形成沟槽来增加涂覆在印刷电路板和发光器件上的焊膏的结合力。 构成:壳体部件(120)具有用于安装发光装置的内部空间。 形成在壳体的一侧上的一个或多个端子部件(130)将外部端子和发光器件电连接。 端子接触部分(140)包括在端子部分和外部端子彼此连接的部分上的凹槽,以增加表面积。 当端子接触部分连接到外部端子时,在凹槽和外部端子之间布置焊膏。
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