MULTILAYER CIRCUIT BOARD
    12.
    发明申请

    公开(公告)号:US20220304149A1

    公开(公告)日:2022-09-22

    申请号:US17596053

    申请日:2020-06-03

    Abstract: A multilayer circuit board includes a plurality of electrically conductive rear pads for termination of a plurality of wires and a plurality of electrically conductive front pads for insertion into a connector. A plurality of pairs of substantially parallel traces extend between and connect the front pads to the rear pads. At least a first pair of traces and the front and rear pads connected thereto are disposed in a same layer of the multilayer circuit board. At least a second pair of traces is disposed in a same layer, and the rear and front pads connected thereto are disposed in a different layer of the multilayer circuit board. At least a third pair of traces are disposed in different layers of the multilayer circuit board. For each trace extending between and connecting the front and rear pads corresponding to the trace, the trace comprises no more than two vias.

    High density connector assembly
    13.
    发明授权

    公开(公告)号:US10957997B2

    公开(公告)日:2021-03-23

    申请号:US16666497

    申请日:2019-10-29

    Abstract: A connector assembly includes, a housing, a circuit board that includes a conductive front pad and a conductive rear pad electrically connected to the front pad, and a cable that includes an insulated conductor having a conductor surrounded by an insulating material. The conductor has a diameter not greater than 24 AWG. The uninsulated front end of the conductor is terminated at the rear pad and includes a preformed bend. The connector assembly also includes a recess formed in an external surface and on a lateral side of the housing. The recess is designed to receive and house a spring member of a pull tab that is assembled to the housing. The vertical separation between the recess and the circuit board is h, the average thickness of the cable is t, and h≥3t. The preformed bend may include first and second portions connected by a substantially flattened joint.

    HIGH DENSITY CONNECTOR ASSEMBLY
    19.
    发明申请

    公开(公告)号:US20200161781A1

    公开(公告)日:2020-05-21

    申请号:US16666497

    申请日:2019-10-29

    Abstract: A connector assembly includes, a housing, a circuit board that includes a conductive front pad and a conductive rear pad electrically connected to the front pad, and a cable that includes an insulated conductor having a conductor surrounded by an insulating material. The conductor has a diameter not greater than 24 AWG. The uninsulated front end of the conductor is terminated at the rear pad and includes a preformed bend. The connector assembly also includes a recess formed in an external surface and on a lateral side of the housing. The recess is designed to receive and house a spring member of a pull tab that is assembled to the housing. The vertical separation between the recess and the circuit board is h, the average thickness of the cable is t, and h≥3t.

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