公开(公告)号：US20210032513A1

公开(公告)日：2021-02-04

申请号：US16969094

申请日：2019-03-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Richard Yufeng Liu ,  Yi Lin Sim ,  Chin Teong Ong ,  Roger A. Grisle ,  Michael C. Martin ,  Nathaniel I. Lehn

IPC: C09J153/02 ,  H05K3/30 ,  H05K3/34

Abstract: Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.