Curable epoxy resin composition
    11.
    发明专利

    公开(公告)号:AU2008233984A1

    公开(公告)日:2008-10-09

    申请号:AU2008233984

    申请日:2008-03-12

    Abstract: Curable epoxy resin composition, which comprises: (i) at least one diglycidyl ether of bisphenol A (DGEBA) and at least one diglycidyl ethers of bisphenol F (DGEBF) as epoxy resins, wherein the weight ratio of DGEBA : DGEBF is within the range of about 15:85 to 45:55; (ii) an anhydride hardener; (iii) at least one plasticizer; (iv) optionally a catalyst, at least one filler material and/or further additives; and wherein Lhe dynamic complex viscosity value (· * ) of said composition is within the range of 0.1 to 20 Pa.s; a process for making said composition and electrical articles containing an electrical insulation system made from said composition.

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