公开(公告)号：JP2010101957A

公开(公告)日：2010-05-06

申请号：JP2008270972

申请日：2008-10-21

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SAITO SEIICHI ,  MORITA HIROSHI ,  TAKENOUCHI HIROMI ,  KOBAYASHI JUN ,  OMI JINICHI

IPC: G03F7/075 ,  C08G77/16 ,  G02F1/1333 ,  G03F7/023 ,  G03F7/40 ,  H01L21/027 ,  H01L51/50 ,  H05B33/22

CPC classification number: G03F7/0757 ,  C08G77/16 ,  C08G77/18 ,  G03F7/0233 ,  G03F7/40 ,  H05B33/10 ,  H05B33/22

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which is excellent in transparency and provides a permanent resist having such high heat resistance and chemical resistance after high-heat history that it is also used as an insulating film above an active matrix substrate, a permanent resist using the positive photosensitive composition and a method for producing the same. SOLUTION: The positive photosensitive composition includes (A) a silicone resin having at least two groups per molecule represented by general formula (1) (wherein, R 1 denotes a 1-10C alkylene group which may have a substituted hydrocarbon group, R 2 denotes a 1-4C alkyl group, a denotes an integer of 0 or 1-4, b denotes an integer of 1-3, and a+b does not exceed 5), (B) a siloxane compound having a glycidyl group, (C) diazonaphthoquinones and (D) an organic solvent. The permanent resist is produced by applying the positive photosensitive composition on a substrate and subjecting the resulting coating to exposure, alkali development and post-bake at 120-350°C. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供透明性优异的正性感光性组合物，并且在高热历史之后提供具有如此高的耐热性和耐化学性的永久性抗蚀剂，它也用作有源矩阵上的绝缘膜 基板，使用正性感光性组合物的永久抗蚀剂及其制造方法。 正光敏组合物包括（A）每分子具有至少两个由通式（1）表示的基团的有机硅树脂（其中，R SP 1表示1-10C亚烷基，其中， 可以具有取代的烃基，R 2是表示1-4C的烷基，a表示0或1-4的整数，b表示1-3的整数，a + b不是 超过5），（B）具有缩水甘油基的硅氧烷化合物，（C）重氮萘醌和（D）有机溶剂。 永久抗蚀剂通过将正性感光性组合物涂布在基材上并使所得涂层在120-350℃下进行曝光，碱显影和后烘烤来制造。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009215343A

公开(公告)日：2009-09-24

申请号：JP2008057339

申请日：2008-03-07

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MORITA HIROSHI ,  SATO HIROMI ,  SAITO SEIICHI

IPC: C08G77/04 ,  C08G77/16 ,  H01J9/02 ,  H01J11/02 ,  H01J11/22 ,  H01J11/34 ,  H01J11/38

Abstract: PROBLEM TO BE SOLVED: To provide a low dielectric thermosetting resin which can be formed at a low temperature, is excellent in heat resistance, and can lighten plasma displays. SOLUTION: Provided is a thermosetting resin prepared by hydrolyzing a compound (1) (wherein, R 1 to R 3 are each identically or differently a straight chain or branched chain 1 to 4C alkyl group; R 4 is H or a straight chain or branched chain 1 to 4C alkyl group) and a compound (2) (wherein, R 5 to R 8 are each identically or differently a straight chain or branched chain 1 to 4C alkyl group) in a (1):(2) molar ratio of 70:30 to 90:10, and having a mol.wt. of ≥10,000. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供可以在低温下形成的低介电性热固性树脂，耐热性优异，并且可以减轻等离子体显示器。 解决方案：提供通过水解化合物（1）（其中R 1和R 3各自相同或不同的直链或支链的化合物（1） 1至4C链烷基; R 4是H或直链或支链1至4个碳原子的烷基）和化合物（2）（其中，R 1〜 （1）：（2）摩尔比为70:30至90:10的R“SP”8各自相同或不同的直链或支链1至4C烷基），并且具有摩尔 .wt。 ≥10,000。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2013113968A

