ENCAPSULATED SWITCHGEAR
    12.
    发明专利

    公开(公告)号:SG176703A1

    公开(公告)日:2012-01-30

    申请号:SG2011090305

    申请日:2009-09-29

    Abstract: The present invention relates to an encapsulated switchgear comprising a housing (4) defining an insulating space (6) and an electrical active part (8; 9, 11a, 11b, 11c) arranged in the insulating space (6), said insulating space (6) comprising an insulation medium.. The switchgear is characterized in that the insulation medium comprises a dielectric compound having a boiling point of above -25°C.

    DIELECTRIC INSULATION MEDIUM
    13.
    发明专利

    公开(公告)号:SG176702A1

    公开(公告)日:2012-01-30

    申请号:SG2011090297

    申请日:2009-06-12

    Abstract: The presentinvention relates to a dielectric insulation medium. The insulation medium is characterized in that it comprises a fluoroketone having from 4 to 12 carbon atoms.

    Medio de aislamiento dieléctrico
    17.
    发明专利

    公开(公告)号:ES2525938T3

    公开(公告)日:2015-01-02

    申请号:ES09779737

    申请日:2009-06-12

    Abstract: Medio de aislamiento dieléctrico que comprende un gas de aislamiento, comprendiendo dicho gas de aislamiento en condiciones operativas una fluorocetona que tiene de 4 a 12 átomos de carbono, caracterizado por que la fluorocetona tiene un punto de ebullición de por lo menos -5 ºC a presión ambiente.

    ENCAPSULATED SWITCHGEAR
    20.
    发明专利

    公开(公告)号:CA2765270A1

    公开(公告)日:2010-12-16

    申请号:CA2765270

    申请日:2009-09-29

    Abstract: The present invention relates to an encapsulated switchgear comprising a housing (4) defining an insulating space (6) and an electrical active part (8; 9, 11a, 11b, 11c) arranged in the insulating space (6), said insulating space (6) comprising an insulation medium.. The switchgear is characterized in that the insulation medium comprises a dielectric compound having a boiling point of above -25°C.

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