公开(公告)号：JP2008169336A

公开(公告)日：2008-07-24

申请号：JP2007005223

申请日：2007-01-12

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SAITO MASAKO ,  OMI JINICHI ,  SAKAMAKI KOICHI ,  MORITA HIROSHI

IPC: C09D9/00

Abstract: PROBLEM TO BE SOLVED: To provide a resin removing agent which is capable of favorably removing a curable cyclic silicone compound not only before it is baked but also after it is baked.
SOLUTION: The resin removing agent is a solution which comprises a block polyether-modified silicone compound comprising a quaternary ammonium compound expressed by the general formula (R
1 )
3 -N
+ -R
2 -X
- , a quaternary ammonium compound expressed by the general formula (R
3 )
4 -N
+ -X
- , a silicone moiety and a polyether moiety, and a solvent.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种树脂去除剂，其能够不仅在其烘烤之前而且在烘烤之后能有利地除去可固化的环状硅氧烷化合物。 解决方案：树脂去除剂是包含嵌段聚醚改性的硅氧烷化合物的溶液，所述嵌段聚醚改性的硅氧烷化合物包含由通式（R 1 SP＆lt; SP＆gt;）＆lt; SB＆gt; 3＆lt; 由通式（R 3 SP 3）表示的季铵化合物，其中R 1，R 2，R 3，R 3， ），硅氧烷部分和聚醚部分以及溶剂。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006232970A

公开(公告)日：2006-09-07

申请号：JP2005048747

申请日：2005-02-24

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： OMI JINICHI ,  SAKAMAKI KOICHI ,  MORITA HIROSHI ,  SAITO MASAKO

IPC: C08L83/14 ,  C08G77/50 ,  C08K5/5425

CPC classification number: C08G77/52 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L83/14 ,  C08L83/00 ,  C08L2666/52

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which has little out-gas component and is excellent in transparency and whose cured product has high heat resistance, is excellent in base resistance and crack resistance and is useful for electric/electronic materials. SOLUTION: The silicon-containing curable composition comprises a prepolymer (A) having two or more Si-H groups in one molecule obtained by hydrosilylation between one or more selected from a component (α) and one or more selected from a component (β) as described below, as a component (A); a cyclic siloxane compound (B) having in one molecule two or more carbon-carbon double bonds having reactivity with an Si-H group, as a component (B); and a hydrosilylation catalyst (C), as a component (C). The component (α) is a cyclic siloxane compound having two or more Si-H groups in one molecule represent by formula (1). The component (β) is a compound having two or more carbon-carbon double bonds having reactivity with an Si-H group. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题为了提供一种具有极少的气体成分并且透明度优异且其固化产物具有高耐热性的含硅可固化组合物，具有优异的耐碱性和抗裂性，并且可用于电 /电子材料。 解决方案：含硅可固化组合物包含在一个分子中具有两个或更多个Si-H基团的预聚物（A），其通过在选自组分（α）和选自组分 （β）作为组分（A）; 作为（B）成分的具有1个分子的具有与Si-H基具有反应性的2个以上碳 - 碳双键的环状硅氧烷化合物（B）。 和作为（C）成分的氢化硅烷化催化剂（C）。 组分（α）是在一个分子中具有两个或更多个Si-H基团的环状硅氧烷化合物，由式（1）表示。 组分（β）是具有与Si-H基具有反应性的两个或多个碳 - 碳双键的化合物。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2013159776A

公开(公告)日：2013-08-19

申请号：JP2012025797

申请日：2012-02-09

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SAITO MASAKO ,  CHIBA RYOTA ,  KANBAYASHI TAKAAKI

IPC: C08L83/07 ,  C08K3/00 ,  C08K3/22 ,  C08K5/5425 ,  H01L33/60

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable white resin composition which is excellent in heat resistance, light resistance, cracking resistance and various mechanical and physical properties such as warpage and is useful as an optical semiconductor material or the like and to provide a cured product obtained by curing the silicon-containing curable white resin composition, and an optical semiconductor package and a reflecting material which are obtained by using the cured product.SOLUTION: A silicon-containing curable white resin composition contains: a polymer containing specific silicon; a prepolymer containing two or more Si-H groups in one molecule thereof; a linear siloxane compound containing two or more carbon-carbon double bonds, each of which has reactivity with the Si-H group or a Si-CH, in one molecule thereof; an organic peroxide; a metallic catalyst; and a filler or white pigment having specific particle size.

Abstract translation: 要解决的问题：提供耐热性，耐光性，耐龟裂性以及翘曲等各种机械物理性质优异的含硅可固化白色树脂组合物，可用作光学半导体材料等，并提供 通过固化含硅可固化白色树脂组合物获得的固化产物，以及通过使用固化产物获得的光学半导体封装和反射材料。溶液：含硅可固化白色树脂组合物包含：含有特定硅的聚合物 ; 在其一个分子中含有两个或更多个Si-H基团的预聚物; 在其一个分子中含有两个以上的碳 - 碳双键的线性硅氧烷化合物，其各自与Si-H基或Si-CH具有反应性; 有机过氧化物; 金属催化剂; 和具有特定粒度的填料或白色颜料。

公开(公告)号：JP2013221134A

公开(公告)日：2013-10-28

申请号：JP2012095150

申请日：2012-04-18

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SAITO MASAKO ,  HARA KENJI

IPC: C08L83/14 ,  C08G77/20 ,  C08G77/48 ,  C08L83/06 ,  C08L83/07

CPC classification number: C08L83/04 ,  C08F236/00 ,  C08G77/12 ,  C08G77/50 ,  C08K5/01 ,  C08L83/00

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which is excellent in crack resistance, hardness and outgassing property and useful for an electrical/electronic material and the like.SOLUTION: A silicon-containing curable composition contains a prepolymer (A) containing two or more Si-H groups in one molecule, obtained by bringing one or more cyclic siloxane compounds (α) represented by formula (1) and a specific divinyl compound or isocyanurate compound into a hydrosilylation reaction, and a specific vinyl group-terminated or epoxy group-terminated polysiloxane-containing polymer.

Abstract translation: 要解决的问题：提供耐裂纹性，硬度和脱气性优异并且可用于电气/电子材料等的含硅可固化组合物。溶液：含硅可固化组合物含有预聚物（A） 在一个分子中含有两个以上的Si-H基团，其通过将由式（1）表示的一种或多种环状硅氧烷化合物（α）和特定的二乙烯基化合物或异氰脲酸酯化合物引入氢化硅烷化反应而获得，并且特定的乙烯基终止 或环氧基封端的含聚硅氧烷的聚合物。