公开(公告)日：2013-06-10

申请号：JP2011258776

申请日：2011-11-28

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： HARA KENJI ,  IWASHIMA TOMOYUKI ,  OMI JUNICHI ,  SAITO SEIICHI

IPC: G02B1/10 ,  G02B1/14 ,  G09F9/00

Abstract: PROBLEM TO BE SOLVED: To provide a curable resin composition which allows alkali development, yields a cured product excellent in adhesion and scratch resistance, and is useful as a hard coating material for an image display surface of an image display device.SOLUTION: Provided is a curable resin composition containing (A) a polyvalent alcohol acrylate compound, (B) a compound containing an acrylic group or methacrylic group and a carboxyl group in a molecule, (C) a siloxane compound containing a glycidyl group, and (D) a photo-radical generator. The (C) siloxane compound containing a glycidyl group is preferably a compound represented by the general formula (1) or (2), particularly a siloxane compound containing a 3-glycidoxypropyl group. The general formulas (1) and (2) are as described in the description of the claimed invention.

Abstract translation: 待解决的问题：为了提供一种能够进行碱显影的固化性树脂组合物，产生粘合性和耐划伤性优异的固化物，可用作图像显示装置的图像显示面用硬涂层材料。 解决方案：提供一种固化性树脂组合物，其含有（A）多元醇丙烯酸酯化合物，（B）分子中含有丙烯酸基或甲基丙烯酸基和羧基的化合物，（C）含有缩水甘油基 组，（D）光激发发生器。 含有缩水甘油基的（C）硅氧烷化合物优选为通式（1）或（2）表示的化合物，特别是含有3-缩水甘油氧基丙基的硅氧烷化合物。 通式（1）和（2）如所要求保护的发明的描述中所述。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011227291A

公开(公告)日：2011-11-10

申请号：JP2010096941

申请日：2010-04-20

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： TAKENOUCHI HIROMI ,  OMI JUNICHI ,  SAITO SEIICHI

IPC: G03F7/075 ,  C08G59/40 ,  C08G77/14 ,  C08G77/20 ,  G03F7/004 ,  G03F7/023

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which can provide a permanent resist which is excellent in terms of transparency, can also be used as an insulating film of an active matrix substrate and has high heat resistance and chemical resistance after high heat history and to provide a permanent resist using the positive photosensitive composition and a method for manufacturing the permanent resist.SOLUTION: A positive photosensitive composition includes as (A) component polysiloxane compound obtained by hydrolysis and condensation of a predetermined cyclic siloxane compound and a predetermined alkoxysilane compound such that silanol groups remain, as (B) component a compound with at least two epoxy groups, as (C) component diazonaphthoquinones and as (D) component an organic solvent.

Abstract translation: 要解决的问题：为了提供能够提供透明性优异的永久性抗蚀剂的正性感光性组合物，也可以用作有源矩阵基板的绝缘膜，并且具有高耐热性和耐化学性 高热历史，并提供使用正性感光性组合物的永久抗蚀剂和永久抗蚀剂的制造方法。 解决方案：正型感光性组合物包含作为（A）成分的聚硅氧烷化合物，其通过使预定的环状硅氧烷化合物和规定的烷氧基硅烷化合物水解缩合而使硅烷醇基保留，作为（B）成分，具有至少两个 环氧基，（C）组分重氮萘醌和（D）组分为有机溶剂。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2010139798A

公开(公告)日：2010-06-24

申请号：JP2008316483

申请日：2008-12-12

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： HARA KENJI ,  ISHIKAWA YOSHIHIRO ,  IWASHIMA TOMOYUKI ,  SAITO SEIICHI

IPC: G02B6/13 ,  G02B6/122

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical waveguide that allows fine processing, has high surface accuracy, is manufactured in a simple process, and has an optical path conversion function. SOLUTION: The method of manufacturing the optical waveguide has the optical path conversion function of forming a core part using photo-curable resin or positive type photosensitive resin. The method of manufacturing the optical waveguide has a process of forming an optical path conversion mirror surface by continuously varying the irradiation amount of irradiation light to the photo-curable resin or positive type photosensitive resin. The optical waveguide is manufactured by the manufacturing method. Preferably, the optical waveguide has a clad part and the core part on a substrate or a support film. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种制造允许精细加工，具有高表面精度的光波导的方法，以简单的工艺制造并具有光路转换功能。 解决方案：制造光波导的方法具有使用光固化树脂或正型感光树脂形成芯部的光路转换功能。 制造光波导的方法具有通过将照射光的照射量连续地变化到光固化树脂或正型感光性树脂来形成光路转换镜面的工序。 光波导通过制造方法制造。 优选地，光波导具有包层部分和在基底或支撑膜上的芯部分。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010100758A

