公开(公告)号：US20160372269A1

公开(公告)日：2016-12-22

申请号：US15251214

申请日：2016-08-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Tao Cheng ,  Qilin Chen ,  Zhou Jin

IPC: H01G9/07 ,  H01G9/055 ,  C08K7/08 ,  C08K3/24 ,  C08K7/14 ,  H01G9/15 ,  H01G9/042

CPC classification number: H01G9/07 ,  C08K3/24 ,  C08K7/08 ,  C08K7/14 ,  H01G4/203 ,  H01G9/042 ,  H01G9/055 ,  H01G9/15 ,  H05K1/0366 ,  H05K2201/0293

Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

Abstract translation: 本发明提供一种树脂组合物，其包含：1〜20重量份的增强纤维; 0.2〜5重量份的防沉降剂; 20〜40重量份的环氧树脂; 0.1〜3重量份的固化剂; 和50至75重量份的高介电常数填料。 本发明还提供由该树脂组合物制成的电介质层和包含电介质层的电容器。 在由本发明提供的树脂组合物制成的电介质层中，纤维可以均匀分散并且可以提高树脂组合物的机械强度，并与环氧树脂配合以提供优异的韧性。 因此，在PCB双面蚀刻工艺中使用电介质层时，可以显着提高所制造的电介质层的机械强度，并且可以有效克服其脆性。

公开(公告)号：US20160006151A1

公开(公告)日：2016-01-07

申请号：US14770108

申请日：2013-03-04

Applicant: Deng LIU ,  3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/72

CPC classification number: H01R12/722 ,  H01R12/585 ,  H01R12/724 ,  H01R12/732 ,  H01R12/79 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

Abstract translation: 本发明提供一种电互连系统，包括：一个桨卡，包括多个第一接触垫，其位于所述桨形卡的第一表面上;多个第二接触垫位于所述桨形卡的相对的第二表面上; 第一晶片，包括多个第一导体，每个第一导体均具有第一接触部分; 以及第二晶片，其包括多个第二导体，每个具有第二接触部分; 其中所述第一晶片和所述第二晶片组装在一起，以使所述第一接触部分和所述第二接触部分彼此面对，并且能够在其间形成间隙，以容纳所述桨片的至少一部分; 每个第一接触部分适于与对应的第一接触焊盘电接触，并且当所述桨卡至少部分地容纳在间隙中时，每个第二接触部分适于与相应的第二接触垫电接触。