Abstract:
PURPOSE: An interpolator for predicting directivity, performing interpolation using a polynomial filter, and enhancing resolution, a scaling device having the same and a method therefor are provided to enhance resolution by calculating pixel data of points joined with horizontal or vertical lines in a predicted direction of an interpolation position by a Lagrange or polyphase polynomial filter, interpolating the calculated pixel data using the polynomial filter, and obtaining the last interpolation data of the interpolation position. CONSTITUTION: A directivity determining unit(121) receives pixel data of a plurality of lines around an interpolation position, performs the low pass filtering of the received pixel data, determines a directional value of the interpolation position from the filtered data, and outputs the determined directional value. An oriented interpolation unit(123) calculates pixel data of points in which an extension line of a direction corresponding to the directional value is joined with horizontal or vertical pixel lines by Lagrange or polyphase filtering, performs the Lagrange or polyphase filtering of the calculated pixel data, and obtains interpolation data of the interpolation position.
Abstract:
An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driven by the spindle. The clamp has an annular clamping frame sized to encircle the outer circumferential surfaces of the spindle and the head, a projection disposed on one end of the clamping frame, a lever pivotally connected to the other end of the clamping frame, and a fastener pivotally connected to the lever and configured to hook over the projection. Once the fastener is hooked over the projection, the lever is pivoted to force the ends of the annular clamping frame together and thereby produce a clamping force that secures the spindle and head to one another. The clamp can be manipulated easily and with a simple motion to clamp the head to the spindle. Also, the parts of the clamp generate little mechanical friction. Accordingly, the head can be quickly connected to and disconnected from the spindle, and such operations will not produce particles that could contaminate the semiconductor wafer.
Abstract:
PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to improve an efficiency and a defect due to particles by easily and quickly performing a connection or a separation between spins and a head using one touch method without tools. CONSTITUTION: A CMP apparatus partially comprises spins for circulating, a head for connecting and separating with the spins, a clamp part(130) connecting the spins with the head by simultaneously tightening the outer surfaces of the spins and the head. The clamp part(130) further includes a ring-type clamping frame(132) having edges separated each other for enclosing the outer surfaces of the spins and the head, a projection part(134) formed at one edge of the clamping frame(132), a lever(136) formed at the other edge of the clamping frame(132) for circulating with an alternating motion, and a fastener(138) connected with the lever(136) for locking the clamping frame(132) with the projection part(134). At this point, a connection or a separation are easily performed without tools.
Abstract:
PURPOSE: A clamp is provided to eliminate the necessity of using a tool when coupling the head to the spindle, while preventing generation of metallic powder by eliminating the necessity of using a bolt when the head is mounted to the spindle. CONSTITUTION: A clamp comprises a first band(40) and a second band(42) shaped as a hemispherical shape; a first hinge(44) for coupling the first band and the second band; a stopper protrusion(56) formed at an end of the first band; a horizontal surface(58) formed at an end of the second band; a plurality of protrusions formed at the horizontal surface; a tightening member(46) coupled to protrusions, and which tightens the first band and the second band by a tension force when pressed by the hand of the worker; a second hinge(48) for coupling the protrusions and the tightening member; a third hinge(54) for coupling the tightening member and a ring fixing member(50) at a position spaced apart from the second hinge; and a connection ring(52) attached to the tightening member, and which gets caught at the stopper protrusion.
Abstract:
본 발명은 영역 기반으로 영상 데이터를 보간하기 위한 디인터레이싱 장치 및 그 방법에 관한 것이다. 본 발명의 디인터레이싱 장치는 입력된 영상 데이터를 평활화, 경사도 추정 및 분수령 알고리즘을 이용하여 분할된 영상 데이터를 생성한다. 그리고 분할된 영역의 상관성을 이용하여 에지의 방향성을 검출하여 공간 및 시간적 보간을 처리한다. 그 결과, 기존의 화소간 차이값에 의한 에지의 방향성 검출을 이용하여 보간하는 방법보다 왜곡이 적고 특히, 굴곡이 심한 영상에서 보간 성능이 우수하다.
Abstract:
Interpolating pixel data in scaling pixel data for display can be provided by determining a pixel value at an interpolation location of a display based on filtering pixel data proximate to the interpolation location in a plurality of directions from the interpolation location. Related circuits and computer program products are also disclosed.
Abstract:
PURPOSE: A platen assembly of a polishing apparatus is provided to extend the lifetime of a bearing, by preventing deionized water from being induced to a gap between a bearing retainer and a platen in a polishing process. CONSTITUTION: A pad is placed on the upper surface of the platen(124), and a lower portion of the platen is mechanically connected to a rotating apparatus. The bearing(126) is installed in the lower portion of the platen. Flanges(130,132) for preventing deionized water/slurry from being induced to the gap between the bearing retainer(128) and the platen are formed in the upper and lower portions of the bearing retainer.