公开(公告)日：2010-05-06

申请号：JP2008274294

申请日：2008-10-24

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which eliminates cissing to have sufficient adhesion even to a polyimide resins and is suitably used as an electric or electronic material, particularly as a sealing medium for luminous elements.
SOLUTION: The silicon-containing curable composition contains: a compound (H-2) having two or more Si-H groups in the molecule, obtained by the hydrosilylation of a compound (V-1) represented by formula (1) (wherein R
1 is a 2-10C organic group having a carbon-carbon double bond having reactivity with an Si-H group and R
2 is a 1-10C organic group) and a compound (H-1) having two or more Si-H groups in the molecule; a prepolymer (V-3) having two or more carbon-carbon double bonds having reactivity with an Si-H group in the molecule, obtained by the hydrosilylation of a cyclic siloxane compound (V-2) having two or more carbon-carbon double bonds reactive with an Si-H group in the molecule and/or the compound (V-2) and a compound (H-3) having two or more Si-H groups in the molecule; and a hydrosilylation catalyst.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种除了可以使聚酰亚胺树脂具有足够的粘附性而能够消除咀嚼的含硅可固化组合物，并且适合用作电气或电子材料，特别是用作发光元件的密封介质。 解决方案：含硅可固化组合物包含：通过由式（1）表示的化合物（V-1）的氢化硅烷化得到的分子中具有两个或更多个Si-H基团的化合物（H-2） （其中R 1 是具有与Si-H基具有反应性的碳 - 碳双键的2-10C有机基团，R 2 是1-10C有机基团 ）和在分子中具有两个或更多个Si-H基团的化合物（H-1）; 通过具有两个或多个碳 - 碳双键的环状硅氧烷化合物（V-2）的氢化硅烷化获得具有两个或多个与分子中的Si-H基具有反应性的碳 - 碳双键的预聚物（V-3） 与分子中的Si-H基团和/或化合物（V-2）和在分子中具有两个或更多个Si-H基团的化合物（H-3）反应的键; 和氢化硅烷化催化剂。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010018719A

公开(公告)日：2010-01-28

申请号：JP2008180913

申请日：2008-07-11

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08L83/07 ,  H01L23/29 ,  H01L23/31 ,  H01L33/48

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which is hardly discolored due to light deterioration or thermal deterioration and is made hard, to which dust is hardly stuck and which is useful as electric/electronic materials, particularly as a sealing agent for a light emitting element. SOLUTION: The silicon-containing curable composition contains: as a component (A), a prepolymer which is obtained by subjecting a cyclic siloxane compound having two or more Si-H groups in one molecule thereof and a trivinylcyclohexane compound to a hydrosilylation reaction by such a ratio that two or more Si-H groups remains in one molecule of the prepolymer and which has two or more Si-H groups in one molecule thereof; as a component (B), a cyclic siloxane compound having two or more carbon-carbon double bonds, each of which has reactivity with the Si-H group, in one molecule thereof; and as a component (C), a hydrosilylation catalyst. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种由于光劣化或热劣化而几乎不变色并且难以粘附的灰尘几乎不粘附并且可用作电/电子材料的含硅可固化组合物，特别是作为电 用于发光元件的密封剂。 解决方案：含硅可固化组合物含有：作为组分（A），通过在一分子中使具有两个或更多个Si-H基团的环状硅氧烷化合物和三乙烯基环己烷化合物进行氢化硅烷化得到的预聚物 通过使一个分子内存在2个以上的Si-H基团而在1分子中具有两个以上的Si-H基的比例进行反应; 作为组分（B），在其一个分子中具有两个或更多个碳 - 碳双键的环硅氧烷化合物各自与Si-H基团具有反应性; 和作为组分（C）的氢化硅烷化催化剂。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009212342A

公开(公告)日：2009-09-17

申请号：JP2008054630

申请日：2008-03-05

Applicant: Adeka Corp ,  Kansai Electric Power Co Inc:The ,  株式会社Adeka ,  関西電力株式会社

Inventor： OKADA SHINICHI ,  SUGAWARA YOSHITAKA ,  KIMURA RYOJI ,  SAITO SEIICHI ,  SUEYOSHI TAKASHI

IPC: H01L23/29 ,  H01L23/31

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device can attain high heat resistance and high voltage resistance and improve tight adhesiveness between a cover part for a semiconductor element and a support. SOLUTION: In a semiconductor device, a cover part 15 covering a GTO thyristor element 1 contains a silicon-containing polymer, including a bridged structure using siloxane (Si-O-Si binder) in one or more parts and is formed from a first silicon-containing curable composition containing a patina catalyst, that is a hardening reactive catalyst, and an iron group containing rust. Furthermore, the cover part 15 and a cover part 16, that covers an anode terminal 5 and a gate terminal 8 on a support 11, are formed from a second silicon-containing curable composition, in which alumina fine particles having a grain size of 20 μm are blended as insulated ceramics in the first silicon-containing curable composition at a volume filling factor of 50%. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供半导体器件可以获得高耐热性和高耐压性，并且改善用于半导体元件的盖部件和支撑件之间的紧密粘合性。 解决方案：在半导体器件中，覆盖GTO晶闸管元件1的覆盖部分15包含含硅聚合物，其包含使用硅氧烷（Si-O-Si粘合剂）的一个或多个部分的桥接结构，并由 含有铜绿色催化剂的第一种含硅固化性组合物，即硬化反应催化剂和含有铁锈的铁基团。 此外，覆盖部分15和覆盖阳极端子5和支撑体11上的栅极端子8的覆盖部分16由第二含硅可固化组合物形成，其中粒径为20微米的氧化铝细颗粒 以50％的体积填充系数将μm作为绝缘陶瓷混合在第一含硅可固化组合物中。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008266485A

公开(公告)日：2008-11-06

申请号：JP2007112742

申请日：2007-04-23

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  HARA KENJI ,  SAITO SEIICHI

IPC: C08G77/14 ,  C08G59/20

CPC classification number: C08G77/50 ,  C08G59/306 ,  C08G59/3254 ,  C08L63/00 ,  C08L83/14

Abstract: PROBLEM TO BE SOLVED: To provide a curable composition in which an obtained cured article is excellent in heat-resistance and flexibility. SOLUTION: The curable composition comprises a silicon-containing compound represented by general formula (0), and 0.01-20 pts.mass of an epoxy-curable compound based on 100 pts.mass of the compound. In general formula (0), Z is a group represented by any one of the formulae (2)-(6). COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 待解决的问题：提供一种固化性组合物，其中得到的固化物的耐热性和柔软性优异。 解决方案：可固化组合物包含由通式（0）表示的含硅化合物和基于100重量份化合物的0.01-20重量份的可环氧固化的化合物。 在通式（0）中，Z为由式（2） - （6）中的任一个表示的基团。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008231068A

公开(公告)日：2008-10-02

申请号：JP2007075991

申请日：2007-03-23

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MORITA HIROSHI ,  SATO HIROMI ,  OMI JINICHI ,  SAITO SEIICHI

IPC: C07F7/21 ,  G03F7/039 ,  G03F7/075

CPC classification number: C07F7/21 ,  G03F7/0045 ,  G03F7/0755 ,  G03F7/0757

Abstract: PROBLEM TO BE SOLVED: To provide a cyclosiloxane compound capable of giving a positive resist composition having excellent physical properties as a resist, and to provide a positive resist composition using the cyclosiloxane compound.
SOLUTION: The cyclosiloxane compound is produced by the hydrosilylation of a compound expressed by formula (1) and/or a compound prepared by the hydrosilylation of the compound expressed by formula (1) with a divinyl compound expressed by formula (2): CH
2 =CH-R
2 -CH=CH
2 , and a compound expressed by formula (3): CH
2 =CR
3 -(R
4 )
h -T.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供能够提供具有优异物理性能的正性抗蚀剂组合物作为抗蚀剂的环硅氧烷化合物，并提供使用该环硅氧烷化合物的正性抗蚀剂组合物。 解决方案：通过式（1）表示的化合物的氢化硅烷化和/或通过式（1）表示的化合物的氢化硅烷化由式（2）表示的二乙烯基化合物制备的化合物来制备环硅氧烷化合物， CH 3 = CH-R 2 SP-CH = CH 2 ，由式（3）表示的化合物：CH 2 = CR 3 - （R 4 ）ħ -T。 版权所有（C）2009，JPO＆INPIT